EPF6016QC208-2N

IC FPGA 171 I/O 208QFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 171 1320 208-BFQFP

Quantity 753 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O171Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016QC208-2N – FLEX 6000 FPGA, 16,000 gates, 171 I/O, 208-BFQFP

The EPF6016QC208-2N is a member of the FLEX 6000 programmable logic family, offering a register-rich, LUT-based architecture optimized for low-cost, reprogrammable logic implementations. With approximately 16,000 gates implemented across 1,320 logic elements and 171 general-purpose I/O pins in a 208-pin surface-mount package, this device targets prototyping, design testing, and mid-density glue-logic or control applications where in-system flexibility and fast design iteration matter.

Built on the OptiFLEX architecture and supplied as a commercial-grade 5.0 V device, the EPF6016QC208-2N supports in-circuit reconfigurability, standardized JTAG boundary-scan, and a suite of I/O and interconnect features that simplify board-level integration and design reuse.

Key Features

  • Logic Density — Approximately 16,000 typical gates implemented as 1,320 logic elements, providing a mid-density programmable fabric for control, interface, and glue-logic functions.
  • Flexible I/O — 171 I/O pins with individual tri-state output-enable control and programmable output slew-rate control for reduced switching noise and flexible board interfacing.
  • Package & Mounting — 208-pin BFQFP package (208-PQFP footprint, 28×28) in a surface-mount form factor suitable for compact PCB layouts.
  • Power & Voltage — 5.0 V device with a specified supply range of 4.75 V to 5.25 V to support legacy 5 V systems and board-level power domains.
  • Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operating temperature.
  • Architecture & Interconnect — OptiFLEX architecture with FastTrack continuous routing, dedicated carry and cascade chains for arithmetic and high-fan-in logic functions, and four low-skew global paths for clock or control signals.
  • System-level Features — In-circuit reconfigurability via an external configuration device or controller, built-in IEEE 1149.1 JTAG boundary-scan circuitry, and support for bridging systems with different I/O voltages through MultiVolt I/O operation.
  • Test & Reliability — 100% functional testing prior to shipment to simplify board bring-up and reduce field failures.
  • Development Ecosystem — Family-level support for automatic place-and-route and software-based design flows as described in the FLEX 6000 documentation.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Prototyping & Development — Rapid hardware iteration, functional validation, and design testing where reprogrammability and fast changes are required.
  • Gate-Array Replacement — Low-cost, reprogrammable alternative to fixed gate-array designs for mid-volume production and design evolution.
  • Peripheral & Bus Interfaces — 5.0 V compatibility and flexible I/O make the device suitable for implementing PCI-compliant peripheral logic and other 5 V interface bridges.
  • Control & Glue Logic — Custom state machines, interface glue, and embedded control functions that benefit from dedicated carry/cascade chains and abundant I/O.

Unique Advantages

  • Reprogrammable Flexibility: In-circuit reconfigurability enables on-board updates and functional changes without replacing hardware.
  • Mid-Density Integration: 1,320 logic elements and 16,000 typical gates provide a balance between capacity and cost for control and interfacing tasks.
  • Robust I/O Control: Individual tri-state enables and programmable slew-rate let you tailor signal behavior to reduce noise and meet board-level timing.
  • Deterministic Interconnect: FastTrack routing, dedicated carry and cascade chains, and low-skew global paths simplify timing closure for arithmetic and synchronous logic.
  • Proven Testability: Built-in JTAG boundary-scan and 100% functional testing streamline board-level validation and manufacturing test.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C, suitable for a wide range of consumer and industrial control electronics.

Why Choose EPF6016QC208-2N?

The EPF6016QC208-2N combines FLEX 6000 family architecture with a mid-density logic fabric and extensive I/O to deliver a practical, reprogrammable solution for prototyping, interface logic, and control applications. Its OptiFLEX/LUT-based architecture, dedicated routing resources, and family-level software support make it appropriate for design teams seeking predictable routing behavior and straightforward place-and-route flow.

With a 208-pin surface-mount package, 5.0 V supply compatibility, and commercial operating range, this device is suited to systems that require reliable, reprogrammable logic while maintaining compact board layout and standard manufacturing processes. The device’s built-in test features and RoHS compliance support efficient production and deployment.

Request a quote or submit a pricing inquiry to evaluate the EPF6016QC208-2N for your next design project.

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