EPF6016ATC144-1N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP |
|---|---|
| Quantity | 1,656 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 117 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016ATC144-1N – FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP
The EPF6016ATC144-1N is an Intel FLEX 6000 family FPGA with an OptiFLEX, register‑rich, LUT‑based architecture designed for low‑cost programmable logic and fast design iteration. It provides 1,320 logic elements (approximately 16,000 typical gates) and 117 I/O in a 144‑pin LQFP/TQFP surface‑mount package for commercial‑grade applications.
This device targets prototyping, design testing and low‑to‑medium density custom logic tasks where in‑circuit reconfigurability, predictable interconnect and flexible I/O control are important. Key system benefits include built‑in boundary‑scan support, programmable I/O features and a low‑skew clock distribution structure.
Key Features
- Core architecture Register‑rich, LUT‑based OptiFLEX architecture that optimizes device area efficiency for flexible logic implementations.
- Logic density 1,320 logic elements corresponding to approximately 16,000 typical gates, suitable for medium‑density programmable designs.
- I/O and package 117 I/O pins in a 144‑pin LQFP package (supplier package: 144‑TQFP, 20×20); surface‑mount mounting for compact board integration.
- Programmable I/O controls Individual tri‑state output enable for each pin and programmable output slew‑rate control to manage switching noise and interface timing.
- Clocking and timing Built‑in low‑skew clock distribution tree with four low‑skew global paths for clock, clear, preset or logic signals.
- Fast interconnect and arithmetic support FastTrack interconnect for predictable routing delays plus dedicated carry and cascade chains for high‑speed adders, counters and wide fan‑in logic.
- In‑system reconfiguration & test Supports in‑circuit reconfigurability via an external configuration device or intelligent controller and includes IEEE 1149.1 JTAG boundary‑scan test circuitry without consuming device logic.
- Electrical and environmental Supply voltage range 3.0 V to 3.6 V, commercial grade operation from 0 °C to 85 °C, and RoHS compliant.
Typical Applications
- Prototyping & design validation Use the device for iterative hardware development where fast functional changes and in‑circuit reprogramming speed time‑to‑market.
- Custom logic and glue‑logic Implement board‑level glue, protocol bridging and medium‑density custom logic with dedicated carry chains for arithmetic functions.
- Interface and I/O control Leverage the programmable I/O features and 117 I/O pins to manage multiple digital interfaces and control signals in commercial systems.
- Low‑cost gate array replacement Deploy as a reprogrammable alternative to fixed gate‑array designs for low‑to‑medium volume production runs and design updates.
Unique Advantages
- Compact medium‑density integration: 1,320 logic elements and ~16,000 gates deliver a balance of capacity and board footprint for many commercial designs.
- Flexible I/O and signal control: Individual tri‑state enables and programmable slew‑rate help optimize signal integrity and interface compatibility without extra external components.
- Predictable performance: Low‑skew global clock paths and FastTrack interconnect simplify timing closure for synchronous designs.
- Design and test convenience: Built‑in IEEE 1149.1 JTAG boundary‑scan and support for in‑circuit reconfiguration streamline debugging, production test and field updates.
- Commercial temperature and RoHS compliance: 0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial hardware requirements.
Why Choose EPF6016ATC144-1N?
The EPF6016ATC144-1N positions itself as a practical, reprogrammable solution for engineers needing medium‑density logic, flexible I/O and in‑circuit configurability in a compact surface‑mount package. Its OptiFLEX architecture and dedicated interconnect features facilitate efficient implementation of arithmetic and control functions while keeping board complexity low.
This device is well suited to development teams and product designs that require fast iterations, reliable boundary‑scan testability and a commercially rated FPGA option with 117 I/O in a 144‑pin footprint. The combination of programmable I/O, low‑skew clocking and on‑board reconfiguration support offers long‑term design flexibility and easier maintenance of deployed hardware.
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