EPF6016AQC208-3
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP |
|---|---|
| Quantity | 1,036 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016AQC208-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP
The EPF6016AQC208-3 is a FLEX 6000 family programmable logic device from Intel, featuring an OptiFLEX, register-rich, LUT-based architecture with reconfigurable SRAM elements. It delivers mid-density programmable logic with 1,320 logic elements and approximately 16,000 typical gates, packaged in a 208-pin surface-mount PQFP (28 × 28 mm) suitable for commercial embedded designs.
Designed for low-cost gate-array replacement and rapid prototyping or design testing, the device targets applications that require flexible in-circuit reconfiguration, extensive I/O, and predictable timing through dedicated routing and clock distribution resources.
Key Features
- Core Architecture OptiFLEX, register-rich LUT-based architecture providing 1,320 logic elements and approximately 16,000 typical gates for mid-density programmable logic integration.
- I/O and Package 171 I/O pins and a 208-BFQFP / 208-PQFP (28×28) supplier package in a surface-mount form factor for board-level integration and high signal-count designs.
- Voltage and Temperature Operates from 3.0 V to 3.6 V with an operating temperature range of 0 °C to 85 °C, targeting commercial-grade electronic applications.
- In-Circuit Reconfiguration Supports in-circuit reconfigurability via an external configuration device or intelligent controller, enabling field updates and iterative prototyping.
- System-Level Testability Built-in IEEE 1149.1 JTAG boundary-scan test circuitry is provided without consuming device logic, simplifying board-level test and validation.
- Clocking and Routing Built-in low-skew clock distribution and FastTrack continuous routing structure for predictable interconnect delays and consistent timing behavior.
- Arithmetic and High-Fan-In Support Dedicated carry and cascade chains accelerate arithmetic functions, counters, and high-fan-in logic, automatically utilized by development tools.
- Pin-Level Control Individual tri-state output enable per pin and programmable output slew-rate control to manage switching noise and interface timing.
- Low Power Features low standby current (typical specification referenced in device documentation) to reduce system power during idle periods.
- RoHS Compliant Device meets RoHS requirements for materials compliance.
Typical Applications
- Gate-array Replacement and Cost-Optimized ASIC Alternatives — Provides a reprogrammable alternative to fixed gate-array implementations for low- to mid-volume products and design iterations.
- Prototyping and Design Validation — Reconfigurable SRAM-based logic lets development teams iterate quickly during prototyping and design testing cycles.
- In-field Updatable Systems — In-circuit reconfiguration enables functional updates or feature changes after deployment without hardware replacement.
- High-Count I/O Interface and Glue Logic — 171 I/O pins and per-pin control simplify bridging between subsystems and implementing complex interface logic, including mixed-voltage environments.
- Board-Level Test and Diagnostics — Integrated JTAG boundary-scan reduces test overhead and supports board-level validation workflows.
Unique Advantages
- Flexible, Reprogrammable Logic — OptiFLEX architecture with LUT-based logic and reconfigurable SRAM supports rapid design changes and in-field updates.
- Mid-Density Integration — 1,320 logic elements and ~16,000 typical gates provide a balance of capacity and cost for mid-sized designs.
- High I/O Count in a Compact Package — 171 I/O pins in a 208-pin PQFP enable dense interfacing without large BGA footprints.
- Built-In Testability — IEEE 1149.1 JTAG boundary-scan is available without using user logic, streamlining manufacturing test and debug.
- Predictable Timing Resources — Low-skew clock distribution and dedicated carry/cascade chains reduce design complexity for timing-critical functions.
- Broad Development Tool Support — Documented software and EDA toolflow compatibility simplify place-and-route, synthesis, and verification for common development environments.
Why Choose EPF6016AQC208-3?
The EPF6016AQC208-3 is positioned for designers who need a commercially graded, reprogrammable mid-density FPGA with strong I/O capability and system-level features such as in-circuit reconfiguration and boundary-scan. Its OptiFLEX architecture and dedicated routing resources deliver predictable timing and efficient use of logic elements for prototyping, gate-array replacement, and interface logic.
Choosing this device provides a development-friendly platform with documented tool support and on-board testability, offering long-term flexibility for evolving product requirements while keeping BOM complexity and development iteration time in check.
Request a quote or submit an inquiry to receive availability and pricing for EPF6016AQC208-3. Our team can provide support on volume options and lead times.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018