EPF6016AQC208-2
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP |
|---|---|
| Quantity | 184 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016AQC208-2 – FLEX 6000 Field Programmable Gate Array (FPGA), 171 I/O, 1,320 Logic Elements
The EPF6016AQC208-2 is a FLEX 6000 series field programmable gate array (FPGA) from Intel, delivering a register-rich, LUT-based architecture optimized for low-cost gate-array replacement and rapid prototyping. It combines 1,320 logic elements and approximately 16,000 typical gates with a flexible I/O set—171 pins—making it suitable for a wide range of digital system designs.
Built on the OptiFLEX architecture, this 3.0–3.6 V device supports in-circuit reconfigurability and includes system-level features such as built-in JTAG boundary-scan and a low-skew clock distribution tree to simplify board-level integration and test.
Key Features
- Core Architecture Register-rich, look-up table (LUT) based OptiFLEX architecture that increases device area efficiency and supports reprogrammable logic.
- Logic Capacity 1,320 logic elements providing approximately 16,000 typical gates for medium-density logic integration.
- I/O and Interfaces 171 user I/O pins with individual tri-state output enable control and programmable output slew-rate control for reduced switching noise and flexible board interfacing.
- System-Level Features In-circuit reconfigurability (ICR) via external configuration device or intelligent controller, plus built-in IEEE 1149.1 JTAG boundary-scan test circuitry for board-level diagnostics.
- Interconnect and Arithmetic Support Dedicated carry and cascade chains for efficient implementation of adders, counters, and high-fan-in logic; FastTrack continuous routing structure for predictable interconnect delays.
- Package & Mounting Surface-mount 208-BFQFP / 208-PQFP (28×28) package, supporting compact board layouts and standardized assembly.
- Power & Temperature Supply voltage range 3.0 V to 3.6 V and commercial operating temperature range 0 °C to 85 °C.
- Compliance RoHS compliant for environmental and regulatory alignment.
Typical Applications
- Prototyping and Development Rapid design iteration and testing where in-circuit reconfiguration and reprogrammability accelerate development cycles.
- Gate-Array Replacement Cost-effective alternative to fixed gate-array implementations for medium-density logic integration and lower NRE risk.
- System Glue Logic and I/O Bridging Implement bus bridging, protocol translation, and custom I/O control using flexible I/O and programmable logic.
- Embedded Control Control and interface functions for embedded systems that benefit from dedicated carry chains and predictable interconnect for arithmetic and control logic.
Unique Advantages
- Balanced Logic Density: 1,320 logic elements and ~16,000 typical gates provide a practical balance of capacity and cost for medium-complexity designs.
- Extensive I/O Count: 171 I/O pins enable broad peripheral and bus connectivity without external multiplexing.
- Reconfigurability: In-circuit reconfigurability lets designers update functionality in-system, shortening debug cycles and enabling field updates.
- Built-in Testability: Integrated IEEE 1149.1 JTAG boundary-scan circuitry simplifies board-level testing and debug.
- Package Flexibility: 208-pin PQFP/BFQFP surface-mount package supports compact PCB layouts and automated assembly.
- Vendor Toolchain Support: Family-level support includes software place-and-route and development tools to streamline design implementation and verification.
Why Choose EPF6016AQC208-2?
The EPF6016AQC208-2 is positioned for engineers needing a cost-effective, reprogrammable medium-density FPGA with robust I/O and on-board test features. Its OptiFLEX LUT-based architecture, dedicated arithmetic chains, and 171 I/O pins make it well suited for prototype systems, gate-array replacements, and embedded control tasks where board-level testability and in-field updates matter.
For teams focused on reducing development time and BOM complexity while retaining flexibility, this FLEX 6000 device offers a pragmatic combination of logic capacity, system features, and packaged form factor backed by established toolflow support.
If you would like pricing, availability, or a formal quote for EPF6016AQC208-2, please submit a request or inquiry and our team will respond with the next steps.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018