EPF8282AVTC100-4

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 997 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8282AVTC100-4 – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

The EPF8282AVTC100-4 is a FLEX 8000 series programmable logic device in a 100‑pin TQFP (14×14) surface-mount package. As a register-rich CMOS PLD, it delivers a compact programmable logic solution with 2,500 usable gates and 208 logic elements organized across 26 logic array blocks.

Designed for commercial applications, this device targets bus interfaces, controller logic, and glue‑logic integration where in-system reconfiguration, predictable interconnect, and a moderate I/O count are required. It operates from a 4.75 V to 5.25 V supply and is rated for 0 °C to 70 °C operation.

Key Features

  • Core Architecture FLEX 8000 family CMOS programmable logic with approximately 2,500 usable gates and 208 logic elements across 26 logic array blocks for compact, register-rich designs.
  • Registers & Storage Register-rich fabric suitable for control logic and state machines; the device is optimized for designs that rely on flip‑flop resources rather than embedded RAM (Total on‑chip RAM bits: 0).
  • I/O and Voltage Up to 78 user I/O pins with support for 5.0 V operation; device supply 4.75 V to 5.25 V. Series-level documentation also describes MultiVolt I/O options for mixed 5.0 V/3.3 V interfacing.
  • Configuration & System Features Supports in-circuit reconfigurability via external configuration devices or an intelligent controller; family-level support for JTAG boundary-scan on selected devices.
  • Interconnect & Arithmetic Support FastTrack continuous routing structure plus dedicated carry and cascade chains for efficient implementation of adders, counters and high‑fan‑in logic.
  • Signal Integrity & Power Programmable output slew-rate control to reduce switching noise and low standby current characteristics documented at the family level.
  • Package & Mounting 100‑pin TQFP (14×14) surface‑mount package, commercial grade, RoHS compliant, suited for compact board layouts and standard assembly processes.

Typical Applications

  • Bus Interfaces Implement PCI/parallel bus glue logic and custom bus adapters where predictable timing and multiple I/O channels are needed.
  • Controller & Control Logic Ideal for microcontroller peripheral offload, custom finite-state machines, and real‑time control tasks that benefit from a register-rich fabric.
  • Glue Logic & TTL Integration Replace discrete logic for TTL integration, address decoding, and signal translation with a single programmable device to reduce BOM and board area.
  • Coprocessor Functions Implement medium-complexity coprocessor or accelerator functions that rely on combinatorial logic and register resources rather than large embedded RAM.

Unique Advantages

  • Compact, Register-Rich Fabric: 208 logic elements and 26 LABs provide a concentrated building block for control-oriented designs without excess silicon area.
  • Flexible I/O Count: 78 user I/O pins enable multiple peripheral and bus connections from a single package, simplifying system-level integration.
  • In-Circuit Reconfigurability: Supports system updates and field reprogramming via external configuration devices or controllers, enabling iterative development and post-deployment updates.
  • Predictable Interconnect: FastTrack routing and dedicated carry/cascade resources improve timing predictability for arithmetic and wide-logic functions.
  • Industry-Standard Package: 100‑pin TQFP (14×14) surface-mount package supports standard PCB assembly and compact board designs.
  • RoHS Compliant: Conforms to RoHS requirements for lead‑free assembly and environmental compliance in commercial electronics.

Why Choose EPF8282AVTC100-4?

The EPF8282AVTC100-4 combines a register-rich FLEX 8000 architecture with a compact 100‑pin TQFP package to deliver a balanced solution for glue logic, control functions, and medium-complexity programmable logic tasks. Its 2,500 usable gates and 208 logic elements suit designers seeking predictable interconnect and efficient resource utilization in commercial-temperature applications.

This device is a practical choice for teams needing in-circuit reconfigurability, a moderate I/O count, and compatibility with standard 5 V systems. It offers long-term design flexibility through reprogrammability and family-level tool support documented for the FLEX 8000 series.

Request a quote or submit an inquiry to receive pricing and availability for EPF8282AVTC100-4 and to discuss how it can fit into your design requirements.

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