EPF6016AFC100-3

The EPF6016AFC100-3 is a FLEX 6000 series Field Programmable Gate Array (FPGA) from Altera designed for commercial embedded logic applications. It provides programmable logic capacity and flexible I/O in a compact 100-ball BGA package, making it suited for space-constrained, surface-mount designs.

Key attributes include 1,320 logic elements, 81 user I/O pins, a supply operating range of 3.0–3.6 V, and a commercial temperature rating of 0–85 °C, delivering a predictable platform for mid-range control, interface and glue-logic tasks.

Key Features

• Logic Capacity — 1,320 logic elements providing programmable resources for implementing custom combinational and sequential logic functions.
• Configurable Logic Blocks (CLBs) — 132 CLBs to structure and organize logic for efficient mapping of designs.
• I/O Count — 81 general-purpose I/O pins suitable for interfacing with sensors, peripherals, and buses in commercial systems.
• Gate Equivalent — Approximately 16,000 gates to convey relative device scale for integration planning.
• Package and Mounting — 100-ball BGA in a compact 11 × 11 mm supplier package (100-FBGA) optimized for surface-mount assembly.
• Power — Operates from a 3.0 V to 3.6 V supply range, aligning with common digital power rails.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for typical consumer and commercial environments.
• Compliance — RoHS compliant for environmental and regulatory alignment in product designs.

Typical Applications

• Consumer Electronics — Implement user-interface logic, peripheral controllers, and protocol bridging in commercial devices operating within 0–85 °C.
• Industrial Control (Commercial Grade) — Perform mid-range control and sequencing tasks where commercial temperature and supply ranges are appropriate.
• Embedded System Glue Logic — Replace discrete glue components with programmable logic using 1,320 logic elements and 81 I/Os to simplify board-level integration.
• Prototyping and Development — Rapidly iterate custom logic functions in compact assemblies requiring surface-mount, BGA packaging.

Unique Advantages

• Balanced Logic Density: 1,320 logic elements and roughly 16,000 gate equivalents provide a practical balance between capacity and cost for mid-range designs.
• Ample I/O for Interfaces: 81 I/O pins let you connect multiple peripherals, sensors, and buses without large external glue logic.
• Compact BGA Footprint: 100-ball BGA (11 × 11 mm supplier package) helps minimize PCB area while supporting surface-mount assembly processes.
• Straightforward Power Requirements: 3.0–3.6 V supply range aligns with common digital power rails for easier system integration.
• Commercial Temperature Qualification: Rated 0–85 °C to match typical consumer and commercial product environments.
• RoHS Compliant: Meets lead-free and hazardous substance restrictions to support regulatory targets.

Why Choose EPF6016AFC100-3?

The EPF6016AFC100-3 delivers a compact, programmable logic solution that fits commercial embedded designs requiring moderate logic capacity and flexible I/O. Its combination of 1,320 logic elements, 81 I/Os, and a compact 100-ball BGA package make it suitable for space-constrained applications where surface-mount assembly and standard 3.0–3.6 V power rails are used.

Manufactured by Altera and offered as a RoHS-compliant, commercial-grade device, this FPGA is aimed at designers seeking a reliable, predictable building block for control, interface, and glue-logic functions in consumer and commercial products.

Request a quote or submit an inquiry to receive pricing and availability for the EPF6016AFC100-3.