EPF6016AFC256-2
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 256-BGA |
|---|---|
| Quantity | 950 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 171 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016AFC256-2 – FLEX 6000 FPGA, 171 I/O, 1320 logic elements, 256‑BGA
The EPF6016AFC256-2 is a FLEX 6000 family field programmable gate array (FPGA) from Intel, featuring the OptiFLEX register-rich, look-up table (LUT)-based architecture. It provides a reprogrammable logic platform targeted as a low-cost, flexible alternative to fixed gate-array designs for prototyping and design testing.
With approximately 1,320 logic elements (typical 16,000 gates) and support for in-circuit reconfiguration, this device addresses applications that require moderate logic capacity, dense I/O (171 pins), and a compact 256‑BGA (17×17) surface-mount package. The device is specified for commercial-grade operation with a supply range of 3.0 V to 3.6 V and an operating temperature range of 0 °C to 85 °C.
Key Features
- Core Architecture Register-rich, LUT-based OptiFLEX architecture for efficient area utilization and flexible logic implementation.
- Logic Capacity Approximately 1,320 logic elements (typical 16,000 gates) suitable for mid-density programmable logic tasks.
- I/O and Interconnect 171 user I/O pins with programmable output slew-rate control and individual tri-state output enable per pin for flexible system interfacing.
- Reconfiguration & Test Supports in-circuit reconfigurability via external configuration devices or intelligent controllers and includes built-in JTAG boundary-scan (IEEE Std. 1149.1) for device test and board-level debug.
- Clock and Routing Built-in low-skew global clock distribution and dedicated carry/cascade chains to support arithmetic and high-fan-in logic functions.
- Package & Mounting 256‑BGA (256‑FBGA, 17×17) surface-mount package for compact board layouts and high I/O density.
- Power & Environmental Single-supply operation from 3.0 V to 3.6 V, commercial-grade temperature range (0 °C to 85 °C), and RoHS-compliant manufacturing.
- Manufacturing & Quality 100% functional testing of devices prior to shipment as part of the FLEX 6000 family production flow.
Typical Applications
- Prototyping and Design Validation Rapid hardware iteration and in-circuit reconfiguration make this device well suited for prototype boards and functional testing.
- Gate-Array Replacement A cost-effective, reprogrammable alternative to high-volume gate-array designs where design changes or updates are expected during development.
- Multi-Voltage System Bridging MultiVolt I/O capabilities allow the device to interface between subsystems operating at different logic levels.
- Moderate-Density Control and Interface Functions Ideal for control logic, protocol bridging, and I/O consolidation where approximately 1,320 logic elements and 171 I/O pins meet system requirements.
Unique Advantages
- Balanced Logic Density: ~1,320 logic elements and typical 16,000 gates provide a middle ground between low- and high-density PLDs for many embedded designs.
- Flexible Reconfiguration: In-circuit reconfigurability enables field updates and iterative development without board swaps.
- Comprehensive Testability: Built-in JTAG boundary-scan support simplifies board-level testing and debug workflows.
- Compact, High-Density Package: 256‑BGA (17×17) package delivers high I/O count in a small footprint for space-constrained PCBs.
- Commercial-Grade Reliability: Specified for 0 °C to 85 °C operation and RoHS-compliant manufacturing for standard commercial applications.
- Family-Level Tools and Support: FLEX 6000 family design flows include automated place-and-route and support for common EDA interfaces to streamline development.
Why Choose EPF6016AFC256-2?
The EPF6016AFC256-2 combines the FLEX 6000 OptiFLEX architecture with reprogrammable SRAM-based logic and robust system-level features such as JTAG boundary-scan and flexible I/O control. Its balance of logic elements, gate capacity, and 171 I/O pins makes it suited to mid-density programmable tasks where reconfigurability and compact packaging are priorities.
This part is positioned for teams needing a commercially graded, reprogrammable solution for prototyping, design iteration, and deployment in applications that benefit from in-field updates and multi-voltage interfacing. The FLEX 6000 family’s tested devices and established design flow help reduce integration risk and accelerate time-to-market.
Request a quote or submit an inquiry to get pricing and availability for the EPF6016AFC256-2 and to discuss how it fits your next FPGA-based design.

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