EPF8282ATI100-3

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 998 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ATI100-3 – FLEX 8000 FPGA, 208 LEs, 78 I/O, 100-TQFP

The EPF8282ATI100-3 is a member of the FLEX 8000 programmable logic device family. It implements a fine-grained FPGA architecture using compact logic elements (LEs) with embedded registers and 4‑input look‑up tables, providing a register‑rich solution for control, data-path, and bus interface designs.

Targeted at industrial embedded applications, this device delivers 2,500 usable gates, 208 logic elements, and up to 78 user I/O pins in a 100‑pin TQFP package, supporting 5.0‑V core operation and a wide operating temperature range for robust system integration.

Key Features

  • Logic Capacity — 208 logic elements and 26 logic array blocks (LABs) providing approximately 2,500 usable gates and 282 flip‑flops for mid‑range logic and control functions.
  • I/O and Packaging — Up to 78 user I/O pins in a 100‑pin TQFP (14×14) surface‑mount package, simplifying PCB routing for compact industrial designs.
  • Voltage Supply — Operates from 4.75 V to 5.25 V, supporting 5.0‑V system environments and MultiVolt I/O capability described for the FLEX 8000 family.
  • Temperature and Grade — Industrial grade with an operating temperature range of −40 °C to 85 °C for deployment in demanding environments.
  • Reconfigurability and Test — Family‑level support for in‑circuit reconfigurability and JTAG boundary‑scan (BST) circuitry consistent with IEEE 1149.1 on selected FLEX 8000 devices.
  • Performance and Architecture — Continuous routing (FastTrack interconnect), dedicated carry and cascade chains, and tri‑state emulation to implement arithmetic, high‑fan‑in logic, and internal tri‑state nets.
  • Power Management — Low standby current (typical specification cited for the family is 0.5 mA or less), plus programmable output slew‑rate control to reduce switching noise.
  • Regulatory — RoHS compliant.

Typical Applications

  • Bus Interfaces — Integrate multiple narrow or wide buses and implement protocol glue logic with available I/O count and routing resources.
  • TTL Integration — Interface and translate between TTL‑level devices and system logic while maintaining predictable timing.
  • Coprocessor and Control Logic — Implement custom coprocessor functions, peripheral controllers, and glue logic using the device’s register resources and dedicated arithmetic chains.
  • High‑Speed Controllers — Use the register‑rich fabric and dedicated routing to implement fast, deterministic control functions for embedded systems.
  • Data Transformation and DSP‑oriented Tasks — Leverage the device’s flip‑flop count and LEs for wide‑data‑path manipulation and data formatting tasks.

Unique Advantages

  • Register‑Rich Architecture: 282 flip‑flops and 208 LEs provide plentiful storage for state machines, pipelined datapaths, and timing‑critical control logic.
  • Flexible I/O in a Compact Package: 78 user I/Os in a 100‑pin TQFP give a balance of pin count and small PCB footprint for space‑constrained designs.
  • Predictable Routing and Arithmetic Support: FastTrack interconnect plus dedicated carry and cascade chains enable consistent timing and efficient implementation of adders, counters, and wide logic functions.
  • Industrial Temperature Range: Rated from −40 °C to 85 °C for reliable operation in harsh or temperature‑variable environments.
  • In‑Circuit Reconfiguration and Testability: Family support for in‑circuit reconfigurability and IEEE‑1149.1 boundary‑scan enhances board‑level debug and field updates.
  • RoHS Compliance: Environmentally compliant manufacturing for regulated product streams.

Why Choose EPF8282ATI100-3?

The EPF8282ATI100-3 is positioned as a mid‑density, register‑rich programmable logic device suited to designers who need a compact FPGA solution with solid logic capacity, ample I/O, and industrial temperature capability. Its combination of 208 logic elements, dedicated routing features, and family‑level support for in‑circuit reconfiguration and boundary‑scan makes it suitable for control, interface, and data‑manipulation roles in embedded systems.

As part of the FLEX 8000 family, the device benefits from established software design flows and family scalability, enabling teams to prototype, iterate, and migrate designs within the same device family while leveraging documented tool support and device features.

Request a quote or submit an inquiry to receive pricing and availability information for EPF8282ATI100-3 and to discuss how this device can be integrated into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up