EPF6016ATI100-2

The EPF6016ATI100-2 is an Intel FLEX 6000 series field programmable gate array provided in a 100-pin TQFP (14×14) surface-mount package. It uses a register-rich, look-up table (LUT) based OptiFLEX architecture and is targeted for designers seeking a reprogrammable, low-cost alternative to fixed gate-array implementations and for rapid prototyping or design validation.

Key device attributes include 1,320 logic elements (LEs), approximately 16,000 typical gates, 81 I/O pins, a 3.0–3.6 V supply range and an industrial operating temperature range of −40 °C to 100 °C. The part includes system-level features such as in-circuit reconfigurability and IEEE 1149.1 JTAG boundary-scan support.

Key Features

• Core Architecture  Register-rich, LUT-based OptiFLEX architecture that maximizes device area efficiency and supports reconfigurable logic implementation.
• Logic Density  Approximately 1,320 logic elements and 16,000 typical gates; suitable for medium-complexity programmable logic designs.
• I/O and Signal Control  81 I/O pins with individual tri-state output enable control and programmable output slew-rate control to reduce switching noise and optimize signal integrity.
• System-Level Features  In-circuit reconfigurability (ICR) via an external configuration device or intelligent controller, and built-in JTAG (IEEE 1149.1) boundary-scan circuitry for board-level test access.
• Interconnect and Arithmetic Support  Dedicated carry and cascade chains to implement fast adders, counters and high-fan-in logic functions; FastTrack continuous routing for predictable interconnect delays.
• Clocking  Built-in low-skew clock distribution tree and four low-skew global paths suitable for clock, clear, preset or logic signals.
• Package and Mounting  100-TQFP (14×14) surface-mount package, enabling compact board layouts and standard SMT assembly.
• Electrical & Environmental  Voltage supply 3.0 V to 3.6 V; industrial operating temperature −40 °C to 100 °C; RoHS compliant.
• Quality and Test  Devices are 100% functionally tested prior to shipment, with built-in boundary-scan test support that does not consume additional user logic.

Typical Applications

• Prototyping & Design Validation  Reprogrammable logic for rapid iteration during prototype and design testing phases where fast design changes are needed.
• Gate-Array Replacement  Low-cost, programmable alternative to fixed gate-array implementations for medium-density logic integration and shorter time-to-market.
• Board-Level Test & Diagnostics  Built-in IEEE 1149.1 JTAG boundary-scan circuitry facilitates board testability and debug without consuming user logic.
• Industrial Control & Interfaces  Industrial temperature rating and flexible I/O control make the device suitable for control logic, interface bridging, and sensor or actuator interfacing in industrial systems.

Unique Advantages

• Flexible Reconfigurability:  In-circuit reconfigurability via external configuration devices enables field updates and iterative design changes.
• Predictable Timing:  FastTrack interconnect structure and dedicated carry/cascade chains reduce routing uncertainty for timing-critical functions.
• Board-Level Testability:  Integrated JTAG boundary-scan support simplifies manufacturing test and system diagnostics without using user logic resources.
• Industrial Robustness:  Rated for −40 °C to 100 °C operation and supplied in an industry-standard 100-TQFP surface-mount package for reliable deployment in industrial environments.
• Quality Assurance:  100% functional testing prior to shipment provides predictable quality for production designs.
• Standards-Based I/O Controls:  Individual tri-state enables and slew-rate control help manage signal integrity across mixed-voltage or noise-sensitive interfaces.

Why Choose EPF6016ATI100-2?

The EPF6016ATI100-2 offers a balanced combination of medium logic density, flexible system features and industrial-grade environmental tolerance. Its OptiFLEX LUT-based architecture and dedicated arithmetic chains provide efficient mapping for common control, interface and arithmetic functions while the built-in JTAG and in-circuit reconfiguration options support efficient test and field updates.

This part is suited to engineering teams and OEMs who need a reprogrammable, tested FPGA solution in a compact 100-TQFP surface-mount package, operating from a 3.0–3.6 V supply and across industrial temperature limits. The device’s feature set supports rapid prototyping, design iteration and cost-effective replacement of fixed gate-array implementations.

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