EPF6016AQC208-3

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

Quantity 1,036 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016AQC208-3 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

The EPF6016AQC208-3 is a FLEX 6000 family programmable logic device from Intel, featuring an OptiFLEX, register-rich, LUT-based architecture with reconfigurable SRAM elements. It delivers mid-density programmable logic with 1,320 logic elements and approximately 16,000 typical gates, packaged in a 208-pin surface-mount PQFP (28 × 28 mm) suitable for commercial embedded designs.

Designed for low-cost gate-array replacement and rapid prototyping or design testing, the device targets applications that require flexible in-circuit reconfiguration, extensive I/O, and predictable timing through dedicated routing and clock distribution resources.

Key Features

  • Core Architecture OptiFLEX, register-rich LUT-based architecture providing 1,320 logic elements and approximately 16,000 typical gates for mid-density programmable logic integration.
  • I/O and Package 171 I/O pins and a 208-BFQFP / 208-PQFP (28×28) supplier package in a surface-mount form factor for board-level integration and high signal-count designs.
  • Voltage and Temperature Operates from 3.0 V to 3.6 V with an operating temperature range of 0 °C to 85 °C, targeting commercial-grade electronic applications.
  • In-Circuit Reconfiguration Supports in-circuit reconfigurability via an external configuration device or intelligent controller, enabling field updates and iterative prototyping.
  • System-Level Testability Built-in IEEE 1149.1 JTAG boundary-scan test circuitry is provided without consuming device logic, simplifying board-level test and validation.
  • Clocking and Routing Built-in low-skew clock distribution and FastTrack continuous routing structure for predictable interconnect delays and consistent timing behavior.
  • Arithmetic and High-Fan-In Support Dedicated carry and cascade chains accelerate arithmetic functions, counters, and high-fan-in logic, automatically utilized by development tools.
  • Pin-Level Control Individual tri-state output enable per pin and programmable output slew-rate control to manage switching noise and interface timing.
  • Low Power Features low standby current (typical specification referenced in device documentation) to reduce system power during idle periods.
  • RoHS Compliant Device meets RoHS requirements for materials compliance.

Typical Applications

  • Gate-array Replacement and Cost-Optimized ASIC Alternatives — Provides a reprogrammable alternative to fixed gate-array implementations for low- to mid-volume products and design iterations.
  • Prototyping and Design Validation — Reconfigurable SRAM-based logic lets development teams iterate quickly during prototyping and design testing cycles.
  • In-field Updatable Systems — In-circuit reconfiguration enables functional updates or feature changes after deployment without hardware replacement.
  • High-Count I/O Interface and Glue Logic — 171 I/O pins and per-pin control simplify bridging between subsystems and implementing complex interface logic, including mixed-voltage environments.
  • Board-Level Test and Diagnostics — Integrated JTAG boundary-scan reduces test overhead and supports board-level validation workflows.

Unique Advantages

  • Flexible, Reprogrammable Logic — OptiFLEX architecture with LUT-based logic and reconfigurable SRAM supports rapid design changes and in-field updates.
  • Mid-Density Integration — 1,320 logic elements and ~16,000 typical gates provide a balance of capacity and cost for mid-sized designs.
  • High I/O Count in a Compact Package — 171 I/O pins in a 208-pin PQFP enable dense interfacing without large BGA footprints.
  • Built-In Testability — IEEE 1149.1 JTAG boundary-scan is available without using user logic, streamlining manufacturing test and debug.
  • Predictable Timing Resources — Low-skew clock distribution and dedicated carry/cascade chains reduce design complexity for timing-critical functions.
  • Broad Development Tool Support — Documented software and EDA toolflow compatibility simplify place-and-route, synthesis, and verification for common development environments.

Why Choose EPF6016AQC208-3?

The EPF6016AQC208-3 is positioned for designers who need a commercially graded, reprogrammable mid-density FPGA with strong I/O capability and system-level features such as in-circuit reconfiguration and boundary-scan. Its OptiFLEX architecture and dedicated routing resources deliver predictable timing and efficient use of logic elements for prototyping, gate-array replacement, and interface logic.

Choosing this device provides a development-friendly platform with documented tool support and on-board testability, offering long-term flexibility for evolving product requirements while keeping BOM complexity and development iteration time in check.

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