EPF81500ARC304-2

IC FPGA 208 I/O 304RQFP
Part Description

FLEX 8000 Field Programmable Gate Array (FPGA) IC 208 1296 304-BFQFP

Quantity 109 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package304-RQFP (40x40)GradeCommercialOperating Temperature0°C – 70°C
Package / Case304-BFQFPNumber of I/O208Voltage4.75 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs162Number of Logic Elements/Cells1296
Number of Gates16000ECCN3A001A2AHTS Code8542.39.0001
QualificationN/A

Overview of EPF81500ARC304-2 – FLEX 8000 FPGA, 208 I/O, 1,296 Logic Elements, 304‑BFQFP

The EPF81500ARC304-2 is a FLEX 8000 family field-programmable gate array implemented in a high-density, register-rich CMOS architecture. With 1,296 logic elements and up to 16,000 usable gates in this device configuration, it targets applications that require dense combinational logic, abundant registers, and a high pin count in a single surface-mount package.

Designed for commercial-grade systems, this device supports 208 user I/O pins in a 304‑pin BFQFP (supplier package 304‑RQFP, 40×40) and operates from a 4.75 V to 5.25 V supply over a 0 °C to 70 °C temperature range. It is RoHS compliant and suited to bus interfaces, TTL integration, coprocessor functions, and high-speed control applications.

Key Features

  • Core Architecture  1,296 logic elements delivering approximately 16,000 usable gates for dense logic implementation and register-rich designs.
  • I/O Capacity  208 user I/O pins to support multi‑bus connectivity and high‑pin-count system integration.
  • Package & Mounting  304‑pin BFQFP package (supplier package: 304‑RQFP, 40×40) in a surface-mount form factor for PCB assembly.
  • Supply & Temperature  Nominal 5 V operation with a 4.75 V to 5.25 V supply range and commercial operating temperature 0 °C to 70 °C.
  • On-chip Memory  No embedded RAM bits in this device configuration; logic and registers are available for control and datapath functions.
  • System-Level Features  Family-level capabilities include in-circuit reconfigurability via external configuration devices or intelligent controllers and JTAG boundary-scan test circuitry on selected devices.
  • Interconnect & Arithmetic Support  Family architecture provides a continuous routing structure and dedicated carry/cascade chains for efficient arithmetic and high‑fan‑in logic implementations.
  • I/O Behavior  Programmable output slew-rate control and MultiVolt I/O support in the family enable compatibility with 5.0 V and 3.3 V logic levels while the device core operates at 5.0 V.
  • Environmental Compliance  RoHS compliant for lead-free manufacturing requirements.

Typical Applications

  • Bus Interfaces  High I/O count and dense logic make the device well-suited to implementing multi‑bus interfaces and glue logic for system-level connectivity.
  • TTL Integration  5 V-compatible core and MultiVolt I/O enable straightforward integration with TTL-based subsystems and legacy logic levels.
  • Coprocessor & Controller Functions  Register-rich architecture and dedicated arithmetic chains support coprocessor tasks, counters, and high-speed controller logic.
  • High‑Pin-Count Systems  304‑pin package and 208 I/O pins allow consolidation of multiple 32‑bit buses or complex I/O routing into a single FPGA package.

Unique Advantages

  • High Logic Density: 1,296 logic elements and up to 16,000 usable gates provide substantial on-chip logic capacity for complex control and datapath designs.
  • Extensive I/O for System Integration: 208 user I/O pins in a 304‑pin package reduce the need for external glue logic when integrating multiple buses or peripherals.
  • 5 V Operation with MultiVolt I/O: Designed around a 5.0 V core supply with I/O compatibility for 3.3 V and 5.0 V signaling, simplifying mixed-voltage board designs.
  • Reconfigurability & Testability: Family support for in-circuit reconfigurability and JTAG boundary-scan enhances field updates and manufacturing test flow options.
  • RoHS Compliant & Commercial Grade: RoHS compliance supports lead‑free assembly; commercial-grade temperature rating aligns with a wide range of consumer and industrial product environments (0 °C to 70 °C).

Why Choose EPF81500ARC304-2?

The EPF81500ARC304-2 positions itself as a practical, high‑pin‑count FPGA option within the FLEX 8000 family for designers needing substantial logic density and extensive I/O in a surface-mount 304‑pin package. Its register-rich architecture and dedicated arithmetic resources make it suitable for control logic, bus interfaces, and coprocessor roles where predictable interconnect and plentiful registers matter.

For commercial-grade systems that require 5 V core operation, flexible I/O signaling, and RoHS compliance, this device offers a balanced combination of performance, integration, and system-level features drawn from the FLEX 8000 family specification.

Request a quote or submit an inquiry to receive pricing and availability information for EPF81500ARC304-2. Our team can provide lead-time details and assist with technical questions to support your design and procurement process.

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