EPF81500AQC240-3N

IC FPGA 181 I/O 240QFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 181 1296 240-BFQFP

Quantity 1,402 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package240-PQFP (32x32)GradeCommercialOperating Temperature0°C – 70°C
Package / Case240-BFQFPNumber of I/O181Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs162Number of Logic Elements/Cells1296
Number of Gates16000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81500AQC240-3N – FLEX 8000 FPGA IC, 1,296 Logic Elements, 181 I/O, 240-BFQFP

The EPF81500AQC240-3N is a member of the FLEX 8000 programmable logic device family, designed as a low-cost, register-rich FPGA implemented on an advanced SRAM process. It delivers a predictable interconnect structure and a mix of logic density and I/O capability suited for control, bus-interface, and data-manipulation applications.

Targeted at commercial-grade embedded designs, this device combines 1,296 logic elements (approximately 16,000 usable gates) with 181 user I/O pins in a 240-pin BFQFP surface-mount package, supporting 5.0 V core operation and in-circuit reconfigurability options for flexible system integration.

Key Features

  • Core architecture Fabricated on an advanced SRAM process with compact 4-input look-up tables and programmable registers providing a register-rich logic fabric.
  • Logic capacity Approximately 16,000 usable gates and 1,296 logic elements supporting up to 1,500 flip-flops for wide-data-path and control logic implementations.
  • I/O and package 181 user I/O pins in a 240-BFQFP (supplier package: 240-PQFP 32×32) surface-mount package, enabling integration of multiple buses and peripheral interfaces.
  • Power and supply Single voltage supply range from 4.75 V to 5.25 V; low-power standby behavior (typical standby current ≤ 0.5 mA as noted for the family).
  • System-level features Supports in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller and family-level compliance with PCI Local Bus Specification Revision 2.2 for 5.0-V operation.
  • Interconnect and arithmetic support FastTrack® continuous routing structure with dedicated carry and cascade chains for efficient arithmetic, counters, and high-fan-in logic functions.
  • Signal integrity controls Programmable output slew-rate control to reduce switching noise and tri-state emulation for internal tri-state nets.
  • Commercial operating range Rated for 0 °C to 70 °C operation and RoHS compliant for environmental conformance.

Typical Applications

  • Bus interfaces and system glue Use as a compact logic hub for TTL integration, peripheral bridging, and multi-bus aggregation where predictable timing and plentiful I/O are required.
  • High-speed controllers Implement control logic for embedded controllers and coprocessor functions that benefit from dedicated carry/cascade chains and dense register resources.
  • Data transformation and DSP support Suitable for wide-data-path manipulation and data transformation tasks that leverage the device's abundant flip-flops and LUT-based logic.
  • Prototype and production reconfigurable designs In-circuit reconfigurability enables field updates and design iteration without board-level changes.

Unique Advantages

  • Balanced logic density and I/O: 1,296 logic elements and 181 I/O pins provide a practical trade-off for designs that need moderate logic resources with high external connectivity.
  • Predictable routing: FastTrack® continuous routing structure reduces variability in interconnect delays, simplifying timing closure for complex logic.
  • Built for system integration: Family-level PCI 5.0-V compliance and ICR support ease integration into board-level systems and enable in-field reconfiguration.
  • Low-power standby: Typical standby current in the family is 0.5 mA or less, supporting designs that require low-power idle states.
  • Standard surface-mount packaging: 240-BFQFP surface-mount package (240-PQFP 32×32 supplier variant) simplifies PCB assembly and supports multi-layer board designs.
  • RoHS compliant: Meets environmental compliance requirements for lead-free assembly processes.

Why Choose EPF81500AQC240-3N?

The EPF81500AQC240-3N positions itself as a practical, commercially graded programmable logic device for embedded and system designers who need a mix of logic density, abundant I/O, and flexible system integration. As part of the FLEX 8000 family, it brings SRAM-based programmability, dedicated arithmetic chains, and predictable routing to applications such as bus interfaces, controllers, and data transformation blocks.

Supported by the family’s established development flow and proven architectural features, this device is suited to teams seeking a scalable, reconfigurable logic component that balances performance, integration, and environmental compliance for commercial embedded products.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for EPF81500AQC240-3N.

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