EPF6016BC256-3N

The EPF6016BC256-3N is a member of the FLEX 6000 programmable logic device family, offering a register-rich, look-up table (LUT) based architecture optimized for low-cost gate array replacement and rapid prototyping. Built on the OptiFLEX architecture, this 5.0‑V device provides in-circuit reconfigurability and a set of system-level and I/O features suited for design testing, PCI-based boards, and general-purpose digital logic integration.

Key value comes from its 1,320 logic elements and approximately 16,000 typical gates, combined with a 204-pin I/O footprint in a 256-ball BGA package, enabling compact, surface-mount implementations for commercial-grade applications operating from 0 °C to 85 °C.

Key Features

• Core Architecture  Register-rich, LUT-based OptiFLEX architecture providing approximately 16,000 typical gates and 1,320 logic elements for flexible digital logic implementation.
• I/O and Signal Control  Up to 204 I/O pins with individual tri-state output-enable control and programmable output slew-rate to manage switching noise and interface timing.
• Clock and Timing  Built-in low-skew clock distribution tree and fast path from register to I/O pin to support predictable clock-to-output timing.
• Interconnect and Arithmetic Support  Dedicated carry and cascade chains for efficient arithmetic functions and high-fan-in logic, plus the FastTrack interconnect for predictable routing delays.
• System-Level Features  In-circuit reconfigurability (ICR) via an external configuration device or intelligent controller, and built-in IEEE Std. 1149.1 JTAG boundary-scan for board-level test.
• Power and Supply  Device supply range 4.75 V to 5.25 V (5.0‑V device) suitable for systems compliant with common 5-V bus requirements; low standby current behavior described in family documentation.
• Package and Mounting  256-ball LBGA / 256-BGA (27 × 27 mm) surface-mount package for compact board layouts and reliable soldered connections.
• Memory  No embedded RAM bits (Total RAM Bits: 0); design implementations should account for external memory if required.
• Compliance and Grade  Commercial grade device with RoHS compliance; device operating range 0 °C to 85 °C.

Typical Applications

• Gate-array replacement and prototyping  Use as a low-cost, reprogrammable alternative to high-volume gate array designs for rapid design iteration and validation.
• PCI-based board designs  As a 5.0‑V FLEX 6000 device, suitable for designs targeting PCI Local Bus environments where a 5-V interface is required.
• Glue logic and I/O bridging  204 programmable I/O pins and MultiVolt I/O capability enable bridging and interfacing between systems operating at different voltages.
• Design testing and in-system reconfiguration  In-circuit reconfigurability supports field updates and iterative testing without board rework.

Unique Advantages

• Flexible, reprogrammable platform: OptiFLEX LUT-based architecture and in-circuit reconfiguration let you change logic functionality during prototyping and after deployment.
• High logic density for compact designs: 1,320 logic elements and approximately 16,000 gates deliver substantial logic capacity in a 256-BGA footprint.
• Robust I/O control: Individual tri-state enables and programmable slew-rate control simplify signal integrity and board-level interface design.
• Built-in board test support: IEEE 1149.1 JTAG boundary-scan integration enables device-level testing without consuming user logic.
• Commercial-grade reliability with RoHS compliance: Surface-mount 256-LBGA package and RoHS status support modern manufacturing and regulatory requirements.
• Predictable routing and arithmetic support: FastTrack interconnect and dedicated carry/cascade chains reduce design effort for adders, counters, and high-fan-in logic.

Why Choose EPF6016BC256-3N?

The EPF6016BC256-3N positions itself as a practical, commercial-grade FPGA choice for teams needing a reprogrammable, compact solution with substantial logic capacity and extensive I/O. Its OptiFLEX architecture and family-level features such as built-in JTAG and in-circuit reconfiguration make it well suited for prototyping, board-level logic integration, and PCI 5-V system designs.

For design teams and procurement managers, this device offers a balance of integration, reconfigurability, and package density that supports iterative development and simplifies board-level interfacing while aligning with modern assembly and RoHS requirements.

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