EPF6016AQC208-3N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

Quantity 1,076 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016AQC208-3N – FLEX 6000 Field Programmable Gate Array (FPGA), 1,320 logic elements, 171 I/Os, 208‑BFQFP

The EPF6016AQC208-3N is a FLEX 6000 series field programmable gate array (FPGA) device offering OptiFLEX register-rich, LUT-based architecture and a flexible interconnect structure. Designed as a low-cost, reconfigurable alternative to fixed gate-array implementations, it supports rapid prototyping, design iteration, and in-system updates.

With 1,320 logic elements (approximately 16,000 typical gates) and 171 I/O pins in a 208-pin surface-mount package, this commercial-grade device targets control, interface-bridging, and logic-integration applications that require moderate logic density and flexible I/O support within a 0 °C to 85 °C operating range.

Key Features

  • Core Architecture OptiFLEX register-rich, LUT-based architecture providing area-efficient programmable logic resources and predictable routing.
  • Logic Density 1,320 logic elements (about 16,000 typical gates) for mid-range combinational and sequential logic integration.
  • I/O and Interface Flexibility 171 I/O pins with individual tri-state output enable and programmable output slew-rate control to manage signal integrity and interfacing across mixed-voltage systems.
  • In-Circuit Reconfiguration & JTAG Supports in-circuit reconfigurability via an external configuration device or intelligent controller and includes IEEE Std. 1149.1 boundary-scan (JTAG) circuitry for board-level test and debug.
  • Flexible Interconnect and Arithmetic Support FastTrack interconnect with dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high-fan-in logic.
  • Power and Supply Operates from 3 V to 3.6 V supply range; series documentation notes low standby power (typical < 0.5 mA).
  • Package & Mounting Supplied in a 208‑BFQFP surface-mount package (supplier device package references a 208‑PQFP 28×28 footprint) for compact PCB implementation.
  • Commercial Grade & Environmental Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
  • Design Tool Support Series documentation provides software design support and automatic place-and-route for common development environments.

Typical Applications

  • Prototyping and Design Testing Rapidly iterate and validate hardware designs thanks to reprogrammable logic and in-circuit reconfiguration capabilities.
  • Gate-Array Replacement Cost-effective programmable alternative to fixed gate arrays for moderate-volume projects that require post-production design changes.
  • Interface Bridging Multi‑voltage I/O capability enables bridging between subsystems operating at different logic levels and integrating mixed-voltage peripherals.
  • Control and Glue Logic Implement custom control, sequencing, and peripheral interfacing where 1,320 logic elements and abundant I/O pins meet system requirements.

Unique Advantages

  • Balanced Logic Density: Provides mid-range capacity with 1,320 logic elements and ~16,000 gates suitable for moderate-complexity designs without excess resources.
  • Extensive I/O Count: 171 programmable I/Os simplify board-level integration by supporting multiple peripherals and interface standards on a single device.
  • In-System Flexibility: In-circuit reconfiguration and JTAG boundary-scan enable field updates, debugging, and production test without consuming user logic.
  • Efficient Arithmetic and Routing: Dedicated carry and cascade chains plus FastTrack interconnect reduce implementation effort for arithmetic and high-fan-in functions.
  • Compact Surface-Mount Package: 208-pin BFQFP surface-mount packaging supports dense PCB layouts while maintaining a standard PQFP footprint option for ease of assembly.
  • Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious product assemblies.

Why Choose EPF6016AQC208-3N?

The EPF6016AQC208-3N delivers a practical combination of programmable logic, sizable I/O, and series-proven architecture for customers seeking a cost-effective, reconfigurable solution. Its OptiFLEX architecture, in-circuit reconfiguration capability, and dedicated arithmetic resources make it well suited for designers replacing gate-array functions, building interface bridges, or consolidating control logic across mixed-voltage systems.

As a commercial‑grade, RoHS‑compliant device with a 3 V–3.6 V supply range and 0 °C–85 °C operating range, it fits applications where mid-density logic, flexible I/O, and field updateability matter. The device is supported by the FLEX 6000 series design tool ecosystem for streamlined implementation and verification.

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