EPF6016ATC144-3

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 659 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016ATC144-3 – FLEX 6000 FPGA IC, 1,320 Logic Elements, 144-LQFP

The EPF6016ATC144-3 is a FLEX 6000 family field-programmable gate array (FPGA) device based on the OptiFLEX® look-up table (LUT) architecture. It provides reconfigurable SRAM-based logic with in-circuit reconfigurability for prototyping, design testing, and low-cost alternatives to gate-array implementations.

With 1,320 logic elements (approximately 16,000 typical gates), 117 I/O pins in a 144-pin surface-mount package, and a 3.0–3.6 V supply range, this device suits embedded control, interface bridging, and small- to medium-density programmable logic tasks where flexible I/O and field updates are required.

Key Features

  • Logic Capacity — 1,320 logic elements and approximately 16,000 typical gates provide medium-density programmable logic for control, glue logic, and moderate datapath implementations.
  • I/O and Package — 117 available I/O pins in a 144-LQFP surface-mount package (supplier package listed as 144-TQFP, 20×20). Suitable for designs that require a balance of I/O count and compact board footprint.
  • OptiFLEX® Architecture — Register-rich, LUT-based architecture designed to increase device area efficiency and support reprogrammable SRAM logic.
  • Clock and Interconnect — Built-in low-skew clock distribution tree and FastTrack® continuous routing structure for predictable timing and routing behavior; dedicated carry and cascade chains for arithmetic and high-fan-in logic.
  • In-Circuit Reconfigurability (ICR) — Supports configuration via an external configuration device or intelligent controller to enable design updates without device replacement.
  • Boundary-Scan (JTAG) — Built-in IEEE Std. 1149.1-1990 JTAG boundary-scan test circuitry available without consuming additional device logic.
  • Power and Supply — 3.0 V to 3.6 V supply voltage range; device documentation notes low-power standby behavior for system-level power management.
  • Pin Control and Signal Integrity — Individual tri-state output enable per pin and programmable output slew-rate control to help manage switching noise and interface timing.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
  • Compliance — RoHS compliant.
  • Design Tools and Support — Software design support and automatic place-and-route are provided by the FLEX 6000 development tools referenced in the device family documentation.

Typical Applications

  • Prototyping and Development — Rapid iteration and in-circuit reconfiguration make the device suitable for hardware prototyping and design validation workflows.
  • Gate-Array Replacement — Medium-density programmable alternative to lower-volume gate array designs, reducing time-to-market for small production runs and design changes.
  • Embedded Control and Glue Logic — Implement controllers, state machines, and interface logic in compact board layouts using the device’s combination of logic elements and I/O.
  • Mixed-Voltage Interface Bridging — Multi-voltage I/O capabilities documented for the FLEX 6000 family allow the device to bridge systems operating at different voltage levels.

Unique Advantages

  • Field Reconfigurability: In-circuit reconfigurability enables firmware-like updates to hardware logic without replacing the device.
  • Balanced Logic and I/O: 1,320 logic elements paired with 117 I/O pins in a 144-pin package provides a practical balance for medium-density board designs.
  • Deterministic Timing Structures: Low-skew clock distribution and dedicated carry/cascade chains deliver predictable timing for arithmetic and control paths.
  • Design Toolchain Support: Documented software design support and automatic place-and-route tools simplify implementation and reduce development time.
  • RoHS Compliance: Environmentally compliant manufacturing status supports modern assembly requirements.

Why Choose EPF6016ATC144-3?

The EPF6016ATC144-3 positions itself as a medium-density, reprogrammable FPGA option for engineers who need flexible, in-field-updatable logic with a practical I/O count in a 144-pin surface-mount package. Its OptiFLEX architecture, dedicated arithmetic chains, and on-board boundary-scan support make it well suited for prototyping, design testing, and low- to mid-volume production where rapid design changes and interface flexibility are priorities.

Choose this device when you require a verified, commercially graded programmable logic solution that combines reconfiguration capability, controllable I/O behavior, and established development tool support to shorten design cycles and simplify BOM choices.

Request a quote or submit a request for pricing and availability for EPF6016ATC144-3 to begin evaluation or to confirm current stock and lead times.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up