EPF6016AQC208-3N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP |
|---|---|
| Quantity | 1,076 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016AQC208-3N – FLEX 6000 Field Programmable Gate Array (FPGA), 1,320 logic elements, 171 I/Os, 208‑BFQFP
The EPF6016AQC208-3N is a FLEX 6000 series field programmable gate array (FPGA) device offering OptiFLEX register-rich, LUT-based architecture and a flexible interconnect structure. Designed as a low-cost, reconfigurable alternative to fixed gate-array implementations, it supports rapid prototyping, design iteration, and in-system updates.
With 1,320 logic elements (approximately 16,000 typical gates) and 171 I/O pins in a 208-pin surface-mount package, this commercial-grade device targets control, interface-bridging, and logic-integration applications that require moderate logic density and flexible I/O support within a 0 °C to 85 °C operating range.
Key Features
- Core Architecture OptiFLEX register-rich, LUT-based architecture providing area-efficient programmable logic resources and predictable routing.
- Logic Density 1,320 logic elements (about 16,000 typical gates) for mid-range combinational and sequential logic integration.
- I/O and Interface Flexibility 171 I/O pins with individual tri-state output enable and programmable output slew-rate control to manage signal integrity and interfacing across mixed-voltage systems.
- In-Circuit Reconfiguration & JTAG Supports in-circuit reconfigurability via an external configuration device or intelligent controller and includes IEEE Std. 1149.1 boundary-scan (JTAG) circuitry for board-level test and debug.
- Flexible Interconnect and Arithmetic Support FastTrack interconnect with dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high-fan-in logic.
- Power and Supply Operates from 3 V to 3.6 V supply range; series documentation notes low standby power (typical < 0.5 mA).
- Package & Mounting Supplied in a 208‑BFQFP surface-mount package (supplier device package references a 208‑PQFP 28×28 footprint) for compact PCB implementation.
- Commercial Grade & Environmental Rated for 0 °C to 85 °C operating temperature and RoHS compliant.
- Design Tool Support Series documentation provides software design support and automatic place-and-route for common development environments.
Typical Applications
- Prototyping and Design Testing Rapidly iterate and validate hardware designs thanks to reprogrammable logic and in-circuit reconfiguration capabilities.
- Gate-Array Replacement Cost-effective programmable alternative to fixed gate arrays for moderate-volume projects that require post-production design changes.
- Interface Bridging Multi‑voltage I/O capability enables bridging between subsystems operating at different logic levels and integrating mixed-voltage peripherals.
- Control and Glue Logic Implement custom control, sequencing, and peripheral interfacing where 1,320 logic elements and abundant I/O pins meet system requirements.
Unique Advantages
- Balanced Logic Density: Provides mid-range capacity with 1,320 logic elements and ~16,000 gates suitable for moderate-complexity designs without excess resources.
- Extensive I/O Count: 171 programmable I/Os simplify board-level integration by supporting multiple peripherals and interface standards on a single device.
- In-System Flexibility: In-circuit reconfiguration and JTAG boundary-scan enable field updates, debugging, and production test without consuming user logic.
- Efficient Arithmetic and Routing: Dedicated carry and cascade chains plus FastTrack interconnect reduce implementation effort for arithmetic and high-fan-in functions.
- Compact Surface-Mount Package: 208-pin BFQFP surface-mount packaging supports dense PCB layouts while maintaining a standard PQFP footprint option for ease of assembly.
- Regulatory and Environmental Compliance: RoHS compliance supports environmentally conscious product assemblies.
Why Choose EPF6016AQC208-3N?
The EPF6016AQC208-3N delivers a practical combination of programmable logic, sizable I/O, and series-proven architecture for customers seeking a cost-effective, reconfigurable solution. Its OptiFLEX architecture, in-circuit reconfiguration capability, and dedicated arithmetic resources make it well suited for designers replacing gate-array functions, building interface bridges, or consolidating control logic across mixed-voltage systems.
As a commercial‑grade, RoHS‑compliant device with a 3 V–3.6 V supply range and 0 °C–85 °C operating range, it fits applications where mid-density logic, flexible I/O, and field updateability matter. The device is supported by the FLEX 6000 series design tool ecosystem for streamlined implementation and verification.
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