EPF81500ARI240-3

The EPF81500ARI240-3 is a FLEX 8000 family programmable logic device from Intel, combining fine-grained logic elements with a predictable interconnect fabric. This surface-mount FPGA provides 1,296 logic elements and up to 16,000 usable gates with 181 user I/O pins in a 240-pin BFQFP package with exposed pad, targeting industrial embedded applications.

Designed for applications that require high pin count, reconfigurability and 5.0 V core/I/O operation, the device supports system-level features such as in-circuit reconfigurability and MultiVolt I/O compatibility while operating across an industrial temperature range.

Key Features

• Core Density 1,296 logic elements and approximately 16,000 usable gates provide substantial combinational and sequential resources for mid-density logic implementations.
• I/O and Packaging 181 user I/O pins in a 240-BFQFP exposed pad package (supplier package: 240-RQFP, 32×32) support integration of multiple buses and complex I/O requirements.
• Voltage and Power Supports a supply voltage range of 4.75 V to 5.25 V and includes programmable output slew-rate control to help manage switching noise.
• Temperature and Grade Industrial grade operation with a specified temperature range of −40 °C to 85 °C for robust embedded use.
• Reconfigurability and System Features Family-level support for in-circuit reconfigurability (ICR) via external configuration devices or an intelligent controller enables field updates and design iteration.
• Interconnect and Arithmetic Support FastTrack continuous routing architecture with dedicated carry and cascade chains to implement arithmetic functions and high-fan-in logic efficiently (family feature).
• On-chip Memory Product data lists total on-chip RAM bits as 0.
• Standards and Testability FLEX 8000 family devices include options for JTAG boundary-scan test circuitry (family-level feature) and PCI Local Bus Specification compliance for 5.0-V operation on selected devices.
• RoHS Compliance Device is RoHS compliant.

Typical Applications

• Bus Interfaces and Bridges High I/O count and available routing resources make the device suitable for implementing multi-bus interfaces and TTL integration.
• High-Speed Control Use in high-speed controllers and coprocessor functions where reconfigurable logic and dedicated arithmetic chains accelerate control and datapath tasks.
• Wide-Data-Path Processing The device’s register-rich architecture and logic density support wide-data-path manipulation and data transformation functions.
• Embedded Systems in Industrial Environments Industrial temperature rating and 5.0 V operation align with rugged embedded applications requiring field reconfigurability.

Unique Advantages

• Substantial Logic Resources: 1,296 logic elements and approximately 16,000 usable gates provide the capacity to consolidate mid-density functions into a single device, reducing component count.
• High Pin Count for System Integration: 181 I/O pins in a 240-pin package enable direct interfacing with multiple buses and parallel data paths, simplifying board-level routing.
• Industrial Robustness: −40 °C to 85 °C operating range and industrial grade classification support deployment in demanding embedded environments.
• Field Reconfigurability: In-circuit reconfigurability allows updates and design changes without board rework, supporting iterative development and late-stage feature additions.
• Predictable Routing and Arithmetic Support: FastTrack routing and dedicated carry/cascade chains improve predictability of timing and simplify implementation of arithmetic and high-fan-in logic (family-level features).
• Standards Compatibility and Testability: Family-level compliance with PCI for 5.0-V operation and availability of JTAG boundary-scan support help with system integration and manufacturing test.

Why Choose EPF81500ARI240-3?

The EPF81500ARI240-3 positions itself as a versatile mid-density FLEX 8000 family FPGA for industrial embedded designs that need significant logic capacity, broad I/O, and 5.0 V operation. Its combination of 1,296 logic elements, 181 I/Os, exposed-pad BFQFP packaging and industrial temperature rating makes it suitable for consolidating interfaces, controllers and data-path logic into a single programmable device.

Backed by family-level features such as in-circuit reconfigurability, FastTrack routing and vendor software support, the device provides a practical platform for designers who require field update capability, predictable interconnect behavior and a mature development flow.

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