EPF6016QC208-2N
| Part Description |
FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP |
|---|---|
| Quantity | 753 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 171 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 132 | Number of Logic Elements/Cells | 1320 | ||
| Number of Gates | 16000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF6016QC208-2N – FLEX 6000 FPGA, 16,000 gates, 171 I/O, 208-BFQFP
The EPF6016QC208-2N is a member of the FLEX 6000 programmable logic family, offering a register-rich, LUT-based architecture optimized for low-cost, reprogrammable logic implementations. With approximately 16,000 gates implemented across 1,320 logic elements and 171 general-purpose I/O pins in a 208-pin surface-mount package, this device targets prototyping, design testing, and mid-density glue-logic or control applications where in-system flexibility and fast design iteration matter.
Built on the OptiFLEX architecture and supplied as a commercial-grade 5.0 V device, the EPF6016QC208-2N supports in-circuit reconfigurability, standardized JTAG boundary-scan, and a suite of I/O and interconnect features that simplify board-level integration and design reuse.
Key Features
- Logic Density — Approximately 16,000 typical gates implemented as 1,320 logic elements, providing a mid-density programmable fabric for control, interface, and glue-logic functions.
- Flexible I/O — 171 I/O pins with individual tri-state output-enable control and programmable output slew-rate control for reduced switching noise and flexible board interfacing.
- Package & Mounting — 208-pin BFQFP package (208-PQFP footprint, 28×28) in a surface-mount form factor suitable for compact PCB layouts.
- Power & Voltage — 5.0 V device with a specified supply range of 4.75 V to 5.25 V to support legacy 5 V systems and board-level power domains.
- Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
- Architecture & Interconnect — OptiFLEX architecture with FastTrack continuous routing, dedicated carry and cascade chains for arithmetic and high-fan-in logic functions, and four low-skew global paths for clock or control signals.
- System-level Features — In-circuit reconfigurability via an external configuration device or controller, built-in IEEE 1149.1 JTAG boundary-scan circuitry, and support for bridging systems with different I/O voltages through MultiVolt I/O operation.
- Test & Reliability — 100% functional testing prior to shipment to simplify board bring-up and reduce field failures.
- Development Ecosystem — Family-level support for automatic place-and-route and software-based design flows as described in the FLEX 6000 documentation.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Prototyping & Development — Rapid hardware iteration, functional validation, and design testing where reprogrammability and fast changes are required.
- Gate-Array Replacement — Low-cost, reprogrammable alternative to fixed gate-array designs for mid-volume production and design evolution.
- Peripheral & Bus Interfaces — 5.0 V compatibility and flexible I/O make the device suitable for implementing PCI-compliant peripheral logic and other 5 V interface bridges.
- Control & Glue Logic — Custom state machines, interface glue, and embedded control functions that benefit from dedicated carry/cascade chains and abundant I/O.
Unique Advantages
- Reprogrammable Flexibility: In-circuit reconfigurability enables on-board updates and functional changes without replacing hardware.
- Mid-Density Integration: 1,320 logic elements and 16,000 typical gates provide a balance between capacity and cost for control and interfacing tasks.
- Robust I/O Control: Individual tri-state enables and programmable slew-rate let you tailor signal behavior to reduce noise and meet board-level timing.
- Deterministic Interconnect: FastTrack routing, dedicated carry and cascade chains, and low-skew global paths simplify timing closure for arithmetic and synchronous logic.
- Proven Testability: Built-in JTAG boundary-scan and 100% functional testing streamline board-level validation and manufacturing test.
- Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of consumer and industrial control electronics.
Why Choose EPF6016QC208-2N?
The EPF6016QC208-2N combines FLEX 6000 family architecture with a mid-density logic fabric and extensive I/O to deliver a practical, reprogrammable solution for prototyping, interface logic, and control applications. Its OptiFLEX/LUT-based architecture, dedicated routing resources, and family-level software support make it appropriate for design teams seeking predictable routing behavior and straightforward place-and-route flow.
With a 208-pin surface-mount package, 5.0 V supply compatibility, and commercial operating range, this device is suited to systems that require reliable, reprogrammable logic while maintaining compact board layout and standard manufacturing processes. The device’s built-in test features and RoHS compliance support efficient production and deployment.
Request a quote or submit a pricing inquiry to evaluate the EPF6016QC208-2N for your next design project.

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