EPF6016QC208-3

The EPF6016QC208-3 is a FLEX 6000 family FPGA from Intel, based on the OptiFLEX register-rich, LUT-based architecture. It provides a reprogrammable logic fabric with in-circuit reconfigurability and features intended for low-cost alternatives to high-volume gate-array implementations and rapid prototyping.

With 1,320 logic elements, approximately 16,000 typical gates and 171 I/O pins in a 208-pin PQFP package, this commercial-grade, RoHS-compliant device targets applications that require flexible logic, wide I/O count and 5.0 V system compatibility.

Key Features

• Core architecture — OptiFLEX register-rich, LUT-based architecture designed to increase device area efficiency and support fast design changes during prototyping and testing.
• Logic capacity — Approximately 1,320 logic elements and 16,000 typical gates for medium-density programmable logic integration.
• I/O and system interfacing — 171 user I/O pins with individual tri-state output enable control and programmable output slew-rate control to manage switching noise and signal integrity.
• Clocking and timing — Built-in low-skew clock distribution tree and four low-skew global paths to support clock, clear, preset or logic signals.
• Dedicated arithmetic and logic chains — Dedicated carry and cascade chains to implement fast adders, counters and high-fan-in logic functions without consuming general routing resources.
• Flexible interconnect — FastTrack continuous routing structure and tri-state emulation for predictable interconnect delays and internal tri-state network support.
• Reconfiguration and test — In-circuit reconfigurability via external configuration device or intelligent controller, and built-in JTAG boundary-scan test (IEEE 1149.1) available without consuming device logic.
• Package and mounting — Surface-mount 208-BFQFP / 208-PQFP (28×28) package for standard PCB assembly processes.
• Power and environmental — 5.0 V device operation with a specified supply range of 4.75 V to 5.25 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.
• Embedded memory — Total on-chip RAM bits: 0 (SRAM-based reconfigurable elements provide the programmable fabric).

Typical Applications

• Gate-array replacement and volume designs — Use as a low-cost, reprogrammable alternative to fixed gate arrays for medium-density logic integration and design flexibility.
• Prototyping and design validation — Reprogrammable architecture and in-circuit reconfiguration enable rapid iteration and functional testing during development.
• System interface and bus bridging — 171 I/O pins and 5.0 V device compatibility support bridging and interface control in mixed-voltage systems; 5.0 V devices are compliant with the PCI Local Bus Specification, Revision 2.2.
• Control and signal processing — Dedicated carry and cascade chains and low-skew clocking make the device suitable for fast adders, counters and control logic in embedded systems.

Unique Advantages

• Reprogrammable flexibility: In-circuit reconfigurability lets you update functionality without board changes, accelerating field updates and iterative development.
• Balanced logic density: 1,320 logic elements and ~16,000 typical gates provide medium-density capacity for consolidating discrete logic and small CPLDs into a single device.
• High I/O count for system integration: 171 I/O pins enable extensive peripheral and bus connectivity while minimizing external glue logic.
• Predictable timing and performance: Built-in low-skew clock distribution, FastTrack interconnect and dedicated arithmetic chains reduce routing complexity and support consistent timing.
• Production-friendly packaging: 208-pin PQFP (surface mount) package supports standard assembly flows and footprint compatibility with other FLEX 6000 devices.
• Standards-aware operation: 5.0 V supply compatibility aligns with legacy 5 V systems and the device family documents PCI Local Bus compliance for 5.0 V variants.

Why Choose EPF6016QC208-3?

The EPF6016QC208-3 positions itself as a practical, reprogrammable FPGA for designs that need medium-density logic, substantial I/O and 5 V system compatibility. Its OptiFLEX architecture and device-level features—such as dedicated carry chains, low-skew clocking and FastTrack interconnect—help simplify board-level designs and speed development cycles.

This commercial-grade, RoHS-compliant device is suited to engineering teams and procurement groups looking for a programmable logic solution that balances capacity, I/O reach and reconfiguration capability while supporting standard surface-mount assembly and commercial temperature operation.

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