EPF8282ALC84-2

IC FPGA 68 I/O 84PLCC
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 68 208 84-LCC (J-Lead)

Quantity 114 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package84-PLCC (29.31x29.31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case84-LCC (J-Lead)Number of I/O68Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ALC84-2 – FLEX 8000 FPGA IC, 208 Logic Elements, 84‑LCC (J‑Lead)

The EPF8282ALC84-2 is a FLEX 8000 family Field Programmable Gate Array (FPGA) offered in an 84‑lead PLCC (J‑Lead) surface‑mount package. It provides a mid‑density, register‑rich programmable logic solution with 208 logic elements (LEs) organized into 26 LABs, making it suitable for control logic, bus interfacing, and glue‑logic integration in commercial applications.

Designed for 5.0 V systems (4.75 V to 5.25 V supply) and commercial temperature operation (0 °C to 70 °C), the device delivers predictable interconnect behavior and system-level features from the FLEX 8000 family, including dedicated arithmetic chains and design tool support for rapid integration.

Key Features

  • Core logic and architecture 208 logic elements arranged in 26 LABs with compact 4‑input LUTs and programmable registers for combinational and sequential logic implementation.
  • Logic density & resources Approximately 2,500 usable gates and 282 flip‑flops provide a mid‑density fabric for control, protocol bridging, and glue‑logic functions.
  • I/O capability 68 user I/O pins suitable for medium‑pin-count applications; family MultiVolt I/O features enable core operation at 5.0 V with I/O compatibility across common logic levels (family characteristic).
  • System‑level features FLEX 8000 family includes in‑circuit reconfigurability options, dedicated carry and cascade chains for fast arithmetic and high‑fan‑in logic, and boundary‑scan (JTAG) support on selected devices.
  • Power and supply Single 5.0 V supply operation (4.75 V to 5.25 V) aligns with legacy TTL/5 V systems and simplifies integration into existing boards.
  • Package & mounting 84‑lead PLCC (J‑Lead) surface‑mount package (84‑LCC), supplier device package 84‑PLCC with dimensions 29.31 × 29.31 mm.
  • Memory No embedded on‑chip RAM (total RAM bits: 0), focusing the device on register and logic‑centric designs.
  • Environmental and grade Commercial grade device with operating range 0 °C to 70 °C and RoHS compliance.

Typical Applications

  • Bus interfaces Integration of medium‑complexity bus bridging and protocol glue logic where predictable interconnect and multiple I/O are required.
  • TTL integration and glue logic Replacement or consolidation of discrete TTL logic to simplify BOM and board routing in 5 V systems.
  • Coprocessor and control functions Implement control state machines, peripheral controllers, and offload functions using the device’s register resources and arithmetic chains.
  • High‑speed controllers Use in medium‑speed controller applications that benefit from dedicated carry/cascade chains and the FLEX 8000 continuous routing structure.
  • Data transformation and DSP‑adjacent logic Suitable for wide‑data‑path manipulation and data formatting where on‑chip RAM is not required.

Unique Advantages

  • Mid‑density programmable fabric: 208 LEs and 26 LABs provide a balanced capacity for consolidating control and interface logic without excess complexity.
  • Predictable interconnect: FLEX 8000 continuous routing structure supports consistent timing behavior for faster design closure.
  • Dedicated arithmetic chains: Built‑in carry and cascade chains accelerate adders, counters, and high‑fan‑in logic implementations without extra routing overhead.
  • 5 V system compatibility: 4.75 V to 5.25 V supply and family I/O characteristics ease migration or integration into existing 5 V boards.
  • Package flexibility for board design: 84‑lead PLCC (J‑Lead) surface‑mount package fits legacy sockets and common PCB footprints where a compact PLCC is preferred.
  • RoHS compliant: Meets RoHS requirements for lead‑free assembly and regulatory alignment in commercial products.

Why Choose EPF8282ALC84-2?

The EPF8282ALC84-2 positions itself as a practical mid‑density FLEX 8000 FPGA option for designers seeking to consolidate control logic, bus interfaces, and peripheral glue logic in a compact PLCC package. Its 208 logic elements, 68 I/O pins, and dedicated arithmetic resources deliver capability for a wide range of commercial applications that operate on a 5 V supply.

Backed by FLEX 8000 family architecture and development tool support, this device is appropriate for teams needing predictable interconnect behavior, in‑circuit configurability options, and a commercially rated, RoHS‑compliant FPGA for long‑term production designs.

Request a quote or submit an inquiry to check availability, pricing, and lead time for EPF8282ALC84-2.

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