EPF6016ATC100-3

The EPF6016ATC100-3 is a FLEX 6000 series programmable logic device based on a register-rich, look-up table (LUT) architecture and Intel’s OptiFLEX architecture for area-efficient implementation. It provides a reprogrammable, low-cost alternative to fixed gate-array designs and is well suited for prototyping, design testing, and low-to-moderate complexity custom logic functions.

Designed for systems that require moderate logic density and flexible I/O, this surface-mount 100-TQFP device combines 1,320 logic elements (approximately 16,000 typical gates) with 81 I/O pins, a 3.0 V–3.6 V supply range, and commercial-temperature operation from 0 °C to 85 °C.

Key Features

• Core Architecture Register-rich, LUT-based OptiFLEX architecture that minimizes die area while delivering predictable routing and routing efficiency.
• Logic Capacity 1,320 logic elements (approximately 16,000 typical gates) for implementing medium-density custom logic.
• I/O and Package 81 I/O pins in a 100-pin TQFP (14 × 14 mm) surface-mount package for straightforward PCB integration and moderate I/O requirements.
• Supply and Temperature 3.0 V to 3.6 V supply operation with a commercial operating temperature range of 0 °C to 85 °C.
• In-Circuit Reconfigurability (ICR) Supports in-circuit reconfiguration via an external configuration device or intelligent controller to enable field updates and design iteration.
• Built-in Test and Boundary-Scan JTAG boundary-scan (IEEE Std. 1149.1) circuitry is included without consuming additional device logic, and devices are 100% functionally tested prior to shipment.
• Power and I/O Control Programmable output slew-rate control and individual tri-state output enable per pin to manage switching noise and I/O behavior.
• Fast Interconnect and Arithmetic Support FastTrack interconnect structure with dedicated carry and cascade chains for efficient implementation of adders, counters, and high-fan-in logic.
• Standby and Power Efficiency Architecture and system-level features designed to support low-power standby operation.
• Standards and Compliance RoHS-compliant and supplied in a surface-mount 100-TQFP package for modern PCB assembly processes.
• Software Support Supported by Altera’s development system and automatic place-and-route tools for common development platforms.

Typical Applications

• Prototyping & Development Reprogrammable logic for rapid iteration during design validation and functional testing of custom digital circuits.
• Low- to Mid-Volume Gate Array Replacement Replace custom gate-array designs where flexibility and faster time-to-market are required without high NRE.
• Embedded Control & Peripheral Interface Aggregate I/O, implement control logic, and bridge peripherals in applications that need configurable digital glue logic.
• Algorithm Acceleration and Arithmetic Blocks Use dedicated carry and cascade chains to implement fast adders, counters, and comparators within embedded systems.

Unique Advantages

• Balanced Logic Density: 1,320 logic elements and ~16,000 typical gates provide a middle-ground option for designs that need substantial but not excessive logic resources.
• Flexible I/O in a Compact Package: 81 I/O in a 100-TQFP (14×14) offers a compact, surface-mount footprint for space-constrained PCBs while preserving multiple signal interfaces.
• Field Reconfigurability: In-circuit reconfiguration capability enables firmware-like updates to hardware behavior without board-level changes.
• Design and Testability: Integrated JTAG boundary-scan and 100% functional testing simplify board-level debug and manufacturing test coverage.
• Deterministic Interconnect: FastTrack routing and dedicated chains reduce routing complexity for arithmetic and high-fan-in functions, improving place-and-route predictability.
• Commercial-Grade Reliability: Operates across a commercial temperature range (0 °C to 85 °C) with RoHS-compliant packaging suitable for mainstream electronics products.

Why Choose EPF6016ATC100-3?

The EPF6016ATC100-3 positions itself as a pragmatic choice for designers who need reprogrammable logic with moderate density, reliable testability, and flexible I/O in a compact 100-TQFP package. Its OptiFLEX architecture, LUT-based logic, and dedicated interconnect chains make it suitable for accelerating arithmetic functions and consolidating glue-logic in embedded systems.

For teams focused on rapid prototyping, low- to mid-volume production, or designs that require field update capability, this FLEX 6000 device offers a verifiable, supported platform with established development-tool coverage and industry-standard boundary-scan test features.

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