EPF6016ATC144-3N

IC FPGA 117 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 117 1320 144-LQFP

Quantity 751 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O117Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs132Number of Logic Elements/Cells1320
Number of Gates16000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of EPF6016ATC144-3N – FLEX 6000 FPGA IC, 117 I/O, 1,320 Logic Elements, 144-LQFP

The EPF6016ATC144-3N is a FLEX 6000 family field-programmable gate array (FPGA) provided by Intel. Based on a register-rich, lookup-table (LUT) architecture and the OptiFLEX layout, this device offers a reconfigurable SRAM-based implementation suitable for prototype and low-cost production designs.

With 1,320 logic elements (approximately 16,000 typical gates) and 117 user I/O pins in a 144-pin LQFP package, the EPF6016ATC144-3N targets commercial applications requiring flexible logic integration, in-circuit reconfigurability and predictable I/O control over a standard commercial operating range.

Key Features

  • Core Logic  1,320 logic elements and a typical gate count of 16,000 provide programmable combinational and sequential logic capacity for glue logic, state machines and custom processing functions.
  • OptiFLEX Architecture  OptiFLEX layout and a register-rich LUT-based architecture increase area efficiency and support fast design iteration through reconfigurable SRAM elements.
  • I/O and Signal Control  117 user I/O pins with individual tri-state output enable control and programmable output slew-rate to manage switching noise and interface timing.
  • Routing and Arithmetic Support  FastTrack interconnect, dedicated carry and cascade chains enable efficient implementation of arithmetic functions, adders, counters and high-fan-in logic structures.
  • System-Level Capabilities  In-circuit reconfigurability (ICR) via an external configuration device or intelligent controller and built-in IEEE 1149.1 JTAG boundary-scan for board-level testability.
  • Clocking and Global Signals  Built-in low-skew clock distribution tree and four low-skew global paths for clock, clear, preset or logic signals to support synchronous designs.
  • Electrical & Packaging  Commercial-grade, surface-mount 144-LQFP package (supplier package: 144-TQFP, 20×20 mm) with supply voltage range 3.0 V to 3.6 V and operating temperature 0 °C to 85 °C.
  • Quality and Compliance  100% functional testing before shipment and RoHS compliance for environmental compatibility.

Typical Applications

  • Prototyping and Design Validation  Reconfigurable SRAM elements and in-circuit reconfiguration make the device suitable for rapid prototyping and iterative design testing.
  • Interface and Glue Logic  Use the programmable I/O and per-pin control to implement protocol bridging, bus interfacing and custom peripheral handlers.
  • Embedded Control and State Machines  The register-rich LUT architecture and dedicated arithmetic chains are well suited for control logic, finite-state machines and real-time decision logic.
  • Board-Level Test and Debug  Built-in JTAG boundary-scan simplifies board-level testing and manufacturing diagnostics without consuming user logic.

Unique Advantages

  • Balanced Logic Density: 1,320 logic elements (≈16,000 typical gates) provide a predictable capacity for mid-density programmable designs.
  • Flexible I/O Management: 117 I/O pins with individual tri-state and slew-rate control reduce external buffering and simplify interface timing control.
  • In-Circuit Reconfigurability: Support for ICR via external configuration devices enables field updates and functional changes after deployment.
  • Deterministic Routing: FastTrack interconnect and dedicated carry/cascade chains yield efficient placement of arithmetic and high-fan-in logic, improving performance predictability.
  • Commercial Temperature and Supply Range: Designed for 3.0 V to 3.6 V operation and 0 °C to 85 °C ambient, matching standard commercial embedded applications.
  • Testability and Compliance: IEEE 1149.1 JTAG boundary-scan and 100% functional testing support manufacturing yield and board-level diagnostics.

Why Choose EPF6016ATC144-3N?

The EPF6016ATC144-3N positions itself as a flexible, commercially graded FPGA option for designers who need mid-range programmable logic density, robust I/O control and the ability to reconfigure designs in-circuit. Its OptiFLEX/LUT architecture and dedicated routing features make it suitable for prototyping, interface logic and embedded control tasks where predictable routing and arithmetic support matter.

With a standard 144-LQFP footprint, RoHS compliance, and full device testing, this part delivers a practical combination of integration, testability and field flexibility for commercial embedded systems and production designs that rely on in-place reprogrammability and board-level diagnostics.

Request a quote or submit a purchase request today to evaluate the EPF6016ATC144-3N for your next programmable logic design.

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