EPF6016AFC256-2

IC FPGA 171 I/O 256FBGA
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 256-BGA

Quantity 950 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O171Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016AFC256-2 – FLEX 6000 FPGA, 171 I/O, 1320 logic elements, 256‑BGA

The EPF6016AFC256-2 is a FLEX 6000 family field programmable gate array (FPGA) from Intel, featuring the OptiFLEX register-rich, look-up table (LUT)-based architecture. It provides a reprogrammable logic platform targeted as a low-cost, flexible alternative to fixed gate-array designs for prototyping and design testing.

With approximately 1,320 logic elements (typical 16,000 gates) and support for in-circuit reconfiguration, this device addresses applications that require moderate logic capacity, dense I/O (171 pins), and a compact 256‑BGA (17×17) surface-mount package. The device is specified for commercial-grade operation with a supply range of 3.0 V to 3.6 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Architecture  Register-rich, LUT-based OptiFLEX architecture for efficient area utilization and flexible logic implementation.
  • Logic Capacity  Approximately 1,320 logic elements (typical 16,000 gates) suitable for mid-density programmable logic tasks.
  • I/O and Interconnect  171 user I/O pins with programmable output slew-rate control and individual tri-state output enable per pin for flexible system interfacing.
  • Reconfiguration & Test  Supports in-circuit reconfigurability via external configuration devices or intelligent controllers and includes built-in JTAG boundary-scan (IEEE Std. 1149.1) for device test and board-level debug.
  • Clock and Routing  Built-in low-skew global clock distribution and dedicated carry/cascade chains to support arithmetic and high-fan-in logic functions.
  • Package & Mounting  256‑BGA (256‑FBGA, 17×17) surface-mount package for compact board layouts and high I/O density.
  • Power & Environmental  Single-supply operation from 3.0 V to 3.6 V, commercial-grade temperature range (0 °C to 85 °C), and RoHS-compliant manufacturing.
  • Manufacturing & Quality  100% functional testing of devices prior to shipment as part of the FLEX 6000 family production flow.

Typical Applications

  • Prototyping and Design Validation  Rapid hardware iteration and in-circuit reconfiguration make this device well suited for prototype boards and functional testing.
  • Gate-Array Replacement  A cost-effective, reprogrammable alternative to high-volume gate-array designs where design changes or updates are expected during development.
  • Multi-Voltage System Bridging  MultiVolt I/O capabilities allow the device to interface between subsystems operating at different logic levels.
  • Moderate-Density Control and Interface Functions  Ideal for control logic, protocol bridging, and I/O consolidation where approximately 1,320 logic elements and 171 I/O pins meet system requirements.

Unique Advantages

  • Balanced Logic Density: ~1,320 logic elements and typical 16,000 gates provide a middle ground between low- and high-density PLDs for many embedded designs.
  • Flexible Reconfiguration: In-circuit reconfigurability enables field updates and iterative development without board swaps.
  • Comprehensive Testability: Built-in JTAG boundary-scan support simplifies board-level testing and debug workflows.
  • Compact, High-Density Package: 256‑BGA (17×17) package delivers high I/O count in a small footprint for space-constrained PCBs.
  • Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for standard commercial applications.
  • Family-Level Tools and Support: FLEX 6000 family design flows include automated place-and-route and support for common EDA interfaces to streamline development.

Why Choose EPF6016AFC256-2?

The EPF6016AFC256-2 combines the FLEX 6000 OptiFLEX architecture with reprogrammable SRAM-based logic and robust system-level features such as JTAG boundary-scan and flexible I/O control. Its balance of logic elements, gate capacity, and 171 I/O pins makes it suited to mid-density programmable tasks where reconfigurability and compact packaging are priorities.

This part is positioned for teams needing a commercially graded, reprogrammable solution for prototyping, design iteration, and deployment in applications that benefit from in-field updates and multi-voltage interfacing. The FLEX 6000 family’s tested devices and established design flow help reduce integration risk and accelerate time-to-market.

Request a quote or submit an inquiry to get pricing and availability for the EPF6016AFC256-2 and to discuss how it fits your next FPGA-based design.

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