EPF6010ATC144-3

The EPF6010ATC144-3 is a FLEX 6000 family FPGA supplied in a 144-pin LQFP/TQFP footprint. Based on the OptiFLEX register-rich, LUT-based architecture, this device is positioned as a low-cost, reconfigurable alternative to gate-array implementations for prototyping, design testing, and moderate-complexity logic integration.

With 880 logic elements (approximately 10,000 typical gates), 102 I/O pins, and support for in-circuit reconfiguration and IEEE 1149.1 JTAG boundary-scan, the EPF6010ATC144-3 targets applications that require flexible logic, configurable I/O control, and straightforward board-level integration within commercial temperature ranges.

Key Features

• Core architecture OptiFLEX, LUT-based, register-rich architecture providing a compact, routable FPGA fabric suitable for replacing low- to mid-density gate-array designs.
• Logic capacity 880 logic elements (typical ≈ 10,000 gates) for implementing combinational and sequential logic.
• I/O and interfacing 102 general-purpose I/O pins with individual tri-state output enable control and programmable output slew-rate to manage signal integrity and interface timing.
• Configuration & test Supports in-circuit reconfigurability via external configuration device or intelligent controller; built-in IEEE 1149.1 JTAG boundary-scan circuitry for board-level test and visibility (note: embedded JTAG logic may add up to 14,000 gates).
• Dedicated arithmetic & logic support Dedicated carry and cascade chains for efficient implementation of adders, counters, comparators and high-fan-in logic structures.
• Clocking & interconnect Built-in low-skew clock distribution with four low-skew global paths and FastTrack continuous routing structure for predictable interconnect delays.
• Memory 0 total RAM bits on-chip (no embedded RAM).
• Power & supply Supply voltage range 3.0 V to 3.6 V; family-level features include low standby current characteristics.
• Package & mounting Surface-mount 144-pin LQFP package (supplier device package listed as 144-TQFP, 20 × 20 mm) for compact board-level integration.
• Operating range & compliance Commercial grade with operating temperature 0 °C to 85 °C; RoHS compliant.

Typical Applications

• Prototyping and design validation Reconfigurable SRAM-based architecture and in-circuit reconfiguration enable rapid iteration during prototype and test cycles.
• Gate-array replacement Low-cost programmable alternative for applications that previously used fixed gate-array logic, enabling late-stage design changes without mask respins.
• I/O bridging and interface logic Multi-voltage I/O support and 102 user I/Os make the device suitable for bridging modules and handling board-level glue logic.
• Arithmetic and control blocks Dedicated carry and cascade chains simplify implementation of adders, counters, and high-fan-in control logic.

Unique Advantages

• Reprogrammable flexibility: SRAM-based device architecture with in-circuit reconfiguration lets designers update functionality without hardware changes.
• Compact, efficient fabric: OptiFLEX architecture reduces die area while retaining routability, helping contain BOM and board space for mid-density logic functions.
• Comprehensive I/O control: Per-pin tri-state enable and programmable slew-rate enable precise control of signal behavior for varied interface requirements.
• Built-in test support: IEEE 1149.1 JTAG boundary-scan is integrated for board-level test access without consuming user logic resources.
• Predictable timing: Low-skew clock distribution and continuous routing structure support deterministic timing for synchronous designs.
• Pin- and footprint-friendly: Available in a 144-pin TQFP/LQFP package for easy integration into compact PCB layouts.

Why Choose EPF6010ATC144-3?

The EPF6010ATC144-3 delivers a balance of reprogrammability, I/O flexibility, and moderate logic density in a compact, commercial-grade package. Its OptiFLEX architecture and dedicated arithmetic resources make it well suited for engineers replacing gate-array designs, iterating prototypes, or consolidating glue logic and control functions on a single device.

This device is a practical choice for design teams seeking a verified, reconfigurable FPGA solution with industry-standard JTAG test support, a broad set of I/O controls, and straightforward integration into 3.3 V designs within commercial temperature ranges.

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