EPF6016QC208-3N

The EPF6016QC208-3N is a FLEX 6000 family programmable logic device implementing a register-rich, LUT-based architecture designed for low-cost, reconfigurable logic. Built around Altera’s OptiFLEX architecture, this 5.0‑V device targets gate-array replacement, rapid prototyping, and design testing where reprogrammability and flexible I/O are required.

With 1,320 logic elements, 171 user I/O pins in a 208‑pin fine quad flat package, and support for in‑circuit reconfiguration and JTAG boundary-scan, the device is suited to system glue logic, interface bridging, and low- to mid-density programmable logic roles in commercial applications.

Key Features

• Core Architecture Register-rich, LUT-based OptiFLEX architecture delivering approximately 16,000 typical gates and 1,320 logic elements for mid-density programmable logic.
• I/O and Interfaces 171 user I/O pins with individual tri-state output enable control and programmable output slew-rate to help manage switching noise and interface timing.
• Package & Mounting 208‑pin BFQFP package (supplier device package: 208‑PQFP, 28x28) suitable for surface-mount assembly.
• Supply & Temperature 5.0‑V operation with a specified supply range of 4.75 V to 5.25 V and a commercial operating temperature range of 0 °C to 85 °C.
• System-Level Features In-circuit reconfigurability (ICR) via external configuration device or intelligent controller, built-in JTAG boundary-scan compliant with IEEE Std. 1149.1 for board-level test without consuming user logic.
• Interconnect & Arithmetic Support FastTrack interconnect, dedicated carry and cascade chains for efficient implementation of arithmetic functions and high-fan-in logic.
• Design-for-Test 100% functional device testing is performed; JTAG boundary-scan is available without additional user logic consumption.
• Compliance RoHS compliant.

Typical Applications

• Gate‑Array Replacement Low-cost, reprogrammable alternative to high-volume gate array implementations for volume-constrained or evolving designs.
• Prototyping & Design Validation Rapid hardware iteration and in-circuit reconfiguration make the device suitable for functional prototyping and system-level testing.
• Interface Bridging & Glue Logic Multi-voltage I/O and abundant I/O pins allow the device to implement protocol bridging and glue logic between subsystems operating at different voltages.
• Board-Level Test & Debug Built-in IEEE 1149.1 JTAG boundary-scan provides a test and debug path without consuming general-purpose logic resources.

Unique Advantages

• Mid-Density Logic Capacity: 1,320 logic elements and approximately 16,000 typical gates provide a balance of capacity and cost for mid-range designs.
• Flexible I/O Count: 171 I/O pins in a 208‑pin package enable complex interfacing and multiple peripheral connections without external multiplexing.
• In‑Circuit Reconfigurability: Support for ICR allows functionality updates and iterative development without board rework.
• Established Family Features: OptiFLEX architecture, FastTrack interconnect, and dedicated arithmetic chains simplify implementation of common functions like adders and counters.
• Testability and Reliability: 100% functional testing and integrated JTAG boundary-scan improve manufacturability and board-level diagnostics.
• Commercial Temperature and RoHS Compliance: Commercial grade operation (0 °C to 85 °C) and RoHS compliance support mainstream product requirements.

Why Choose EPF6016QC208-3N?

The EPF6016QC208-3N positions itself as a practical mid-density FPGA option for designers seeking a reprogrammable, 5.0‑V solution with substantial I/O and on-board logic. Its OptiFLEX architecture, dedicated arithmetic resources, and 100% functional testing provide a predictable platform for replacing gate-array implementations, accelerating prototyping, and implementing system glue logic.

Available in a 208‑pin BFQFP surface-mount package and backed by family-level design support and tools, this device is well suited to commercial applications that require adaptable logic, robust board-level testability, and flexible I/O in a compact footprint.

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