EPF8282ATC100-2

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 376 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ATC100-2 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

The EPF8282ATC100-2 is a member of the FLEX 8000 programmable logic device family, offering a register-rich CMOS architecture optimized for medium-density programmable logic tasks. Designed for commercial applications, this device provides a balance of logic density, I/O count and package compactness for control, interface and data-path functions.

The FLEX 8000 family combines fine-grained logic elements with predictable routing to support bus interfaces, TTL integration, coprocessor functions, high-speed controllers and DSP-style data manipulation. The EPF8282ATC100-2 delivers this capability in a 100-pin TQFP (14×14 mm) surface-mount package with RoHS compliance.

Key Features

  • Core & Logic 208 logic elements implemented across 26 logic array blocks (LABs) providing approximately 2,500 usable gates and 282 flip-flops for register-rich designs.
  • I/O Up to 78 user I/O pins in a 100-TQFP package, enabling multiple peripheral and bus connections on a compact board footprint.
  • Package & Mounting 100-TQFP (14×14 mm) surface-mount package suitable for space-constrained PCBs.
  • Power Single VCC supply range of 4.75 V to 5.25 V for 5.0 V system compatibility.
  • Operating Range Commercial temperature grade with an operating range of 0 °C to 70 °C.
  • Family System Features FLEX 8000 family capabilities include in-circuit reconfigurability (ICR), built-in JTAG boundary-scan test on selected devices, MultiVolt™ I/O compatibility (supporting 5.0 V core operation with I/O levels compatible with 5.0 V and 3.3 V), and programmable output slew-rate control to reduce switching noise.
  • Dedicated Arithmetic Resources Family-level dedicated carry and cascade chains implement fast adders, counters and high-fan-in logic, automatically leveraged by design tools and megafunctions.
  • Standby Power FLEX 8000 devices are specified for low standby power—the family lists typical standby current of 0.5 mA or less—helpful for low-power modes in system designs.
  • RoHS Compliant Device is RoHS compliant for regulatory and environmental considerations.
  • Design Ecosystem Supported by Altera MAX+PLUS II development software and common EDA toolflows for design entry, place-and-route and simulation.

Typical Applications

  • Bus Interfaces and TTL Integration Use the EPF8282ATC100-2 to implement bridge logic, protocol glue, and TTL-level integration for legacy and mixed-voltage systems.
  • High-speed Controllers Suitable for control logic and timing-critical state machines where predictable interconnect and dedicated arithmetic chains improve design performance.
  • Coprocessor and Glue Logic Implement coprocessor assist functions, address decoding and custom control paths to offload tasks from main processors.
  • DSP and Data-path Tasks Supports wide-data-path manipulation and data transformation functions that benefit from a high register count and dedicated routing resources.

Unique Advantages

  • Register-rich architecture: High flip-flop count and 208 logic elements enable dense state-machine and pipeline implementations without external registers.
  • Predictable routing: FLEX family interconnect architecture provides consistent routing delays, simplifying timing closure for medium-complexity designs.
  • Compact package with ample I/O: 100-TQFP (14×14) offers up to 78 user I/O pins, balancing board space and interface flexibility.
  • 5 V system compatibility: 4.75 V–5.25 V supply range and MultiVolt™ I/O family support ease integration into 5.0 V designs while maintaining compatibility with 3.3 V I/O levels on supported devices.
  • Built-in testability and reconfigurability: Family-level JTAG boundary-scan (on selected devices) and in-circuit reconfigurability streamline production testing and field updates.
  • RoHS compliant: Environmentally compliant manufacturing reduces regulatory overhead for many markets.

Why Choose EPF8282ATC100-2?

The EPF8282ATC100-2 positions itself as a compact, register-rich programmable logic solution for commercial embedded applications that require moderate gate density, a substantial register count and flexible I/O in a small package. It is particularly well suited to designers implementing bus glue logic, control/state machines, coprocessor assist functions and data-path manipulation where consistent routing and dedicated arithmetic resources matter.

Backed by FLEX 8000 family features and supported design tools, the EPF8282ATC100-2 offers a practical balance of performance, integration and manufacturability for teams targeting 5.0 V systems and commercial-temperature deployments.

Request a quote or submit a purchase inquiry for the EPF8282ATC100-2 to obtain pricing, availability and ordering information.

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