EPF6016AQC208-2N

The EPF6016AQC208-2N is a FLEX 6000 family programmable logic device from Intel (Altera) offering a mid-density FPGA fabric based on the OptiFLEX architecture. It provides 1,320 logic elements (LEs) and approximately 16,000 typical gates in a 208-pin BFQFP package, making it suitable for low-cost gate-array replacement, prototyping, and design-testing applications where reconfigurability and predictable I/O count are important.

Designed for commercial-temperature systems, this device supports 171 user I/O pins, a 3.0–3.6 V supply range, and family-level features such as in-circuit reconfiguration, JTAG boundary-scan, and flexible I/O operation to bridge different voltage domains.

Key Features

• Logic Capacity 1,320 logic elements and approximately 16,000 typical gates provide mid-density logic resources for glue logic, control functions, and moderate combinational/sequential designs.
• OptiFLEX Architecture Family-level OptiFLEX architecture optimizes device area efficiency while enabling routability and reprogrammable logic for iterative design flows.
• I/O and Package 171 user I/O pins in a 208-pin BFQFP (supplier package listed as 208-PQFP 28×28); surface-mount mounting simplifies PCB assembly for compact designs.
• Supply and Temperature Operates from 3.0 V to 3.6 V and is specified for commercial temperature range of 0 °C to 85 °C.
• In-Circuit Reconfiguration (ICR) Supports in-circuit reconfigurability via external configuration devices or intelligent controllers for rapid updates during prototyping or field changes.
• JTAG Boundary-Scan Built-in IEEE Std. 1149.1 boundary-scan test (JTAG) circuitry is available without consuming additional device logic.
• Dedicated Arithmetic and Cascade Chains Family features include dedicated carry and cascade chains to accelerate adders, counters, and high-fan-in logic functions when used with supported design tools.
• Low-Power Standby and Hot-Socketing Support Family datasheet notes low-power standby behavior and 3.3‑V device support for hot-socketing in appropriate system contexts.

Typical Applications

• Gate-array replacement & prototyping Use as a programmable alternative to mid-volume gate-array designs to enable fast design iteration and reduce nonrecurring engineering effort.
• Control and glue logic Implement board-level control functions, bus bridging, and custom interfacing where a fixed pin count and flexible logic are required.
• System I/O bridging 171 I/O pins and multivoltage I/O family capabilities enable bridging between different logic domains in mixed-voltage systems.
• Design verification and testing In-circuit reconfiguration and built-in JTAG boundary-scan simplify validation, bring-up, and manufacturing test flows.

Unique Advantages

• Mid-density logic with predictable routing 1,320 logic elements and OptiFLEX architecture provide a balance of capacity and efficient routing for medium-complexity designs.
• High I/O count in a compact package 171 I/O pins in a 208-pin BFQFP give designers ample signal access without a larger package footprint.
• Reconfigurable during development and deployment In-circuit reconfiguration support enables rapid firmware updates and iterative hardware/software co-development.
• Built-in test and debug infrastructure Integrated IEEE 1149.1 JTAG simplifies board-level test and boundary-scan diagnostics without consuming programmable logic.
• Commercial temperature and 3.3 V compatibility Specifically targeted for commercial systems operating at 0 °C to 85 °C with a 3.0–3.6 V supply range, matching many standard embedded environments.

Why Choose EPF6016AQC208-2N?

The EPF6016AQC208-2N positions itself as a practical, reprogrammable solution for mid-density logic needs where flexibility, I/O availability, and proven family-level features matter. Its 1,320 logic elements, 171 I/Os, and support for in-circuit reconfiguration and JTAG make it well suited to design teams performing prototyping, gate-array replacement, or board-level control functions.

This device offers long-term value for commercial embedded designs through a combination of predictable packaging, family architecture benefits, and test-friendly features that streamline development and manufacturing workflows.

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