EPF6016AQC208-1N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

Quantity 1,293 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016AQC208-1N – FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

The EPF6016AQC208-1N is a FLEX 6000 series programmable logic device from Intel, providing reconfigurable logic in a 208-pin BFQFP (28 × 28) package. Based on the OptiFLEX architecture and a register-rich, look-up table (LUT) design, this device targets low-cost alternatives to high-volume gate-array designs and rapid prototyping or design testing.

Key device attributes include 1,320 logic elements (approximately 16,000 typical gates), 171 user I/O pins, support for in-circuit reconfigurability, RoHS compliance, a 3.0–3.6 V supply range, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Architecture OptiFLEX architecture with a register-rich, LUT-based core delivering 1,320 logic elements and a typical gate-equivalent of 16,000 for medium-density logic integration.
  • I/O and Interfaces 171 programmable I/O pins with individual tri-state output enable control and programmable output slew-rate control to manage switching noise and interface timing.
  • Clocking and Timing Built-in low-skew clock distribution tree and four low-skew global paths suitable for clock, clear, preset, or critical logic signals.
  • Interconnect and Arithmetic Support FastTrack interconnect continuous routing structure plus dedicated carry and cascade chains to implement fast adders, counters, and high-fan-in logic functions.
  • Reconfigurability and Testability In-circuit reconfigurability (ICR) via external configuration device or intelligent controller and built-in JTAG boundary-scan test circuitry compliant with IEEE Std. 1149.1.
  • Packaging and Supply 208-pin BFQFP (supplier package: 208-PQFP 28×28) surface-mount package; supply voltage range 3.0 V to 3.6 V; commercial grade operation from 0 °C to 85 °C.
  • Quality and Compliance Devices are 100% functionally tested prior to shipment and listed as RoHS compliant.
  • Memory Total on-chip RAM: 0 bits (no embedded RAM reported for this device).

Typical Applications

  • Prototyping & Design Verification Rapid iteration of hardware logic and functional testing during development, leveraging in-circuit reconfigurability to update designs without board changes.
  • Low- to Mid-Volume Gate-Array Replacement Cost-effective alternative for replacing high-volume gate-array designs where reprogrammability and faster time-to-market are required.
  • Multi-Voltage System Bridging I/O capabilities allow interfacing between subsystems operating at different voltages, supporting mixed-voltage board designs.
  • Systems Requiring Boundary-Scan Test Built-in IEEE 1149.1 JTAG boundary-scan facilitates board-level testing and diagnostics without consuming additional device logic.

Unique Advantages

  • Area-efficient OptiFLEX Architecture: Optimized die utilization balances performance and density for medium-complexity logic implementations.
  • Flexible I/O Control: Per-pin tri-state enable and programmable slew-rate reduce the need for external buffering and simplify signal integrity management.
  • Dedicated Arithmetic Paths: Built-in carry and cascade chains accelerate implementation of adders, counters, and other arithmetic functions through automatic tool support.
  • In-circuit Reconfiguration: Update or modify designs in the field via external configuration devices or controllers, shortening development cycles and enabling post-deployment changes.
  • Proven Testability: 100% functional testing and integrated JTAG boundary-scan support simplify board bring-up and production test strategies.
  • Package Options for Dense I/O: The 208-pin BFQFP (208-PQFP 28×28) provides a compact surface-mount footprint with 171 available I/O pins for signal-dense applications.

Why Choose EPF6016AQC208-1N?

The EPF6016AQC208-1N offers a balanced, reprogrammable logic solution for engineers needing medium-density logic (1,320 logic elements) with substantial I/O (171 pins) in a compact 208-BFQFP package. Its OptiFLEX architecture, dedicated arithmetic chains, and low-skew clock distribution make it suitable for designs that require predictable routing and in-field flexibility.

With 100% functional testing, built-in JTAG boundary-scan, RoHS compliance, and a commercial operating range, this device is positioned for development, prototyping, and low- to mid-volume deployments where reconfigurability and rapid design iteration are priorities.

Request a quote or submit a pricing inquiry to receive availability and lead-time details for the EPF6016AQC208-1N. Our sales team can provide part availability, pricing, and ordering options tailored to your project needs.

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