EPF81500ARC240-3

The EPF81500ARC240-3 is a FLEX 8000 family programmable logic device offering 1,296 logic elements and a density of approximately 16,000 usable gates in a 240‑pin BFQFP exposed‑pad package. Built on the FLEX 8000 architecture, it combines fine‑grained logic elements with fast, predictable interconnect for register‑rich designs requiring multiple I/O and medium‑to‑high logic density.

Targeted at commercial applications, this device supports 181 user I/O pins, standard 5 V supply operation (4.75 V to 5.25 V) and a commercial operating temperature range of 0 °C to 70 °C, making it suitable for bus interfaces, controller logic and other system‑level programmable functions.

Key Features

• Core & Logic 1,296 logic elements (LEs) providing a register‑rich implementation model and approximately 16,000 usable gates for medium‑density programmable logic functions.
• Logic Array Blocks 162 logic array blocks (LABs) supporting compact 4‑input look‑up tables and programmable registers for deterministic logic mapping.
• I/O and Voltage Support 181 user I/O pins with MultiVolt™ I/O interface capability described in the FLEX 8000 family documentation; device supply range is 4.75 V to 5.25 V.
• Interconnect & Arithmetic FastTrack® continuous routing architecture and dedicated carry/cascade chains (documented for the FLEX 8000 family) to support efficient arithmetic, counters and high‑fan‑in logic.
• Configuration & System Features Supports in‑circuit reconfigurability via external configuration devices or an intelligent controller, and the FLEX 8000 family includes JTAG boundary‑scan test (BST) circuitry on selected devices.
• Package & Mounting Surface‑mount 240‑BFQFP package with exposed pad (supplier device package: 240‑RQFP 32×32) for board‑level thermal/mechanical integration.
• Environmental & Compliance Commercial grade operation (0 °C to 70 °C) and RoHS compliance as indicated in the product data.
• On‑chip Memory Total on‑chip RAM bits: 0, enabling designers to plan external memory or register usage accordingly.

Typical Applications

• Bus Interfaces: Implement multi‑bus bridging and protocol glue logic where multiple 32‑bit buses or bus aggregation is required.
• High‑Speed Controllers: Integrate control logic and timing‑critical state machines leveraging the device’s dedicated carry/cascade resources and continuous routing.
• Coprocessor & Glue Logic: Offload custom processing tasks or implement peripheral integration and TTL‑level interfacing in system designs.
• DSP & Data Transformation: Use the high register count and LE fabric for wide‑data‑path manipulation, simple DSP pipelines, and data formatting tasks.

Unique Advantages

• Medium‑to‑High Logic Density: 1,296 LEs and approximately 16,000 usable gates provide substantial logic capacity for complex control and glue logic without moving to larger FPGA families.
• High I/O Count: 181 user I/O pins allow integration of multiple buses, peripherals and interfaces directly to the device, reducing external glue components.
• Family‑Level System Features: FLEX 8000 family features such as in‑circuit reconfigurability and JTAG BST (on selected devices) simplify board‑level debug and field updates.
• Predictable Routing Architecture: FastTrack® continuous routing and dedicated arithmetic chains enable predictable timing for arithmetic and wide combinational logic.
• Commercial‑Grade Simplicity: 5 V supply operation (4.75 V–5.25 V) and a 0 °C–70 °C operating range make the device straightforward to deploy in standard commercial applications.
• RoHS Compliant: Conforms to RoHS requirements for lead‑free assembly and regulatory alignment in commercial product builds.

Why Choose EPF81500ARC240-3?

The EPF81500ARC240-3 positions itself as a flexible, register‑rich programmable logic solution for commercial systems that require substantial logic resources and a high I/O count in a surface‑mount BFQFP package. Its FLEX 8000 architecture provides deterministic routing and dedicated arithmetic support that simplify implementation of bus interfaces, controllers and data‑path logic.

Designers benefit from the family’s system‑level capabilities—such as in‑circuit reconfigurability and documented software design support—while maintaining predictable supply and thermal requirements. This part is well suited to customers integrating multiple buses, coprocessor logic or medium‑density programmable functions where commercial grade operation and RoHS compliance are required.

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