EPF6010ATI100-2N

The EPF6010ATI100-2N is a FLEX 6000 family FPGA from Intel, delivering 880 logic elements (approximately 10,000 typical gates) and up to 71 user I/O pins in a 100‑pin TQFP (14×14) surface-mount package. Its OptiFLEX register‑rich, LUT‑based architecture is designed for efficient area utilization and predictable routing.

Targeted at low-cost gate-array replacement, prototyping and design testing, this industrial‑grade device supports in‑circuit reconfiguration and system-level features useful for embedded control, I/O bridging, and production boundary-scan testing. It operates from 3 V to 3.6 V and across an operating temperature range of −40 °C to 100 °C.

Key Features

• Core & Architecture OptiFLEX, register‑rich, LUT‑based architecture that optimizes device area efficiency and supports fast, predictable routing.
• Logic Capacity 880 logic elements (typical ~10,000 gates) suitable for compact logic designs and mid‑density programmable implementations.
• I/O and Signal Control Up to 71 I/O pins on the 100‑TQFP package with individual tri‑state output enable and programmable output slew‑rate control to manage switching noise and interface timing.
• Configuration & Test In‑circuit reconfigurability (ICR) support via external configuration device or intelligent controller, plus IEEE‑1149.1 JTAG boundary‑scan test circuitry available without consuming device logic.
• Interconnect & Arithmetic Support Dedicated carry and cascade chains for efficient implementation of adders, counters and high‑fan‑in logic, and a FastTrack continuous routing structure for predictable interconnect delays.
• Power & Supply Designed for 3 V to 3.6 V operation; low standby power behavior is indicated in the FLEX 6000 family documentation.
• Package & Mounting Supplied in a 100‑pin TQFP (14×14) surface‑mount package, enabling compact PCB layouts and standard SMT assembly.
• Environmental & Quality Industrial grade operating range (−40 °C to 100 °C) and RoHS compliant; devices in the FLEX 6000 family are 100% functionally tested prior to shipment.

Typical Applications

• Prototyping & Design Validation Rapidly iterate hardware designs and verify logic before committing to ASIC or gate‑array production using reprogrammable logic and in‑circuit reconfiguration.
• Low‑Cost Gate‑Array Replacement Implement mid‑density gate‑array functions with reduced non‑recurring engineering risk and faster design changes during development.
• Embedded Control & I/O Bridging Control functions, peripheral interfacing and voltage‑bridging applications benefit from the device’s I/O flexibility and programmable signal control.
• Production Test & Boundary‑Scan Leverage the built‑in IEEE‑1149.1 JTAG boundary‑scan for board‑level testing and diagnostics without consuming user logic resources.

Unique Advantages

• Compact, programmable logic density: 880 logic elements and ~10,000 typical gates provide a mid‑density FPGA option that reduces board count and simplifies design partitioning.
• In‑circuit reconfigurability: Update functionality in‑system via external configuration devices or intelligent controllers for field upgrades and flexible prototypes.
• Deterministic interconnect: FastTrack continuous routing and dedicated carry/cascade chains enable predictable timing for arithmetic and high‑fan‑in logic.
• Manufacturing friendliness: Built‑in JTAG boundary‑scan and 100% functional testing streamline board bring‑up and production verification.
• Industrial operating range and compliance: −40 °C to 100 °C operation and RoHS compliance support deployment in industrial environments.
• Pin‑ and footprint‑compatible family options: FLEX 6000 family SameFrame compatibility enables scalable migration across device densities and pin counts.

Why Choose EPF6010ATI100-2N?

The EPF6010ATI100-2N combines a space‑efficient OptiFLEX architecture with a practical mid‑range logic capacity and flexible I/O in a compact 100‑TQFP package, making it well suited for designers needing reprogrammable logic for prototyping, gate‑array replacement or embedded control tasks. Its industrial temperature rating, surface‑mount packaging and RoHS compliance make it a pragmatic choice for production systems that require defined environmental robustness.

Engineers benefit from series features such as in‑circuit reconfiguration, JTAG boundary‑scan, and dedicated arithmetic resources, simplifying implementation of control, interface and test functions while preserving PCB area and BOM simplicity.

Request a quote or submit an inquiry for EPF6010ATI100-2N to check availability and pricing for your next design.