EPF6016ATI144-3

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 40 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016ATI144-3 – FLEX 6000 Field Programmable Gate Array (FPGA), 144‑LQFP

The EPF6016ATI144-3 is an Intel FLEX 6000 series field programmable gate array (FPGA) featuring the OptiFLEX register-rich, look-up table (LUT) architecture. The device provides 1,320 logic elements (approximately 16,000 gates) and 117 user I/O pins in a 144‑pin LQFP surface-mount package.

Designed for mid-density programmable logic applications, this industrial-grade FPGA supports in-circuit reconfiguration, boundary-scan testing, and flexible I/O control. It is suited for designers seeking a reprogrammable alternative to fixed gate-array implementations with a focus on deployable industrial environments.

Key Features

  • Core architecture OptiFLEX register-rich LUT-based architecture with 1,320 logic elements and approximately 16,000 typical gates for mid-density logic implementations.
  • I/O control 117 user I/O pins with individual tri-state output enable control and programmable output slew-rate to manage switching noise and interface timing.
  • Configuration and test Supports in-circuit reconfigurability (ICR) via external configuration device or intelligent controller, and includes IEEE Std. 1149.1 JTAG boundary-scan test (BST) circuitry.
  • Interconnect and arithmetic support FastTrack interconnect with dedicated carry and cascade chains to implement fast adders, counters, and high-fan-in logic functions.
  • Clocking Built-in low-skew clock distribution tree and multiple global low-skew paths to support predictable timing on clock, clear, preset, or other global signals.
  • Memory Total on-chip RAM bits: 0 (device is provided without embedded RAM).
  • Package and mounting 144-pin LQFP surface-mount package; supplier reference also lists 144-TQFP (20×20). RoHS compliant.
  • Power and temperature Supply voltage range 3.0 V to 3.6 V. Operating temperature range −40 °C to 100 °C; device grade: Industrial.

Typical Applications

  • Prototyping and design validation Reprogrammable logic enables rapid design iterations and in-system updates during prototyping and testing phases.
  • Gate-array replacement Mid-density programmable alternative to fixed gate-array implementations where design flexibility and faster time-to-market are required.
  • Industrial control and automation Industrial temperature rating and robust I/O control make the device suitable for control logic, custom sequencing, and interface tasks in industrial equipment.
  • System glue logic and interface bridging Flexible I/O management and programmable slew-rate allow the FPGA to implement custom glue logic and interface bridging between subsystems.

Unique Advantages

  • Reconfigurable in-system In-circuit reconfigurability enables firmware updates and functional changes without hardware replacement.
  • Clearly defined mid-density capacity 1,320 logic elements and roughly 16,000 gates provide deterministic resource expectations for mid-range custom logic designs.
  • Granular I/O control Per-pin tri-state enable and programmable slew-rate reduce design risk when integrating with mixed-speed peripherals.
  • Industrial-rated operation −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
  • Standard surface-mount packaging 144‑pin LQFP footprint supports common PCB assembly flows and enables compact board layouts.
  • Environmental compliance RoHS compliant for regulatory and manufacturing requirements.

Why Choose EPF6016ATI144-3?

The EPF6016ATI144-3 offers a balanced combination of reprogrammability, mid-density logic resources, and robust I/O control in a compact 144‑pin surface-mount package. Its OptiFLEX LUT-based architecture and dedicated interconnect features provide a predictable platform for custom logic, arithmetic, and glue-logic implementations.

This industrial-grade FPGA is well suited to teams replacing gate-array designs, performing in-field updates, or deploying flexible control and interface logic in applications that require a stable operating temperature range and clear resource sizing.

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