EPF6010ATC144-1

IC FPGA 102 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 102 880 144-LQFP

Quantity 1,656 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs88Number of Logic Elements/Cells880
Number of Gates10000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6010ATC144-1 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 102 I/O, 880 logic elements, 144-LQFP

The EPF6010ATC144-1 is a FLEX 6000 family programmable logic device from Intel, delivering a register-rich, look-up table (LUT) based architecture optimized for low-cost gate-array replacement and rapid prototyping. Based on the OptiFLEX architecture, the device provides efficient logic packing and predictable routing suited to design testing, in-circuit reconfiguration and medium-density programmable logic tasks.

Key practical attributes include 880 logic elements, up to 102 I/O pins in a 144-pin LQFP/TQFP footprint, operation from 3 V to 3.6 V, and commercial-grade temperature rating (0 °C to 85 °C), making it appropriate for a wide range of commercial embedded and system integration projects.

Key Features

  • Logic Capacity — 880 logic elements and a typical gate-equivalent figure of 10,000 gates provide mid-range programmable logic density for glue logic, control functions and moderate combinational/sequential designs.
  • Package & Mounting — Available in a 144-pin thin quad flat pack (144-LQFP / 144-TQFP 20×20) with surface-mount mounting for compact board layouts.
  • I/O and Interface Flexibility — Up to 102 I/O pins with individual tri-state output enable control and programmable output slew-rate control to manage signal integrity and interface timing.
  • OptiFLEX Architecture — LUT-based, register-rich architecture and OptiFLEX area-efficiency enhancements for better utilization of silicon area.
  • Fast, Predictable Interconnect — FastTrack continuous routing structure, dedicated carry chains for arithmetic functions, and dedicated cascade chains for high-fan-in logic.
  • Clock & Performance — Built-in low-skew clock distribution tree and four low-skew global paths for clock, clear, preset or logic signals to support synchronous designs.
  • System-Level Features — In-circuit reconfigurability via external configuration device or intelligent controller, and built-in IEEE 1149.1 JTAG boundary-scan test circuitry for board-level testability.
  • Power & Voltage — Device operation supported between 3 V and 3.6 V; family-level low-power behavior includes a typical standby specification under 0.5 mA.
  • Commercial Grade & Environmental — Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

  • Gate-array replacement and cost-sensitive logic — Replace or prototype medium-density gate-array functions where reprogrammability and design iteration are required.
  • Prototyping and design validation — Rapid iteration and in-circuit reconfiguration support functional testing and iterative development workflows.
  • Voltage-domain bridging and mixed-voltage I/O — MultiVolt I/O capability enables interfacing between systems operating at different I/O voltages.
  • Board-level glue logic and control — Compact 144-pin package and 102 I/O pins suit glue logic, peripheral control, and medium-complexity state machines.

Unique Advantages

  • Reconfigurability: In-circuit reconfiguration lets engineers update logic without board swaps, accelerating prototype cycles and post-deployment updates.
  • Efficient mid-range density: 880 logic elements and ~10,000 typical gates deliver a balance of capacity and cost for medium-complexity applications.
  • Rich I/O control: Individual tri-state enables and programmable slew-rate reduce external circuitry and simplify signal-integrity tuning.
  • Built-in testability: IEEE 1149.1 JTAG boundary-scan support improves board-level diagnostics without consuming device logic.
  • Predictable routing and arithmetic support: FastTrack interconnect plus dedicated carry and cascade chains streamline implementation of adders, counters and high-fan-in functions.
  • Compact surface-mount package: 144-pin TQFP/LQFP packaging enables dense PCB layouts while providing 102 accessible I/O pins.

Why Choose EPF6010ATC144-1?

The EPF6010ATC144-1 positions itself as a practical, reprogrammable alternative to mid-density gate arrays for commercial embedded designs and prototype development. With 880 logic elements, 102 I/O pins, OptiFLEX architecture and family-level features such as low-skew clocking, dedicated arithmetic chains and JTAG boundary-scan, it offers a balanced combination of integration, testability and interface flexibility.

Designed for engineers who need iterative design capability and reliable board-level diagnostics, the device is supported by the FLEX 6000 family tool ecosystem for synthesis, place-and-route and simulation, helping reduce development time and simplify deployment in commercial applications.

Request a quote or submit an inquiry for pricing and availability of the EPF6010ATC144-1 to discuss how it fits your next design or prototype project.

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