EPF10K50VRI240-3N

The EPF10K50VRI240-3N is an Intel FLEX‑10K family field‑programmable gate array (FPGA) provided in a 240‑pin BFQFP exposed‑pad package. It combines a logic array with embedded memory resources to implement specialized functions and system‑level integration for industrial applications.

With 2,880 logic elements, 360 LABs and 20,480 bits of embedded RAM, the device targets designs that need moderate logic capacity, on‑chip memory, and a high pin count (189 I/O) in a surface‑mount, industrial‑grade package.

Key Features

• Logic Capacity — 2,880 logic elements and 360 LABs supporting up to 116,000 system gates as reported for this device.
• Embedded Memory — 20,480 total RAM bits (approximately 0.0205 Mbits) for implementing FIFOs, small buffers and megafunctions on‑chip.
• I/O and Package — 189 user I/O pins in a 240‑BFQFP exposed‑pad (240‑RQFP 32×32) surface‑mount package, suitable for dense board layouts and thermal management via exposed pad.
• Power Supply — Operates from a 3 V to 3.6 V supply, matching 3.3 V system domains.
• Industrial Temperature Range — Rated for −40 °C to 85 °C operation for industrial classes of deployment.
• Family System Features — FLEX 10K family capabilities include embedded arrays for megafunctions and a logic array for general logic, in‑circuit reprogrammability, JTAG boundary‑scan (IEEE 1149.1) support, and features such as FastTrack interconnect, dedicated carry/cascade chains, and ClockLock/ClockBoost options.
• Manufacturing and Compliance — Surface‑mount package and RoHS compliance for modern PCB assembly and regulatory requirements.

Typical Applications

• System Integration and SOPC — Implements embedded megafunctions and custom logic to consolidate functions in system‑level programmable designs.
• Interface Bridging and I/O Expansion — High I/O count (189 pins) supports protocol bridging, parallel interfaces and dense I/O requirements.
• Industrial Control and Automation — Industrial temperature rating and exposed‑pad thermal package suit control, monitoring and automation modules.
• Prototyping and In‑Circuit Reconfiguration — In‑circuit reconfigurability and JTAG support enable iterative development and field updates.

Unique Advantages

• Balanced Logic and Memory: 2,880 logic elements coupled with 20,480 bits of embedded RAM let you implement both control logic and localized data storage on a single device, reducing external memory needs.
• High Pin Density in a Compact Package: 189 user I/Os in a 240‑pin BFQFP exposed‑pad package delivers board‑level connectivity without larger BGA footprints.
• Industrial Reliability: Specified operation from −40 °C to 85 °C and surface‑mount packaging with exposed pad for improved thermal dissipation support industrial deployments.
• Reconfigurable System Integration: Family features such as embedded arrays, in‑circuit configuration and JTAG boundary‑scan enable flexible system architectures and easier board bring‑up.
• Standards‑Oriented Design Tools: FLEX 10K family design support and megafunctions simplify implementation of common functions and arithmetic chains via dedicated carry and cascade resources.
• Regulatory and Assembly Friendly: RoHS compliance and standard surface‑mount package streamline manufacturing and regulatory acceptance.

Why Choose EPF10K50VRI240-3N?

The EPF10K50VRI240-3N positions itself as a versatile, industrial‑grade FLEX‑10K FPGA option where a balanced combination of logic, embedded RAM and high I/O count is required. Its 240‑pin exposed‑pad package and surface‑mount form factor make it practical for thermally demanding board designs while retaining significant on‑chip resources for megafunctions and custom logic.

This part is suited to engineers developing embedded systems, interface controllers and industrial equipment that benefit from in‑circuit reconfiguration, JTAG support and the FLEX 10K family architecture. Its specifications support scalable designs that require moderate logic density, integrated memory and robust temperature performance.

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