EPF6016ATI100-2N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 81 1320 100-TQFP |
|---|---|
| Quantity | 1,711 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 81 | Voltage | 3 V - 3.6 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016ATI100-2N – FLEX 6000 Field Programmable Gate Array (FPGA) IC 81 1320 100-TQFP
The EPF6016ATI100-2N is an Intel FLEX 6000 series field programmable gate array optimized for cost-sensitive programmable logic applications and rapid prototyping. It implements a register-rich, look-up table–based architecture (OptiFLEX) intended to deliver efficient area utilization and flexible reconfiguration for design testing and low-volume production.
Targeted uses include in-circuit reconfigurable logic, bridging between voltage domains, and embedded control in industrial environments. The device combines 1,320 logic elements and approximately 16,000 typical gates with 81 user I/Os in a 100-pin TQFP surface-mount package.
Key Features
- Core architecture — Register-rich, LUT-based OptiFLEX architecture for efficient logic implementation and compact die area.
- Logic capacity — 1,320 logic elements and approximately 16,000 typical gates, providing a balance of density for mid-range programmable logic tasks.
- I/O capability — 81 user I/O pins with individual tri-state output enable and programmable output slew-rate control for signal integrity management.
- Package & mounting — Available in a 100-pin TQFP (14×14) surface-mount package suitable for compact board layouts.
- Power supply — Operates from 3.0 V to 3.6 V supply range to support 3.3 V system environments.
- Thermal and grade — Industrial-grade device rated for an operating range of −40 °C to 100 °C.
- System-level features — In-circuit reconfigurability via external configuration device or controller, plus built-in IEEE 1149.1 boundary-scan (JTAG) circuitry for board-level testability.
- Interconnect and arithmetic support — FastTrack interconnect with dedicated carry and cascade chains to implement adders, counters, and high-fan-in logic efficiently.
- Reliability & testing — Devices are 100% functionally tested prior to shipment; includes low-skew global clock routing for predictable timing.
- Environmental compliance — RoHS compliant for regulatory alignment in many end products.
Typical Applications
- Prototyping & design validation — Rapidly iterate logic designs and validate system behavior using the device’s in-circuit reconfigurability.
- Gate-array replacement — Provide a programmable, lower-cost alternative to fixed gate-array implementations during low- to mid-volume production runs.
- Industrial control — Implement control logic, I/O bridging, and signal conditioning in industrial equipment operating across the device’s −40 °C to 100 °C range.
- Interface bridging — Use MultiVolt I/O operation to connect systems operating at different voltage domains while maintaining flexible I/O control.
Unique Advantages
- Reconfigurable hardware: In-circuit reconfigurability lets you update logic without board changes, shortening development cycles and enabling field updates.
- Balanced density and I/O: 1,320 logic elements with 81 I/Os provide a practical mix of logic capacity and connectivity for mid-range designs.
- Board-level testability: Built-in IEEE 1149.1 JTAG boundary-scan simplifies manufacturing test and debug without consuming user logic.
- predictable routing and arithmetic support: FastTrack interconnect and dedicated carry/cascade chains speed implementation of arithmetic and high-fan-in functions.
- Industrial operating range: Specified for −40 °C to 100 °C, making the device suitable for demanding temperature environments.
- RoHS compliant: Meets environmental requirements for modern electronics assemblies.
Why Choose EPF6016ATI100-2N?
The EPF6016ATI100-2N positions itself as a flexible, mid-density FPGA option within the FLEX 6000 family, combining a compact 100-TQFP footprint with 1,320 logic elements and roughly 16,000 typical gates. It is well suited to engineers needing a programmable alternative to gate arrays, with features that support in-system reconfiguration, board-level test, and efficient arithmetic implementation.
Its industrial temperature rating, multi-volt I/O capabilities, and RoHS compliance make it appropriate for embedded and industrial applications where temperature range and regulatory alignment matter. The device also benefits from FLEX 6000 family design compatibility and established toolchain support described for the series, helping teams scale designs or move between package options within the family.
Request a quote or submit an inquiry to get pricing, availability, and support details for the EPF6016ATI100-2N. Our team can assist with ordering quantities, lead times, and technical clarification to accelerate your design cycle.

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