EPF6010ATI100-2

The EPF6010ATI100-2 is a FLEX 6000 family field-programmable gate array (FPGA) in a 100‑pin TQFP (14×14 mm) package. Based on the OptiFLEX register-rich, LUT‑based architecture, it provides a low-cost, reprogrammable alternative to fixed gate-array designs for prototyping, design validation, and low- to mid-volume deployments.

With 880 logic elements (LEs), approximately 10,000 typical gates, 71 I/O pins, a 3.0–3.6 V supply range, and industrial operating temperature rating, the device targets embedded control, interface bridging, and in-circuit reconfigurable applications that require robust packaging and wide temperature support.

Key Features

• Core Architecture OptiFLEX LUT-based, register-rich architecture that optimizes device-area efficiency and supports rapid design changes.
• Logic Capacity 880 logic elements and a typical gate-equivalent of 10,000 gates, enabling moderate-density logic integration on a single device.
• I/O and Interface Flexibility 71 I/O pins on the 100‑pin TQFP package with per-pin tri-state control and programmable output slew-rate for signal integrity management.
• Configuration and Test In-circuit reconfigurability (ICR) via external configuration device or intelligent controller, plus built-in IEEE 1149.1 JTAG boundary-scan test (BST) for board-level testability.
• Dedicated Arithmetic and Logic Chains Dedicated carry and cascade chains for high-speed adders, counters, comparators, and high‑fan‑in logic functions to simplify implementation of arithmetic and complex logic.
• Clocking and Routing Built-in low-skew clock distribution and FastTrack continuous routing structure for predictable interconnect delays and efficient timing.
• Power and Voltage Operates from 3.0 V to 3.6 V. Family data show low standby power (typical <0.5 mA in standby mode) and support for hot-socketing in 3.3‑V configurations.
• Package & Mounting 100‑pin TQFP (14×14 mm), surface-mount package suited for compact board layouts; RoHS compliant.
• Environmental and Reliability Industrial grade operation with an extended operating temperature range from −40 °C to 100 °C and 100% functional testing prior to shipment.

Typical Applications

• Prototyping & Design Validation Rapidly iterate logic and system-level designs with in-circuit reconfiguration and reprogrammable LUT-based logic to shorten development cycles.
• Gate Array Replacement Cost-effective alternative to low- and mid-volume gate-array implementations where design changes or updates are expected during production or field service.
• Mixed‑Voltage Interface Bridging Use the device’s flexible I/O features to bridge systems operating at different voltages and manage peripheral interfaces on a single FPGA.
• Embedded Control & Peripheral Management Implement control logic, interface handling, and timing-critical functions using dedicated carry/cascade chains and low-skew clock distribution.

Unique Advantages

• Reprogrammable Flexibility: In-circuit reconfigurability lets you update functionality without board-level replacements, reducing field service complexity.
• Testability Built In: IEEE 1149.1 JTAG boundary-scan support and 100% functional device testing simplify board bring-up and manufacturing diagnostics.
• Predictable Timing: Low-skew global clock paths and FastTrack interconnect improve timing predictability for synchronous designs.
• Arithmetic Acceleration: Dedicated carry and cascade chains streamline implementation of fast adders, counters, and high‑fan‑in logic without consuming extra routing resources.
• Industrial Temperature Range: Specified operation from −40 °C to 100 °C supports deployments in demanding thermal environments.
• Compact, Surface‑Mount Package: 100‑pin TQFP (14×14 mm) offers a compact footprint for space-constrained boards while providing 71 usable I/O pins.

Why Choose EPF6010ATI100-2?

The EPF6010ATI100-2 combines a proven OptiFLEX LUT-based architecture with practical logic density (880 logic elements) and 71 general-purpose I/O pins in a compact 100‑TQFP package. Its family-level features—dedicated arithmetic chains, robust clock distribution, in-circuit reconfigurability, and built-in JTAG—make it suited to teams that need flexible, testable hardware for prototyping, low-volume production, or embedded control tasks.

With a 3.0–3.6 V supply range, RoHS compliance, surface-mount packaging, and industrial temperature rating (−40 °C to 100 °C), the device offers a balance of integration, environmental tolerance, and board-level testability that supports long-term design stability and iterative development.

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