EPF6016AFC256-1

The EPF6016AFC256-1 is a FLEX 6000 family field programmable gate array (FPGA) offered in a 256-ball fine-pitch BGA package. Based on the OptiFLEX architecture and a register‑rich LUT‑based design, this device targets logic- and I/O‑centric applications where in-circuit reconfigurability and mid-density programmable logic are required.

Typical use cases include prototyping and design testing, bridging systems with differing I/O voltages, and replacing fixed gate-array designs with a reprogrammable, RoHS‑compliant commercial‑grade FPGA solution.

Key Features

• OptiFLEX architecture OptiFLEX architecture increases device area efficiency and supports a register-rich, LUT‑based logic fabric for flexible logic implementation.
• Logic density Approximately 1,320 logic elements and a typical gate-equivalent count of 16,000 provide mid-range programmable logic capacity for control, glue‑logic, and interface functions.
• I/O capability 171 user I/O pins exposed in a 256-FBGA (17×17) package enable high‑pin-count interfacing for peripherals and board-level integration.
• In‑circuit reconfigurability (ICR) Supports reconfiguration via an external configuration device or intelligent controller for field updates and design iteration.
• Built‑in JTAG boundary‑scan IEEE 1149.1‑compliant boundary‑scan circuitry is provided without consuming user logic, enabling board test and debug.
• Power and I/O flexibility Device supply range of 3.0 V to 3.6 V and MultiVolt™ I/O interface features described for the family support bridging between systems operating at different voltages.
• Low power standby Family documentation cites low standby current (typical specification less than 0.5 mA), supporting designs that require low-power idle modes.
• Commercial temperature and mounting Commercial grade operation from 0 °C to 85 °C and surface‑mount packaging suit standard commercial embedded and prototyping environments.
• RoHS compliant Device is RoHS compliant for environmentally conscious designs.

Typical Applications

• Prototyping and design validation Reprogrammable logic and in‑circuit reconfigurability make the EPF6016AFC256-1 well suited for rapid prototyping and iterative development cycles.
• Gate‑array replacement A low‑cost programmable alternative to high‑volume gate array designs, enabling design changes without new masks.
• System interfacing and glue logic The 171 I/Os and MultiVolt™ I/O capability allow the device to bridge between peripherals or subsystems operating at different voltage domains.
• Board‑level test and debug Built‑in JTAG boundary‑scan supports manufacturing test and in‑system diagnostics.

Unique Advantages

• Mid‑density logic in a compact package: 1,320 logic elements and a 256‑FBGA footprint provide a balance of capacity and board‑space efficiency for many embedded designs.
• High I/O count for flexible interfacing: 171 I/O pins support diverse peripheral connections and complex board routing scenarios.
• Field reprogrammability: In‑circuit reconfigurability via external configuration devices enables updates and functional changes after deployment.
• Testability and debug: Integrated IEEE 1149.1 JTAG boundary‑scan reduces the need for extra test logic and aids manufacturing test and system bring‑up.
• Commercial operating range: Specified 0 °C to 85 °C and RoHS compliance make the device suitable for mainstream commercial electronics and prototyping applications.
• Low standby power: Family documentation indicates standby current typically below 0.5 mA, helping reduce idle‑state power consumption.

Why Choose EPF6016AFC256-1?

The EPF6016AFC256-1 positions itself as a versatile, mid‑density FPGA option within the FLEX 6000 family, combining 1,320 logic elements, approximately 16,000 typical gates, and a 171‑pin I/O resource set in a 256‑FBGA package. Its OptiFLEX architecture and LUT‑based fabric provide a practical balance of area efficiency and routability for logic- and I/O‑intensive designs.

This device is appropriate for engineering teams needing a reprogrammable alternative to fixed gate arrays, designers implementing complex interfacing or glue logic, and projects that benefit from boundary‑scan testability and in‑circuit reconfiguration. With commercial temperature operation and RoHS compliance, it supports a wide range of standard embedded applications and iterative development workflows.

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