EPF6016BC256-2

The EPF6016BC256-2 is a FLEX 6000 family programmable logic device offering a register-rich, LUT-based architecture with OptiFLEX area optimization and reconfigurable SRAM elements. This 5.0-V device provides 1,320 logic elements, approximately 16,000 typical gates, and up to 204 I/O in a 256-ball BGA (27 × 27 mm) package for surface-mount applications.

Engineered for low-cost gate-array replacement, rapid prototyping, and in-system reconfiguration, the device supports system-level features such as in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan. Its commercial-grade operating range and RoHS compliance make it suitable for a wide range of standard embedded and interface-control designs.

Key Features

• Core Architecture
  Register-rich, LUT-based OptiFLEX architecture with dedicated carry and cascade chains to support fast arithmetic and high‑fan‑in logic functions.
• Logic Resources
  1,320 logic elements and approximately 16,000 typical gates for medium-density programmable logic implementations.
• I/O and Interface
  Up to 204 I/O pins with individual tri-state output enable and programmable output slew-rate control for signal integrity and flexible interfacing.
• Configuration and Test
  In-circuit reconfigurability via external configuration device or intelligent controller, plus built-in IEEE 1149.1 JTAG boundary-scan for board-level test without consuming user logic.
• Clocking and Interconnect
  Built-in low-skew clock distribution tree and FastTrack continuous routing structure for predictable timing; dedicated carry and cascade chains accelerate arithmetic and complex logic.
• Power and Voltage
  5.0-V device with supply range 4.75 V to 5.25 V and low-power standby behavior noted in the family data.
• Package and Mounting
  256-LBGA (256-ball BGA, 27 × 27 mm) surface-mount package for dense board layouts and reliable soldered connections.
• Operating Range and Compliance
  Commercial operating temperature 0 °C to 85 °C and RoHS compliance for regulatory and environmental considerations.

Typical Applications

• Prototyping and Development
  Rapid design iteration and functional testing where in-circuit reconfigurability and reprogrammable logic reduce development cycles.
• Gate-Array Replacement
  Cost-sensitive designs that require a programmable alternative to fixed gate-array implementations while preserving gate-count parity.
• Interface and Glue Logic
  Custom bus bridging, signal conditioning, and peripheral interfacing using the device’s 204 I/O pins and programmable I/O controls.
• Board-Level Test and Validation
  Built-in JTAG boundary-scan simplifies board test and debug without consuming additional user logic resources.

Unique Advantages

• Reprogrammable Flexibility:
  In-circuit reconfiguration enables field updates and design changes without board replacement, reducing lifecycle cost.
• Medium-Density Integration:
  1,320 logic elements and ~16,000 gates provide a balance of capacity and cost for many embedded logic functions.
• Robust I/O Capability:
  204 configurable I/O pins with individual output enable and slew-rate control help manage signal integrity across mixed-voltage systems.
• Test-Ready Design:
  IEEE 1149.1 JTAG boundary-scan is available without consuming device logic, streamlining manufacturing test and board-level diagnostics.
• Package Density:
  256-ball BGA (27 × 27 mm) delivers high pin count in a compact surface-mount footprint for space-constrained boards.
• Proven Family Features:
  OptiFLEX architecture, low-skew clocking, and dedicated arithmetic chains provide predictable routing and performance for deterministic designs.

Why Choose EPF6016BC256-2?

The EPF6016BC256-2 combines the FLEX 6000 family’s OptiFLEX architecture and reconfigurable SRAM-based logic to deliver a practical, programmable alternative to fixed gate-array solutions. With 1,320 logic elements, roughly 16,000 gates, extensive I/O and built-in test/configuration features, it is well suited for engineers needing medium-density programmable logic with in-system flexibility.

This device is aimed at teams developing prototypes, custom interface logic, and designs that benefit from field reconfiguration, board-level boundary-scan, and cost-effective integration in a 256-BGA surface-mount package. Its commercial temperature range and RoHS compliance support deployment across standard embedded applications.

Request a quote or submit an inquiry for pricing and availability of EPF6016BC256-2 to begin your design evaluation and procurement process.