EPF81500ARC240-2
| Part Description |
FLEX 8000 Field Programmable Gate Array (FPGA) IC 181 1296 240-BFQFP Exposed Pad |
|---|---|
| Quantity | 846 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 240-RQFP (32x32) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 240-BFQFP Exposed Pad | Number of I/O | 181 | Voltage | 4.75 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 162 | Number of Logic Elements/Cells | 1296 | ||
| Number of Gates | 16000 | ECCN | 3A001A2A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of EPF81500ARC240-2 – FLEX 8000 FPGA, 181 I/O, 1,296 Logic Elements, 240‑BFQFP
The EPF81500ARC240-2 is a FLEX 8000 family field-programmable gate array (FPGA) manufactured by Intel. It implements a register-rich, LUT-based logic architecture organized into logic elements and logic array blocks to support medium-density programmable logic designs.
Designed for commercial applications, this device provides 1,296 logic elements, 181 user I/O pins, and compatibility with 5.0 V core operation (4.75 V to 5.25 V supply range). The device is supplied in a 240‑pin BFQFP package with an exposed pad for thermal performance and is RoHS compliant.
Key Features
- Logic Capacity — 1,296 logic elements across 162 logic array blocks, delivering approximately 16,000 usable gates for mid-range programmable logic implementations.
- I/O Density — 181 user I/O pins suitable for integrating multiple buses, TTL-level peripherals, and parallel interfaces in a single device.
- Supply & I/O — Operates from a 4.75 V to 5.25 V supply; supports MultiVolt I/O concepts in the FLEX 8000 family that allow core and I/O level flexibility as described in the family datasheet.
- Package & Mounting — 240‑BFQFP with exposed pad (supplier package: 240‑RQFP, 32 × 32) for surface-mount board assembly and improved thermal conduction.
- Temperature Range & Grade — Commercial grade operation from 0 °C to 70 °C, suitable for standard embedded and consumer applications.
- On‑Chip Resources — Total on-chip RAM reported as 0 bits for this part number; logic and register resources are intended for combinational and sequential implementation.
- Standards & Test Support — FLEX 8000 family devices include features such as in-circuit reconfigurability options and JTAG boundary-scan support on selected devices, as documented in the FLEX 8000 family datasheet.
- Regulatory — RoHS compliant, supporting lead-free assembly processes.
Typical Applications
- Bus Interfaces — Integrate and bridge multiple parallel buses and TTL-level logic for board-level system interfaces.
- High‑Speed Controllers — Implement control logic for controllers and peripherals that require moderate gate counts and extensive I/O.
- Coprocessor and Glue Logic — Offload specialized logic functions, bus arbitration, and protocol translation within larger systems.
- Data Transformation & DSP Support — Suitable for wide-data-path manipulation and register-rich operations in signal processing pipelines where on-chip RAM is not required.
Unique Advantages
- Balanced Logic and I/O — 1,296 logic elements combined with 181 I/O pins allow integration of complex logic while maintaining extensive external connectivity.
- Commercial-grade, Ready for Production — 0 °C to 70 °C operating range and surface-mount 240‑BFQFP package simplify integration into mainstream embedded products.
- Family-Level Flexibility — Features of the FLEX 8000 family—such as in-circuit reconfigurability and programmable I/O behavior—enable adaptable system designs that can evolve through firmware updates.
- Thermal-Friendly Package — Exposed pad on the 240‑BFQFP aids thermal dissipation for sustained operation within the specified commercial temperature range.
- Standards and Testability — Family support for JTAG boundary-scan and PCI Local Bus compatibility (5.0 V operation on the family level) helps simplify board bring-up and validation.
Why Choose EPF81500ARC240-2?
The EPF81500ARC240-2 positions itself as a mid-density programmable logic device within the FLEX 8000 family that balances logic capacity and I/O count for commercial embedded designs. Its 1,296 logic elements and 181 I/O pins make it a practical choice for bus interfaces, glue logic, and control applications where moderate gate count and plentiful external connectivity are priorities.
With a 240‑pin BFQFP exposed‑pad package, RoHS compliance, and a defined commercial operating range, this device offers a predictable, production-ready option for teams needing a FLEX 8000 family FPGA with established architecture and toolchain support as documented in the family datasheet.
Request a quote or submit an inquiry to receive pricing and availability details for the EPF81500ARC240-2. Our team can provide lead-time information and assist with ordering for your production or development needs.

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