EPF8282ATC100-3N

The EPF8282ATC100-3N is a FLEX 8000 family programmable logic device in a 100-pin TQFP (14×14) surface-mount package. It implements a register‑rich CMOS programmable-logic architecture optimized for logic- and register‑centric designs, delivering 208 logic elements arranged in 26 logic array blocks and up to 2,500 usable gates with 78 user I/O pins.

Designed for commercial-grade applications, this device suits bus interfaces, TTL integration, coprocessor functions, high-speed controllers and other embedded systems that require flexible I/O and in-circuit reconfigurability while operating from a 4.75 V to 5.25 V supply.

Key Features

• Logic Resources  208 logic elements (LEs) organized into 26 logic array blocks (LABs); approximately 2,500 usable gates for implementing control, glue logic, and moderate-complexity datapath functions.
• User I/O and Packaging  78 user I/O pins in a 100‑TQFP (14×14) surface-mount package, enabling multiple bus interfaces and peripheral connections in compact board designs.
• Power and Voltage  Single supply operation from 4.75 V to 5.25 V. The FLEX 8000 family supports a MultiVolt I/O interface that lets the device core run at 5.0 V while I/O pins are compatible with both 5.0 V and 3.3 V logic levels.
• Register‑Rich Architecture  High register count with 282 flip‑flops in the FLEX 8000 family provides deterministic timing for DSP-style data paths and wide-data‑path manipulation (device-level register count per family documentation).
• Flexible, Predictable Routing  FastTrack continuous interconnect structure and dedicated carry and cascade chains for efficient implementation of adders, counters and high‑fan‑in logic without manual routing intervention.
• System Features  In-circuit reconfigurability (ICR) support via external configuration devices or an intelligent controller, plus JTAG boundary-scan test circuitry available on selected family devices for board-level test accessibility.
• Signal Integrity and Power Savings  Programmable output slew-rate control to reduce switching noise and low standby power (typical standby specification of 0.5 mA or less as indicated in family documentation).
• Commercial Temperature Grade & Compliance  Commercial operating temperature range of 0 °C to 70 °C and RoHS compliant for environmental compliance in standard commercial applications.
• Design Ecosystem  Family-level software support and automatic place-and-route provided by the MAX+PLUS II development system and compatibility with common EDA flows for synthesis and simulation.

Typical Applications

• Bus Interface and Glue Logic  Implement address decoding, bus arbitration, and signal translation between TTL/CMOS domains using the device’s I/O count and MultiVolt compatibility.
• High‑Speed Control  Use in microcontroller or microprocessor support roles such as coprocessor interfacing and custom control-state machines where predictable interconnect and dedicated carry logic accelerate design closure.
• Data Path and DSP‑Style Functions  Suitable for wide-data-path manipulation and moderate DSP tasks that benefit from the family’s register-rich topology and dedicated arithmetic chains.
• Board-Level Test and Configuration  Leverage JTAG boundary-scan on supported devices and in-circuit reconfigurability options for manufacturing test and field updates.

Unique Advantages

• Register‑Rich, Predictable Architecture: 208 logic elements and a high flip‑flop count enable deterministic timing and simplified timing closure for register‑dominated designs.
• MultiVolt I/O Flexibility: Core operation at 5.0 V with I/O compatibility for both 5.0 V and 3.3 V logic levels reduces the need for level‑shifting components.
• Dedicated Arithmetic Support: Built‑in carry and cascade chains accelerate implementation of adders, counters and comparators, letting synthesis tools map arithmetic functions efficiently.
• Compact, Surface‑Mount Package: 100‑TQFP (14×14) packaging provides a balance of pin count and board space for compact embedded designs.
• In‑Circuit Reconfigurability: Support for external configuration devices allows field updates and flexible development workflows without PCB rework.
• RoHS Compliant Commercial Offering: Commercial-grade temperature range and RoHS compliance make this device suitable for mainstream electronic products and prototyping.

Why Choose EPF8282ATC100-3N?

The EPF8282ATC100-3N delivers a practical combination of logic density, predictable routing, and flexible I/O in a compact 100‑TQFP surface‑mount package. Its register‑rich design and dedicated arithmetic structures make it well suited for control logic, bus interfacing, and moderate datapath tasks where deterministic timing and in-circuit reconfiguration are valuable.

For commercial embedded systems that require a 5 V core environment with mixed 3.3 V/5 V peripheral compatibility, this FLEX 8000 family device offers a proven architecture, development‑tool support, and RoHS compliance to streamline design and production.

Request a quote or submit an RFQ to get pricing and availability for the EPF8282ATC100-3N.