EPF6016QC208-2

The EPF6016QC208-2 is a FLEX 6000 family field programmable gate array (FPGA) from Intel (Altera). It is based on the OptiFLEX architecture and provides a reprogrammable, register-rich, LUT-based logic fabric intended as a low-cost, programmable alternative to fixed gate-array designs.

Key hardware specifics for this device include 1,320 logic elements, approximately 16,000 typical gates, 171 I/O pins in a 208-pin fine-pitch quad flat package, a 5.0 V nominal supply (4.75 V to 5.25 V), and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Architecture — OptiFLEX, register-rich LUT-based architecture delivering 1,320 logic elements and approximately 16,000 typical gates for flexible logic implementation.
• I/O and Interface — 171 user I/O pins with individual tri-state output-enable control and programmable output slew-rate control; supports MultiVolt I/O interface operation to bridge between systems at different voltages.
• Configuration & Test — In-circuit reconfigurability (ICR) via external configuration device or intelligent controller and built-in IEEE Std. 1149.1 JTAG boundary-scan test circuitry available without consuming user logic.
• Dedicated Arithmetic Support — Dedicated carry and cascade chains for efficient implementation of adders, counters, comparators, and high-fan-in logic functions.
• Interconnect & Clocking — FastTrack continuous routing structure for predictable interconnect delays and a built-in low-skew clock distribution tree with four low-skew global paths for clock/clear/preset or logic signals.
• Power & Standby — 5.0 V device operation with a supply range of 4.75 V to 5.25 V; family-level standby behavior includes low power consumption characteristics.
• Package & Mounting — Surface-mount 208-BFQFP package (supplier package: 208-PQFP 28×28) suitable for compact PCB designs; RoHS compliant.
• Grade & Environment — Commercial grade device rated for 0 °C to 85 °C operation and RoHS compliant.
• On-Chip Memory — No embedded on-chip RAM (total RAM bits: 0) for designs that rely solely on logic resources and external memory.

Typical Applications

• Prototyping & Design Validation — Rapidly iterate hardware designs and test gate-array replacements using the device’s reprogrammable logic and in-circuit reconfiguration capabilities.
• Low-Cost Gate-Array Replacement — Implement medium-density logic functions as a programmable alternative to custom gate arrays, reducing NRE and enabling late-stage design changes.
• System Glue Logic & Interface Bridging — Use the device’s MultiVolt I/O and abundant I/O pins to bridge components operating at different voltages and consolidate glue logic into a single programmable device.
• Boundary-Scan Testability — Integrate JTAG boundary-scan for board-level testing and manufacturing diagnostics without consuming user logic resources.

Unique Advantages

• Flexible, Reprogrammable Platform: OptiFLEX architecture and in-circuit reconfiguration let teams change functionality during prototyping or in-field updates without hardware redesign.
• Mid-Density Logic Capacity: 1,320 logic elements and ~16,000 gates provide sufficient density for medium-complexity logic implementations while keeping BOM costs predictable.
• Rich I/O Capability: 171 I/O pins with per-pin output enable and programmable slew rate simplify interface design and signal integrity tuning on mixed-voltage systems.
• Test and Manufacturing Support: Built-in IEEE 1149.1 JTAG boundary-scan enables board-level test and diagnostics without using the device’s logic resources.
• Package Flexibility: 208-pin fine-pitch quad flat package in a surface-mount form factor supports compact PCB layouts and common assembly flows.
• Standards Compatibility: As a 5.0 V device, the family supports compliance with the PCI Local Bus Specification, Revision 2.2, where applicable.

Why Choose EPF6016QC208-2?

The EPF6016QC208-2 positions itself as a commercially graded, mid-density FPGA option for engineers and procurement teams seeking a programmable alternative to gate-array implementations. With 1,320 logic elements, ~16,000 typical gates, and 171 I/O pins in a 208-pin surface-mount package, it targets applications that require flexible logic integration, robust I/O, and production-ready packaging.

This device is suited for design teams working on prototypes, system glue logic, or moderate-complexity digital functions that benefit from reprogrammability, boundary-scan testing, and MultiVolt interfacing. Its commercial temperature rating and RoHS compliance make it appropriate for a broad range of general-purpose electronic products and development projects.

Request a quote or submit an inquiry to receive availability and pricing information for the EPF6016QC208-2. Our team can provide lead-time details and support for procurement and integration planning.