EPF6016ATI144-3N

The EPF6016ATI144-3N is a FLEX 6000-series FPGA IC from Intel designed for low-cost, reprogrammable logic applications. It implements a register‑rich, look‑up table (LUT) based OptiFLEX architecture to deliver flexible logic and routing for prototyping, design testing, and low- to mid-volume programmable logic needs.

This device provides 1,320 logic elements, approximately 16,000 typical gates, and up to 117 user I/O pins in a 144‑pin LQFP package, with a 3.0–3.6 V supply range and an industrial operating temperature span of −40 °C to 100 °C.

Key Features

• Core architecture  Register‑rich, LUT‑based OptiFLEX architecture for compact, routable logic implementation as described in the FLEX 6000 family documentation.
• Logic capacity  1,320 logic elements (LEs) and approximately 16,000 typical gates to implement medium-density logic functions.
• I/O and package  117 I/O pins in a 144‑LQFP (144‑TQFP 20×20 supplier package) surface‑mount package, enabling multiple external interfaces in a compact footprint.
• Configuration and test  Supports in‑circuit reconfigurability via external configuration devices or intelligent controllers and includes IEEE 1149.1 JTAG boundary‑scan circuitry for board‑level test access.
• Clock and arithmetic support  Built‑in low‑skew clock distribution tree and dedicated carry/cascade chains for efficient implementation of arithmetic and high‑fan‑in logic functions.
• Power and supply  Operates from 3.0 V to 3.6 V (covers 3.3 V operation) and includes low‑power standby behavior described for the FLEX 6000 family.
• Temperature and grade  Industrial grade operation with a specified operating temperature range of −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Prototyping and design validation  Reprogrammable logic is suited to iterative hardware development and verification during product bring‑up and testing.
• Gate‑array replacement  Low‑cost alternative to fixed gate‑array implementations where post‑production changes or updates are required.
• System interface and voltage bridging  Flexible I/O count and multi‑voltage I/O support in the FLEX 6000 family make the device useful for implementing interface logic and bridging between systems.
• In‑system reconfiguration  In‑circuit reconfigurability enables functional updates or mode changes without board replacement.

Unique Advantages

• OptiFLEX architecture: Optimized device area efficiency and routability inherited from the FLEX 6000 family architecture.
• Medium-density integration: 1,320 logic elements and ~16,000 typical gates provide a balanced capacity for a wide range of control and glue‑logic tasks without excessive board space.
• Compact, surface‑mount package: 144‑LQFP (surface mount) with 117 usable I/Os gives a practical footprint for constrained PCBs while retaining ample external connectivity.
• In‑circuit reconfiguration and JTAG: Supports ICR via external configuration devices and includes IEEE 1149.1 boundary‑scan circuitry for board test and diagnostics.
• Industrial temperature range: Specified operation from −40 °C to 100 °C for thermal robustness in demanding environments.
• Standby and low‑power capability: FLEX 6000 family documentation includes low‑power standby characteristics, supporting reduced power modes where appropriate.

Why Choose EPF6016ATI144-3N?

The EPF6016ATI144-3N positions itself as a flexible, medium‑density FPGA choice within the FLEX 6000 family, combining the OptiFLEX architecture, 1,320 logic elements, and roughly 16,000 gates with 117 I/O pins in a 144‑pin LQFP footprint. Its support for in‑circuit reconfiguration and JTAG boundary‑scan makes it suitable for iterative development cycles and deployable systems that may require field updates.

This device is well suited to engineers seeking a reprogrammable, industrial‑grade logic solution for prototyping, low‑volume product runs, and system interface logic where a balance of capacity, I/O, and temperature resilience is required.

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