EPF6016AFC100-2

The EPF6016AFC100-2 is a FLEX 6000 series Field Programmable Gate Array (FPGA) in a 100-ball LBGA package, manufactured by Intel. It provides a commercial-grade programmable logic solution with 1,320 logic elements and approximately 16,000 gates, suitable for a range of moderate-density digital designs.

With 81 I/O pins, a 3.0–3.6 V supply range, surface-mount 100-LBGA packaging, and RoHS compliance, the EPF6016AFC100-2 targets commercial embedded applications and development workflows that require compact, programmable logic in a standardized BGA form factor.

Key Features

• Core Logic 1,320 logic elements and approximately 16,000 gates provide moderate-density programmable logic for custom digital functions and control logic.
• I/O Count 81 I/O pins for interfacing to external devices, sensors, and peripherals in embedded designs.
• Power Designed for a 3.0 V to 3.6 V supply range to match typical commercial-system power rails.
• Package & Mounting 100-LBGA (supplier package noted as 100-FBGA, 11×11) in a surface-mount form factor for compact board-level integration.
• Operating Range Commercial operating temperature from 0 °C to 85 °C, suitable for standard commercial-environment applications.
• Compliance RoHS-compliant for regulatory and manufacturing alignment with lead-free processes.
• Manufacturer Documentation Package and thermal resistance information is provided in the Altera/Intel package information datasheet for mature devices, supporting thermal and assembly planning.

Typical Applications

• Custom digital logic and prototyping Implement glue logic, state machines, and custom accelerators using 1,320 logic elements and ~16,000 gates for moderate-complexity designs.
• Embedded system control Use in commercial embedded devices where a compact, surface-mount FPGA with 81 I/O and commercial temperature range is required.
• Interface bridging and I/O expansion Leverage the 81 I/O pins to implement protocol translation, bus interfacing, and signal aggregation in compact designs.

Unique Advantages

• Right-sized logic density: 1,320 logic elements and approximately 16,000 gates provide a balance between capability and cost for moderate-complexity designs.
• Compact, manufacturable package: 100-LBGA (100-FBGA, 11×11) surface-mount package simplifies PCB layout and supports automated assembly.
• Commercial-ready thermal and package data: Supported by Altera/Intel package documentation covering package outlines and thermal resistance to aid integration and reliability planning.
• Flexible power compatibility: 3.0–3.6 V supply range aligns with common commercial power rails.
• Regulatory alignment: RoHS compliance helps meet lead-free manufacturing requirements.

Why Choose EPF6016AFC100-2?

The EPF6016AFC100-2 positions itself as a compact, commercial-grade FPGA option for designers needing moderate logic density with a standardized 100-LBGA surface-mount package. Its combination of 1,320 logic elements, ~16,000 gates, 81 I/O pins, and a common 3.0–3.6 V supply makes it well suited for embedded control, interface, and prototyping tasks where board space and manufacturability matter.

Backed by Altera/Intel package and thermal documentation for mature devices, the EPF6016AFC100-2 offers practical integration details to support thermal planning and assembly, providing predictable behavior for commercial production and development environments.

Request a quote or submit an inquiry to obtain pricing and availability for the EPF6016AFC100-2 and to discuss how this FLEX 6000 FPGA can fit into your next commercial design.