EPF8282ATC100-3

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 250 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ATC100-3 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

The EPF8282ATC100-3 is a member of the FLEX 8000 programmable logic device family, delivered in a 100-pin TQFP (14×14) surface-mount package for commercial applications. It provides a compact, register-rich FPGA architecture with 208 logic elements organized across 26 logic array blocks and approximately 2,500 usable gates.

Designed for general-purpose digital logic, bus interfacing and controller tasks, this device offers 78 user I/O pins and operates from a 4.75 V to 5.25 V supply within a 0 °C to 70 °C operating range, making it suitable for a wide range of commercial embedded designs.

Key Features

  • Core and Logic 208 logic elements (LEs) across 26 logic array blocks (LABs) providing approximately 2,500 usable gates and 282 flip‑flops/registers for register-rich designs.
  • I/O and Voltage 78 user I/O pins with MultiVolt I/O capability described for the FLEX 8000 family, allowing core operation at 5.0 V while supporting I/O compatibility with 5.0 V and 3.3 V logic levels. Supply range: 4.75 V to 5.25 V.
  • System-level Features Family-level capabilities include in‑circuit reconfigurability, predictable FastTrack® interconnect routing, dedicated carry and cascade chains for arithmetic and high‑fan‑in logic, and programmable output slew-rate control to help manage switching noise.
  • Packaging & Mounting Surface-mount 100‑TQFP (14×14 mm) package for compact board-level integration and automated assembly.
  • Commercial Temperature Grade Rated for operation from 0 °C to 70 °C for commercial applications.
  • On-chip Memory No embedded RAM bits on-chip (Total RAM bits = 0), enabling deterministic logic and register-focused implementations.
  • Standards & Tooling (Family) FLEX 8000 family features include JTAG boundary-scan test support on selected devices and software design support via the MAX+PLUS II tool flow (family-level information).

Typical Applications

  • Bus Interfaces: Implement glue logic and bus bridging where multiple TTL-compatible buses or parallel interfaces must be integrated into a single device.
  • High‑Speed Controllers: Use the device’s dense register count and dedicated carry/cascade chains for control logic in high-speed embedded controllers and peripheral controllers.
  • Coprocessor / Logic Offload: Deploy as a small coprocessor or offload for specific logic functions, leveraging abundant registers and deterministic interconnect for predictable timing.
  • TTL Integration: Integrate legacy TTL-level systems with modern board designs using the device’s I/O compatibility and flexible voltage interfacing.
  • Digital Signal Preprocessing: Implement front-end DSP control, wide-data-path manipulation, or data transformation functions that benefit from a high register count.

Unique Advantages

  • Register‑Rich Architecture: 282 flip‑flops/registers and 208 logic elements provide substantial on-device storage for state machines, pipelines, and timing-critical logic.
  • Compact Integration: 78 user I/O and a 100‑pin TQFP package let you consolidate multiple functions into a single surface-mount FPGA, reducing board-level BOM and interconnect complexity.
  • Deterministic Routing: Family FastTrack® interconnect and dedicated arithmetic/cascade chains enable predictable timing for arithmetic and high‑fan‑in logic without external glue logic.
  • Flexible I/O Voltage Compatibility: MultiVolt I/O support (family-level) combined with a 5 V core supply range supports mixed‑voltage system integration with 3.3 V and 5.0 V logic.
  • Commercially Tuned: Designed and rated for 0 °C to 70 °C operation, aligning with typical commercial embedded product requirements.

Why Choose EPF8282ATC100-3?

The EPF8282ATC100-3 offers a balanced, register-rich FPGA option for commercial embedded designs that need compact package density, ample I/O, and predictable logic resources. Its 208 logic elements, 282 registers and 78 I/O pins make it well suited for bus interfaces, controller logic, and coprocessor offload tasks where deterministic timing and integration density matter.

As part of the FLEX 8000 family, it benefits from family-level system features such as in-circuit reconfigurability, dedicated arithmetic chains, and proven software support, delivering a practical platform for engineers seeking a low-cost, high-functionality programmable solution in a 100‑TQFP surface-mount package.

If you need pricing, availability, or to request a quote for EPF8282ATC100-3, submit a product inquiry or request a quote and our team will respond with details and lead-time information.

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