EPF6016AQI208-2

The EPF6016AQI208-2 is an Intel FLEX 6000 family FPGA supplied in a 208-pin BFQFP package and designed for industrial environments. It implements a register-rich, look-up table (LUT) based architecture (OptiFLEX) and targets low-cost, reprogrammable implementations where in-field changes and rapid prototyping are required.

This device provides 1,320 logic elements and approximately 16,000 typical gates with 171 available I/O pins, making it suitable for control, interfacing, and logic-integration tasks across industrial applications that require surface-mount assembly and extended temperature operation.

Key Features

• Core Architecture  Register-rich, LUT-based OptiFLEX architecture for efficient area use and flexible logic implementation as described for the FLEX 6000 family.
• Logic Capacity  1,320 logic elements and approximately 16,000 typical gates provide mid-range integration for custom control and glue-logic functions.
• I/O Density  171 I/O pins support diverse interfacing requirements; individual tri-state enable and programmable output slew-rate control are available at the family level.
• Configuration & Test  Supports in-circuit reconfigurability (ICR) via external configuration device or intelligent controller; built-in IEEE 1149.1 JTAG boundary-scan test circuitry is available without consuming additional device logic.
• Performance & Routing  Family features include a built-in low-skew clock distribution tree, dedicated carry and cascade chains for arithmetic and high-fan-in functions, and the FastTrack continuous routing structure for predictable interconnect delays.
• Supply & Power  Operates from a 3.0 V to 3.6 V supply range per product specification.
• Package & Mounting  Supplied in a 208-BFQFP package (supplier device package: 208-PQFP, 28×28) with surface-mount mounting for standard PCB assembly processes.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for industrial deployments.
• Compliance  RoHS compliant.

Typical Applications

• Prototyping & Design Validation  Rapid, reprogrammable logic makes the device suitable for iterative prototyping and functional verification during development cycles.
• Industrial Control  Use in motor control, PLC peripheral logic, or sensor aggregation where mid-level logic density and industrial temperature support are required.
• Interface Bridging and Glue Logic  Implement protocol translation, bus bridging, or custom I/O conditioning using the device’s 171 I/Os and family-level MultiVolt I/O capabilities.
• Field Upgradeable Systems  In-circuit reconfiguration enables firmware updates and in-field feature changes without board-level replacement.

Unique Advantages

• Reprogrammable Flexibility: In-circuit reconfigurability allows functional updates and quick design iterations without replacing hardware.
• Balanced Logic Density: 1,320 logic elements and ~16,000 gates provide a mid-range capacity that fits many control and interfacing tasks while preserving board space.
• Robust I/O Count: 171 I/O pins enable complex peripheral integration and multiple interface connections from a single device.
• Industrial-Ready Thermal Range: Rated −40 °C to 100 °C for deployment in industrial environments requiring extended temperature operation.
• Standard Surface-Mount Packaging: 208-pin BFQFP (208-PQFP 28×28 supplier package) supports common PCB assembly workflows for cost-effective production.
• Testability & Debug Support: Built-in JTAG boundary-scan circuitry facilitates board-level test and debug without using additional logic resources.

Why Choose EPF6016AQI208-2?

The EPF6016AQI208-2 combines the FLEX 6000 family’s OptiFLEX architecture and field reprogrammability with a practical logic capacity and a high I/O count, making it well suited for industrial embedded designs that require updateable logic and robust thermal performance. Its combination of 1,320 logic elements, ~16,000 typical gates, and 171 I/Os delivers a compact, flexible platform for control, interfacing, and mid-level integration tasks.

Engineers seeking a reprogrammable FPGA with surface-mount packaging and industrial temperature capability will find EPF6016AQI208-2 aligns with development and production processes where in-circuit updates, board-level testability, and a broad tool ecosystem (as provided for the FLEX 6000 family) are important.

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