EPF8282ATI100-3N

IC FPGA 78 I/O 100TQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

Quantity 42 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-TQFP (14x14)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case100-TQFPNumber of I/O78Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs26Number of Logic Elements/Cells208
Number of Gates2500ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF8282ATI100-3N – FLEX 8000 Field Programmable Gate Array (FPGA) IC 78 208 100-TQFP

The EPF8282ATI100-3N is an Intel FLEX 8000 family programmable logic device supplied in a 100‑pin TQFP (14×14) surface‑mount package. It combines SRAM‑based programmable logic with a FastTrack interconnect architecture to deliver moderate logic density and predictable routing for embedded and interface applications.

Designed for 5.0 V systems, the device provides 208 logic elements, 26 logic array blocks, up to 78 user I/O pins, and a usable gate count of approximately 2,500. Its industrial operating range and RoHS compliance make it suitable for a wide range of commercial and industrial designs that require in‑circuit configurability and flexible I/O options.

Key Features

  • Core architecture FLEX 8000 family, SRAM‑based programmable logic with register‑rich logic elements designed for in‑system programmability and flexible logic implementation.
  • Logic resources 208 logic elements and 26 logic array blocks (LABs) providing approximately 2,500 usable gates and 282 flip‑flops for state storage and control logic.
  • I/O and voltage support Up to 78 user I/O pins and MultiVolt I/O capability within the FLEX 8000 family; device supply range specified at 4.75 V to 5.25 V, enabling 5.0 V core operation with I/O compatibility across common logic levels.
  • System configurability Supports in‑circuit reconfigurability via external configuration devices or an intelligent controller for field updates and flexible system provisioning.
  • Interconnect and arithmetic support FastTrack continuous routing structure with dedicated carry and cascade chains to implement high‑speed adders, counters and high‑fan‑in logic functions.
  • Low standby power Designed for low power consumption in standby operation (typical standby currents cited in the family data).
  • Package and mounting 100‑TQFP (14×14) surface‑mount package; industrial grade with operating temperature range −40 °C to 85 °C and RoHS compliance.

Typical Applications

  • Bus interfaces Integration of parallel bus controllers and glue logic where predictable timing and multiple I/O pins simplify system interfaces.
  • Digital signal and data path logic DSP preprocessing, wide‑data‑path manipulation, and data transformation tasks that benefit from register‑rich logic resources.
  • Coprocessor and control logic Offloading control sequencing, protocol handling, or custom instruction logic to a reconfigurable device to ease MCU/CPU load.
  • High‑speed controllers Implementing timing‑sensitive controllers and state machines using dedicated carry and cascade chains for deterministic performance.

Unique Advantages

  • Moderate, practical logic density: 208 logic elements and ~2,500 usable gates provide a cost‑effective solution for mid‑range programmable logic needs without unnecessary complexity.
  • Flexible I/O and 5 V compatibility: 78 user I/O pins and a 4.75–5.25 V supply range support integration into existing 5.0 V systems while maintaining I/O level compatibility.
  • Field reconfiguration: In‑circuit reconfigurability enables firmware updates and design iteration without board rework, reducing maintenance time and BOM churn.
  • Predictable routing and arithmetic primitives: FastTrack interconnect and dedicated carry/cascade chains simplify implementation of arithmetic and high‑fan‑in logic, improving timing predictability.
  • Industrial readiness: Surface‑mount 100‑TQFP package, industrial temperature range (−40 °C to 85 °C), and RoHS compliance support deployment in commercial and industrial applications.
  • Low standby power: Family‑level low standby current characteristics help reduce system power draw in idle or low‑activity states.

Why Choose EPF8282ATI100-3N?

The EPF8282ATI100-3N is positioned for designs that require a mid‑range, register‑rich programmable logic device with reliable 5 V operation and practical I/O capacity. Its FLEX 8000 architecture offers designers a balance of logic resources, predictable routing, and field reconfigurability for interface, control, and data‑path functions.

Engineers and procurement teams looking for a compact, industrial‑grade FPGA solution will find the EPF8282ATI100-3N delivers long‑term value through flexible configuration options, a compact 100‑TQFP footprint, and integration readiness for a wide array of embedded designs.

Request a quote or submit a procurement inquiry to obtain pricing, lead times, and availability for the EPF8282ATI100-3N.

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