EPF6016ATC100-1

The EPF6016ATC100-1 is a Flex 6000 series Field Programmable Gate Array (FPGA) supplied in a 100-TQFP (14×14) surface-mount package. It provides 1,320 logic elements, 81 user I/O pins and supports a 3 V to 3.6 V supply range for commercial-grade applications.

With a commercial operating temperature range of 0 °C to 85 °C and RoHS compliance, this device is intended for commercial embedded designs that require moderate logic density and a compact TQFP footprint.

Key Features

• Core Logic  Provides 1,320 logic elements (LEs) and 132 logic array blocks (LABs/CLBs equivalent) to implement combinational and sequential logic functions.
• Gate Density  Equivalent to approximately 16,000 gates of logic capacity for moderate-density programmable logic implementations.
• I/O  Includes 81 general-purpose I/O pins to support external peripheral interfacing and system-level connectivity.
• Memory  No on-chip embedded RAM; external memory is required if design demands on-chip storage.
• Power  Operates from a 3 V to 3.6 V supply, compatible with common commercial logic power rails.
• Package  100-TQFP surface-mount package, supplier device package 100-TQFP (14×14), suitable for space-constrained PCB layouts.
• Temperature Rating  Commercial operating range: 0 °C to 85 °C.
• Regulatory Status  RoHS compliant, meeting common environmental requirements for commercial electronics.

Typical Applications

• Commercial embedded systems  Programmable logic for control, glue logic and protocol handling in commercial products requiring up to 1,320 logic elements and 81 I/Os.
• Compact PCB designs  TQFP (14×14) package enables integration into space-limited boards while preserving accessible soldering and rework characteristics.
• 3 V logic platforms  Direct compatibility with systems operating from 3 V to 3.6 V power rails for consistent integration into commercial power domains.

Unique Advantages

• Moderate-density programmable logic:  1,320 logic elements provide a balance between capacity and cost for mid-range programmable designs.
• Generous I/O count:  81 I/O pins enable flexible interfacing with multiple peripherals and external devices without additional I/O expander hardware.
• Compact, manufacturable package:  100-TQFP (14×14) surface-mount package simplifies PCB layout for compact designs and standard assembly processes.
• Commercial temperature and RoHS compliance:  Rated 0 °C to 85 °C and RoHS compliant for use in mainstream commercial products and environmentally compliant manufacturing.
• Simple power integration:  3 V to 3.6 V supply range aligns with common commercial logic rails for easier power-system design.

Why Choose EPF6016ATC100-1?

The EPF6016ATC100-1 offers a practical mix of programmable logic capacity, I/O flexibility and a compact 100-TQFP package appropriate for commercial embedded designs. Its specification set—1,320 logic elements, 81 I/O pins, 3.0–3.6 V supply and 0 °C to 85 °C rating—makes it suitable for engineers seeking a straightforward FPGA option for mid-density applications.

This device is well suited for projects where package footprint, predictable supply requirements and RoHS compliance are important. Its feature set provides a scalable option for development and production in commercial product lines.

Request a quote or submit an inquiry to get pricing, availability and lead-time information for the EPF6016ATC100-1.