EPF8282ALC84-2
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 68 208 84-LCC (J-Lead) |
|---|---|
| Quantity | 114 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 84-PLCC (29.31x29.31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 84-LCC (J-Lead) | Number of I/O | 68 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 26 | Number of Logic Elements/Cells | 208 | ||
| Number of Gates | 2500 | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF8282ALC84-2 – FLEX 8000 FPGA IC, 208 Logic Elements, 84‑LCC (J‑Lead)
The EPF8282ALC84-2 is a FLEX 8000 family Field Programmable Gate Array (FPGA) offered in an 84‑lead PLCC (J‑Lead) surface‑mount package. It provides a mid‑density, register‑rich programmable logic solution with 208 logic elements (LEs) organized into 26 LABs, making it suitable for control logic, bus interfacing, and glue‑logic integration in commercial applications.
Designed for 5.0 V systems (4.75 V to 5.25 V supply) and commercial temperature operation (0 °C to 70 °C), the device delivers predictable interconnect behavior and system-level features from the FLEX 8000 family, including dedicated arithmetic chains and design tool support for rapid integration.
Key Features
- Core logic and architecture 208 logic elements arranged in 26 LABs with compact 4‑input LUTs and programmable registers for combinational and sequential logic implementation.
- Logic density & resources Approximately 2,500 usable gates and 282 flip‑flops provide a mid‑density fabric for control, protocol bridging, and glue‑logic functions.
- I/O capability 68 user I/O pins suitable for medium‑pin-count applications; family MultiVolt I/O features enable core operation at 5.0 V with I/O compatibility across common logic levels (family characteristic).
- System‑level features FLEX 8000 family includes in‑circuit reconfigurability options, dedicated carry and cascade chains for fast arithmetic and high‑fan‑in logic, and boundary‑scan (JTAG) support on selected devices.
- Power and supply Single 5.0 V supply operation (4.75 V to 5.25 V) aligns with legacy TTL/5 V systems and simplifies integration into existing boards.
- Package & mounting 84‑lead PLCC (J‑Lead) surface‑mount package (84‑LCC), supplier device package 84‑PLCC with dimensions 29.31 × 29.31 mm.
- Memory No embedded on‑chip RAM (total RAM bits: 0), focusing the device on register and logic‑centric designs.
- Environmental and grade Commercial grade device with operating range 0 °C to 70 °C and RoHS compliance.
Typical Applications
- Bus interfaces Integration of medium‑complexity bus bridging and protocol glue logic where predictable interconnect and multiple I/O are required.
- TTL integration and glue logic Replacement or consolidation of discrete TTL logic to simplify BOM and board routing in 5 V systems.
- Coprocessor and control functions Implement control state machines, peripheral controllers, and offload functions using the device’s register resources and arithmetic chains.
- High‑speed controllers Use in medium‑speed controller applications that benefit from dedicated carry/cascade chains and the FLEX 8000 continuous routing structure.
- Data transformation and DSP‑adjacent logic Suitable for wide‑data‑path manipulation and data formatting where on‑chip RAM is not required.
Unique Advantages
- Mid‑density programmable fabric: 208 LEs and 26 LABs provide a balanced capacity for consolidating control and interface logic without excess complexity.
- Predictable interconnect: FLEX 8000 continuous routing structure supports consistent timing behavior for faster design closure.
- Dedicated arithmetic chains: Built‑in carry and cascade chains accelerate adders, counters, and high‑fan‑in logic implementations without extra routing overhead.
- 5 V system compatibility: 4.75 V to 5.25 V supply and family I/O characteristics ease migration or integration into existing 5 V boards.
- Package flexibility for board design: 84‑lead PLCC (J‑Lead) surface‑mount package fits legacy sockets and common PCB footprints where a compact PLCC is preferred.
- RoHS compliant: Meets RoHS requirements for lead‑free assembly and regulatory alignment in commercial products.
Why Choose EPF8282ALC84-2?
The EPF8282ALC84-2 positions itself as a practical mid‑density FLEX 8000 FPGA option for designers seeking to consolidate control logic, bus interfaces, and peripheral glue logic in a compact PLCC package. Its 208 logic elements, 68 I/O pins, and dedicated arithmetic resources deliver capability for a wide range of commercial applications that operate on a 5 V supply.
Backed by FLEX 8000 family architecture and development tool support, this device is appropriate for teams needing predictable interconnect behavior, in‑circuit configurability options, and a commercially rated, RoHS‑compliant FPGA for long‑term production designs.
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