EPF6016ATC144-1N

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 1,656 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity LevelN/ANumber of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016ATC144-1N – FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

The EPF6016ATC144-1N is an Intel FLEX 6000 family FPGA with an OptiFLEX, register‑rich, LUT‑based architecture designed for low‑cost programmable logic and fast design iteration. It provides 1,320 logic elements (approximately 16,000 typical gates) and 117 I/O in a 144‑pin LQFP/TQFP surface‑mount package for commercial‑grade applications.

This device targets prototyping, design testing and low‑to‑medium density custom logic tasks where in‑circuit reconfigurability, predictable interconnect and flexible I/O control are important. Key system benefits include built‑in boundary‑scan support, programmable I/O features and a low‑skew clock distribution structure.

Key Features

  • Core architecture  Register‑rich, LUT‑based OptiFLEX architecture that optimizes device area efficiency for flexible logic implementations.
  • Logic density  1,320 logic elements corresponding to approximately 16,000 typical gates, suitable for medium‑density programmable designs.
  • I/O and package  117 I/O pins in a 144‑pin LQFP package (supplier package: 144‑TQFP, 20×20); surface‑mount mounting for compact board integration.
  • Programmable I/O controls  Individual tri‑state output enable for each pin and programmable output slew‑rate control to manage switching noise and interface timing.
  • Clocking and timing  Built‑in low‑skew clock distribution tree with four low‑skew global paths for clock, clear, preset or logic signals.
  • Fast interconnect and arithmetic support  FastTrack interconnect for predictable routing delays plus dedicated carry and cascade chains for high‑speed adders, counters and wide fan‑in logic.
  • In‑system reconfiguration & test  Supports in‑circuit reconfigurability via an external configuration device or intelligent controller and includes IEEE 1149.1 JTAG boundary‑scan test circuitry without consuming device logic.
  • Electrical and environmental  Supply voltage range 3.0 V to 3.6 V, commercial grade operation from 0 °C to 85 °C, and RoHS compliant.

Typical Applications

  • Prototyping & design validation  Use the device for iterative hardware development where fast functional changes and in‑circuit reprogramming speed time‑to‑market.
  • Custom logic and glue‑logic  Implement board‑level glue, protocol bridging and medium‑density custom logic with dedicated carry chains for arithmetic functions.
  • Interface and I/O control  Leverage the programmable I/O features and 117 I/O pins to manage multiple digital interfaces and control signals in commercial systems.
  • Low‑cost gate array replacement  Deploy as a reprogrammable alternative to fixed gate‑array designs for low‑to‑medium volume production runs and design updates.

Unique Advantages

  • Compact medium‑density integration: 1,320 logic elements and ~16,000 gates deliver a balance of capacity and board footprint for many commercial designs.
  • Flexible I/O and signal control: Individual tri‑state enables and programmable slew‑rate help optimize signal integrity and interface compatibility without extra external components.
  • Predictable performance: Low‑skew global clock paths and FastTrack interconnect simplify timing closure for synchronous designs.
  • Design and test convenience: Built‑in IEEE 1149.1 JTAG boundary‑scan and support for in‑circuit reconfiguration streamline debugging, production test and field updates.
  • Commercial temperature and RoHS compliance: 0 °C to 85 °C operating range and RoHS compliance align the device with standard commercial hardware requirements.

Why Choose EPF6016ATC144-1N?

The EPF6016ATC144-1N positions itself as a practical, reprogrammable solution for engineers needing medium‑density logic, flexible I/O and in‑circuit configurability in a compact surface‑mount package. Its OptiFLEX architecture and dedicated interconnect features facilitate efficient implementation of arithmetic and control functions while keeping board complexity low.

This device is well suited to development teams and product designs that require fast iterations, reliable boundary‑scan testability and a commercially rated FPGA option with 117 I/O in a 144‑pin footprint. The combination of programmable I/O, low‑skew clocking and on‑board reconfiguration support offers long‑term design flexibility and easier maintenance of deployed hardware.

Request a quote or submit an inquiry to receive pricing and availability details for the EPF6016ATC144-1N.

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