EPF8282ATC100-4N

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 145 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeCommercialOperating Temperature0°C – 70°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCNEAR99HTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ATC100-4N – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

The EPF8282ATC100-4N is a FLEX 8000 series field programmable gate array supplied by Intel, packaged in a 100‑pin TQFP (14×14) surface‑mount package. It provides a compact, register‑rich programmable logic solution for designs that require moderate gate density and flexible I/O.

Designed for applications such as bus interfaces, TTL integration, coprocessor functions, DSP and high‑speed control, the device combines a FastTrack® interconnect architecture with dedicated carry and cascade chains to support arithmetic and high‑fan‑in logic functions.

Key Features

  • Core resources: 208 logic elements and 26 LABs providing approximately 2,500 usable gates and 282 flip‑flops for register‑rich logic implementation.
  • I/O capacity and flexibility: Up to 78 user I/O pins with MultiVolt™ I/O support at the family level, enabling compatibility with 5.0‑V and 3.3‑V logic levels while the device core can run at 5.0 V.
  • Configurable interconnect: FastTrack® continuous routing structure plus dedicated carry and cascade chains for efficient arithmetic, counters and high‑fan‑in logic implementations.
  • In‑circuit reconfigurability (ICR): Family‑level support for in‑circuit reconfiguration via external configuration devices or an intelligent controller for flexible field updates.
  • System and test support: Family features include PCI Local Bus Specification (Revision 2.2) compliance for 5.0‑V operation and JTAG boundary‑scan test (BST) circuitry available on selected FLEX 8000 devices.
  • Power and packaging: Standard 5‑V supply range (4.75 V to 5.25 V), commercial operating temperature range 0 °C to 70 °C, RoHS compliant, and surface‑mount 100‑TQFP (14×14) package.
  • Programmable I/O control: Programmable output slew‑rate control to help manage switching noise at the system level (family feature).

Typical Applications

  • Bus interfaces and bridging: Implement flexible bus logic and protocol adapters for multi‑bus systems and TTL integrations using available I/O and gate resources.
  • High‑speed controllers: Realize control logic and state machines for peripherals and controllers where predictable interconnect delays and dedicated carry chains improve timing behavior.
  • Digital signal processing (DSP) and data path logic: Use the register‑rich architecture and logic array to implement wide data‑path manipulation and data transformation functions.
  • Coprocessor and accelerator logic: Offload custom arithmetic or control tasks using dedicated arithmetic resources and compact LUT‑based logic elements.

Unique Advantages

  • Compact package with substantial I/O: 100‑TQFP (14×14) footprint provides up to 78 user I/O pins for dense I/O integration in space‑constrained boards.
  • Balanced logic and registers: 208 logic elements with 282 flip‑flops offer a good balance of combinational logic and storage for register‑heavy designs.
  • Design flexibility: FastTrack® interconnect plus dedicated carry and cascade chains simplify implementation of arithmetic and high‑fan‑in logic without manual routing effort.
  • Field configurability: In‑circuit reconfigurability via external configuration devices enables firmware updates and in‑field feature changes.
  • Industry‑ready compliance features: Family‑level support for PCI 2.2 (5.0‑V operation) and JTAG BST on selected devices supports integration and testability in system designs.
  • RoHS compliant and surface‑mount ready: Commercial grade, RoHS‑compliant device in a standard surface‑mount TQFP package for straightforward PCB assembly.

Why Choose EPF8282ATC100-4N?

The EPF8282ATC100-4N positions itself as a versatile, commercially graded FLEX 8000 FPGA option for mid‑density programmable logic needs. Its combination of 208 logic elements, substantial flip‑flop count, and 78 I/O pins in a 100‑TQFP package makes it suitable for designs that require moderate gate capacity, flexible I/O signaling and in‑circuit reconfigurability.

Designers targeting bus interfaces, controller logic, DSP data paths, or coprocessor offload will find the device’s dedicated arithmetic chains, FastTrack® routing, and family‑level system features useful for reducing design complexity while maintaining predictability in timing and testability over the product lifecycle.

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