EPF10K50VRC240-4

The EPF10K50VRC240-4 is a FLEX-10K family FPGA offering a mid-range logic and embedded-memory solution for commercial applications. It combines a dedicated logic array and embedded array blocks for implementing general logic and megafunctions, enabling System-on-a-Programmable-Chip (SOPC) integration and efficient on-chip memory usage.

Designed for surface-mount applications, this device provides 2,880 logic elements (LEs), approximately 20,480 bits of embedded RAM, up to 189 user I/Os, and a 240-pin BFQFP exposed-pad package. The device operates from 3.0 V to 3.6 V with a commercial temperature range of 0 °C to 70 °C and is RoHS compliant.

Key Features

• Core Logic  2,880 logic elements and 360 LABs provide the programmable fabric for implementing combinational and sequential logic functions.
• Embedded Memory  Approximately 20,480 bits of embedded RAM distributed across embedded array blocks (EABs) to support megafunctions and on-chip data storage.
• Capacity (Gates)  Device-level capacity reported as 116,000 maximum system gates for integrating substantial logic and memory resources on a single IC.
• I/O and Interfaces  Up to 189 user I/O pins with per-pin control options for flexible interfacing in multi-voltage systems.
• Configuration & Test  In-circuit reconfigurability via external configuration device or JTAG; built-in JTAG boundary-scan circuitry for board-level testability.
• Clocking & Interconnect  Family features include low-skew clock distribution, dedicated carry and cascade chains, and a continuous routing structure to support predictable interconnect delays and arithmetic functions.
• Power & Supply  Voltage supply range of 3.0 V to 3.6 V supports 3.3 V system designs; surface-mount mounting type and exposed-pad BFQFP package aid thermal management and board assembly.
• Package & Mechanical  240-BFQFP exposed pad (supplier package: 240-RQFP, 32×32) for surface-mount placement and integration into space-constrained boards.
• Compliance & Grade  Commercial grade device (0 °C to 70 °C) and RoHS compliant.

Typical Applications

• System Integration / SOPC  Use the device's embedded arrays and logic fabric to consolidate memory and specialized logic into a System-on-a-Programmable-Chip architecture.
• Interface Bridging and I/O Expansion  Leverage up to 189 I/Os to implement protocol bridging, level translation, or custom peripheral interfaces on a single FPGA.
• Embedded Control and Glue Logic  Implement control state machines, peripheral controllers, and glue logic using the device's logic elements and embedded RAM.
• Megafunction Implementation  Deploy efficient memory-based megafunctions and specialized logic using the device's EABs and dedicated arithmetic/cascade chains.

Unique Advantages

• Integrated Memory and Logic:  Approximately 20,480 bits of embedded RAM combined with 2,880 logic elements reduces external memory needs and simplifies board design.
• Substantial I/O Count:  Up to 189 user I/Os enable dense peripheral connectivity and flexible interface options without additional I/O expanders.
• In-Circuit Reconfigurability:  Supports reconfiguration via external devices or JTAG, enabling field-updatable logic and late-stage design changes.
• Dedicated Arithmetic Resources:  Carry and cascade chains accelerate implementation of adders, counters, and high-fan-in logic, improving performance for arithmetic- and control-heavy designs.
• Package for Thermal Management:  240-BFQFP exposed-pad package supports heat dissipation and reliable surface-mount assembly in commercial electronics.
• Testability:  Built-in JTAG boundary-scan facilitates board-level test and debug without consuming device logic.

Why Choose EPF10K50VRC240-4?

The EPF10K50VRC240-4 positions itself as a versatile mid-range FPGA for designers who need a balanced combination of logic capacity, embedded memory, and I/O density in a commercial-grade device. Its flexible fabric and embedded array architecture support SOPC integration and efficient implementation of megafunctions while providing built-in test and reconfiguration capabilities.

This device is well suited for applications requiring significant on-chip RAM, multiple dedicated arithmetic resources, and a high number of I/Os within a 240-pin BFQFP exposed-pad surface-mount package. The combination of programmable resources and configuration options supports iterative development and long-term design scalability within the FLEX-10K family.

Request a quote or submit an RFQ to evaluate EPF10K50VRC240-4 for your next design project.