EPF10K50VRC240-3N

IC FPGA 189 I/O 240RQFP
Part Description

FLEX-10K® Field Programmable Gate Array (FPGA) IC 189 20480 2880 240-BFQFP Exposed Pad

Quantity 407 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-RQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFP Exposed PadNumber of I/O189Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates116000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits20480

Overview of EPF10K50VRC240-3N – FLEX-10K Field Programmable Gate Array (FPGA), 2,880 LEs, 20,480 RAM bits, 189 I/Os, 240-BFQFP

The EPF10K50VRC240-3N is an Intel FLEX 10K family FPGA delivering embedded programmable logic and on-chip memory for system-level integration. Built for reconfigurable designs, this device combines logic array blocks and embedded array blocks to implement custom logic, memory, and peripheral functions in a single IC.

Designed for commercial embedded and electronic applications, the device provides reconfigurability, a broad I/O count, and package options that suit board-level integration, while operating from a 3.0 V to 3.6 V supply and across a 0 °C to 70 °C commercial temperature range.

Key Features

  • Logic Capacity — 2,880 logic elements (LEs) and a maximum system gate count of 116,000 provide substantial combinatorial and sequential resources for custom logic implementation.
  • Logic Array Blocks (LABs) — 360 LABs (logic array blocks) support structured logic mapping and predictable routing for automated place-and-route flows.
  • Embedded Memory — 20,480 total RAM bits across embedded array blocks enable on-chip storage for FIFOs, buffers, and small tables without reducing core logic capacity.
  • I/O and Interfaces — 189 user I/O pins provide flexible external connectivity for sensors, peripherals, and high-pin-count interfaces; individual pin attributes are supported by the FLEX 10K architecture.
  • Package and Mounting — 240-BFQFP with exposed pad (supplier package: 240-RQFP 32×32) in a surface-mount format for board-level assembly.
  • Power and Temperature — Operates from 3.0 V to 3.6 V and rated for commercial grade operation from 0 °C to 70 °C.
  • Reconfigurability and Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE Std. 1149.1 JTAG boundary-scan facilitates board-level test without consuming device logic.
  • System-Level Features — FLEX 10K family capabilities such as FastTrack interconnect, dedicated carry and cascade chains, ClockLock and ClockBoost options, and multi-volt I/O support (as defined by the family) help implement arithmetic functions, low-skew clocking, and predictable routing.
  • Compliance — RoHS compliant, supporting environmental and regulatory requirements for lead-free assembly.

Typical Applications

  • Commercial Embedded Systems — Implement custom control, glue logic, and peripheral aggregation where on-chip memory and reconfigurable logic accelerate time-to-market.
  • Prototyping and Development — Use as a reprogrammable platform for hardware validation, algorithm testing, and iterative design refinement.
  • Peripheral and I/O Expansion — Aggregate, translate, or buffer multiple external interfaces using the device’s high I/O count and embedded memory blocks.
  • Custom Logic Acceleration — Offload application-specific functions such as arithmetic engines or state machines to dedicated logic and carry/cascade chains.

Unique Advantages

  • Reconfigurable System Integration: Embedded arrays and logic array blocks enable implementation of megafunctions and custom logic on a single device, reducing component count.
  • Predictable Routing and Performance: FastTrack interconnect and dedicated carry/cascade chains provide predictable routing and efficient implementation of arithmetic and high-fan-in functions.
  • High I/O Density in a Compact Package: 189 user I/Os in a 240-pin BFQFP package permit high connector or peripheral connectivity while maintaining a compact board footprint.
  • Design and Test Support: Built-in JTAG boundary-scan and documented software design support in the FLEX 10K family simplify board bring-up and manufacturing test.
  • Environmentally Compliant: RoHS compliance supports lead-free assembly requirements for modern electronics manufacturing.

Why Choose EPF10K50VRC240-3N?

The EPF10K50VRC240-3N positions itself as a flexible, reprogrammable solution for commercial embedded designs that require a balance of logic resources, embedded memory, and a high I/O count in a surface-mount 240-pin package. Its FLEX 10K family features—such as embedded array blocks, FastTrack interconnect, and dedicated arithmetic chains—help translate design intent into efficient hardware implementations.

This part is well suited to teams building prototypes, custom peripherals, or integrated logic subsystems that benefit from in-circuit reconfigurability, board-level testability via JTAG, and the software design support provided for the FLEX 10K family.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the EPF10K50VRC240-3N.

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