EPF6016ATC144-3
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP |
|---|---|
| Quantity | 659 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 117 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016ATC144-3 – FLEX 6000 FPGA IC, 1,320 Logic Elements, 144-LQFP
The EPF6016ATC144-3 is a FLEX 6000 family field-programmable gate array (FPGA) device based on the OptiFLEX® look-up table (LUT) architecture. It provides reconfigurable SRAM-based logic with in-circuit reconfigurability for prototyping, design testing, and low-cost alternatives to gate-array implementations.
With 1,320 logic elements (approximately 16,000 typical gates), 117 I/O pins in a 144-pin surface-mount package, and a 3.0–3.6 V supply range, this device suits embedded control, interface bridging, and small- to medium-density programmable logic tasks where flexible I/O and field updates are required.
Key Features
- Logic Capacity — 1,320 logic elements and approximately 16,000 typical gates provide medium-density programmable logic for control, glue logic, and moderate datapath implementations.
- I/O and Package — 117 available I/O pins in a 144-LQFP surface-mount package (supplier package listed as 144-TQFP, 20×20). Suitable for designs that require a balance of I/O count and compact board footprint.
- OptiFLEX® Architecture — Register-rich, LUT-based architecture designed to increase device area efficiency and support reprogrammable SRAM logic.
- Clock and Interconnect — Built-in low-skew clock distribution tree and FastTrack® continuous routing structure for predictable timing and routing behavior; dedicated carry and cascade chains for arithmetic and high-fan-in logic.
- In-Circuit Reconfigurability (ICR) — Supports configuration via an external configuration device or intelligent controller to enable design updates without device replacement.
- Boundary-Scan (JTAG) — Built-in IEEE Std. 1149.1-1990 JTAG boundary-scan test circuitry available without consuming additional device logic.
- Power and Supply — 3.0 V to 3.6 V supply voltage range; device documentation notes low-power standby behavior for system-level power management.
- Pin Control and Signal Integrity — Individual tri-state output enable per pin and programmable output slew-rate control to help manage switching noise and interface timing.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
- Compliance — RoHS compliant.
- Design Tools and Support — Software design support and automatic place-and-route are provided by the FLEX 6000 development tools referenced in the device family documentation.
Typical Applications
- Prototyping and Development — Rapid iteration and in-circuit reconfiguration make the device suitable for hardware prototyping and design validation workflows.
- Gate-Array Replacement — Medium-density programmable alternative to lower-volume gate array designs, reducing time-to-market for small production runs and design changes.
- Embedded Control and Glue Logic — Implement controllers, state machines, and interface logic in compact board layouts using the device’s combination of logic elements and I/O.
- Mixed-Voltage Interface Bridging — Multi-voltage I/O capabilities documented for the FLEX 6000 family allow the device to bridge systems operating at different voltage levels.
Unique Advantages
- Field Reconfigurability: In-circuit reconfigurability enables firmware-like updates to hardware logic without replacing the device.
- Balanced Logic and I/O: 1,320 logic elements paired with 117 I/O pins in a 144-pin package provides a practical balance for medium-density board designs.
- Deterministic Timing Structures: Low-skew clock distribution and dedicated carry/cascade chains deliver predictable timing for arithmetic and control paths.
- Design Toolchain Support: Documented software design support and automatic place-and-route tools simplify implementation and reduce development time.
- RoHS Compliance: Environmentally compliant manufacturing status supports modern assembly requirements.
Why Choose EPF6016ATC144-3?
The EPF6016ATC144-3 positions itself as a medium-density, reprogrammable FPGA option for engineers who need flexible, in-field-updatable logic with a practical I/O count in a 144-pin surface-mount package. Its OptiFLEX architecture, dedicated arithmetic chains, and on-board boundary-scan support make it well suited for prototyping, design testing, and low- to mid-volume production where rapid design changes and interface flexibility are priorities.
Choose this device when you require a verified, commercially graded programmable logic solution that combines reconfiguration capability, controllable I/O behavior, and established development tool support to shorten design cycles and simplify BOM choices.
Request a quote or submit a request for pricing and availability for EPF6016ATC144-3 to begin evaluation or to confirm current stock and lead times.

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