EPF6010ATC144-2

IC FPGA 102 I/O 144TQFP
Part Description

FLEX 6000 Field Programmable Gate Array (FPGA) IC 102 880 144-LQFP

Quantity 830 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time14 Weeks
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeCommercialOperating Temperature0°C – 85°C
Package / Case144-LQFPNumber of I/O102Voltage3 V - 3.6 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs88Number of Logic Elements/Cells880
Number of Gates10000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF6010ATC144-2 – FLEX 6000 Field Programmable Gate Array (FPGA) IC 102 880 144-LQFP

The EPF6010ATC144-2 is a FLEX 6000-series Field Programmable Gate Array (FPGA) from Intel, delivered in a 144-LQFP package. It provides a defined logic resource set and a high pin-count I/O footprint for commercial embedded designs requiring configurable digital logic.

Key electrical and environmental characteristics include operation from a 3.0 V to 3.6 V supply and a commercial operating temperature range of 0°C to 85°C. Package and thermal resistance details are documented in the manufacturer's mature-device package information.

Key Features

  • Core Logic Capacity 880 logic elements (cells) organized across 88 logic array blocks, enabling predictable resource allocation for custom logic implementations.
  • On-chip Memory Total RAM bits: 0 — the device provides logic fabric without embedded RAM resources.
  • I/O Count 102 general-purpose I/O pins to support external peripherals and signal interfacing.
  • Gate Equivalence Equivalent to 10,000 gates for sizing and integration planning in legacy gate-count terms.
  • Power Operates from a 3.0 V to 3.6 V supply, compatible with common commercial power rails.
  • Package & Mounting 144-LQFP package (supplier device package: 144-TQFP, 20×20) with surface-mount mounting for standard PCB assembly.
  • Operating Temperature Commercial-grade operation from 0°C to 85°C.
  • Compliance RoHS-compliant for lead-free manufacturing.
  • Manufacturer Documentation Package outlines and thermal resistance data are provided in the manufacturer's package information datasheet for mature Altera devices.

Typical Applications

  • Commercial embedded systems Implement configurable digital functions and control logic for commercial equipment operating within the 0°C–85°C range.
  • Prototyping and evaluation Use the 144-LQFP package and accessible I/O count to prototype and validate custom logic designs on development boards.
  • Interface bridging and I/O expansion Aggregate signals, perform protocol glue logic, or expand peripheral connectivity using the 102 I/O pins.
  • Control and sequencing for commercial devices Implement deterministic control state machines and sequencing logic for consumer or commercial products.

Unique Advantages

  • Compact, high I/O package: 102 available I/Os in a 144-LQFP surface-mount package help reduce board area while preserving connectivity.
  • Predictable logic resources: 880 logic elements across 88 logic array blocks enable clear design sizing and resource planning.
  • Common power-rail compatibility: 3.0 V to 3.6 V operation aligns with standard commercial power designs.
  • Commercial temperature rating: 0°C to 85°C supports a wide range of non-industrial, commercial deployments.
  • RoHS-compliant: Supports lead-free manufacturing workflows.
  • Documented package and thermal data: Manufacturer-provided package information and thermal resistance guidance aid PCB layout and thermal planning.

Why Choose EPF6010ATC144-2?

The EPF6010ATC144-2 offers a compact, commercially rated FPGA option with a clear logic footprint (880 logic elements) and a substantial I/O count (102 pins) in a 144-LQFP surface-mount package. Its 3.0 V–3.6 V supply range and RoHS compliance make it appropriate for cost-sensitive commercial designs where configurable logic and flexible interfacing are required.

This part is well suited for designers needing a predictable, documented FPGA platform for prototyping, glue logic, or control tasks in commercial applications, backed by manufacturer package and thermal documentation for integration and production planning.

If you would like pricing, availability, or to request a quote for EPF6010ATC144-2, submit an inquiry or request a quote and our team will respond with the required procurement details.

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