LCMXO2-2000HC-6BG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA |
|---|---|
| Quantity | 749 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CABGA (14x14) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-6BG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA
The LCMXO2-2000HC-6BG256C is a MachXO2 family non-volatile FPGA offering flexible logic and system integration in a 256-ball BGA package. This device provides 2,112 logic elements, approximately 75,776 bits of on-chip RAM and 206 I/O pins, making it suitable for compact control, glue-logic and I/O-expansion roles in commercial electronic systems.
Designed for low-power operation and fast startup, the device supports a wide supply range (2.375 V to 3.465 V), surface-mount assembly and RoHS compliance. Its commercial operating range (0 °C to 85 °C) addresses mainstream embedded and communications product needs.
Key Features
- Core Logic 2,112 logic elements provide programmable LUT-based logic capacity for control, glue logic and custom peripheral implementations.
- On-chip Memory Approximately 75,776 bits of total RAM available for distributed and block memory use in buffering, FIFOs and small SRAM storage.
- I/O Capacity and Flexibility 206 I/O pins in the 256-ball package support a broad range of system interfacing and parallel/serial connectivity requirements.
- Power and Supply Operates from 2.375 V to 3.465 V supply rails and includes family-level low-power options and standby modes for reduced system power consumption.
- Non-volatile and Reconfigurable MachXO2 family devices support non-volatile, instant-on operation and background programming options, enabling in-field updates without external volatile configuration.
- System Integration On-chip peripherals and hardened functions in the family (SPI, I²C, timers/counters, oscillator) simplify system-level design and offload common tasks from external components.
- Clocking and Memory Interfaces Family-level support includes multiple primary clocks, analog PLLs and dedicated DDR gearing and registers for source-synchronous I/O implementations.
- Package and Assembly 256-LFBGA package (supplier device package: 256-CABGA 14 × 14 mm) optimized for surface-mount assembly in space-constrained designs.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for mainstream commercial applications.
- Regulatory RoHS compliant for environmentally conscious manufacturing.
Typical Applications
- Consumer and Portable Electronics Implements glue logic, peripheral aggregation and low-latency control functions while minimizing BOM and power draw.
- Communications Equipment Provides I/O-rich, reconfigurable interfaces and source-synchronous I/O support useful for protocol bridging and interface adaptation.
- Display and User Interfaces Pre-engineered display gearing and DDR-capable I/O support make it suitable for driving or interfacing with display controllers and human-machine interfaces.
- Embedded Control and Prototyping Programmable logic and on-chip memory enable rapid prototyping of control logic, custom peripherals and small soft-processor implementations.
Unique Advantages
- Instant-on, Non-volatile Operation: MachXO2 family non-volatile architecture enables immediate startup without external configuration memory, simplifying system boot behavior.
- Compact, High I/O Density: 206 I/Os in a 256-ball BGA deliver dense interface capability for designs that need many signals in a small footprint.
- Integrated Memory Resources: Approximately 75.8 kbits of on-chip RAM supports buffering, FIFOs and small SRAM needs without adding external memory.
- Flexible I/O Standards: Family-level programmable sysIO buffers and on-chip termination options support a wide range of interface standards to reduce external components.
- Field Reconfiguration: Supports in-field updates and background programming approaches to enable firmware-like upgrades of hardware logic.
Why Choose LCMXO2-2000HC-6BG256C?
The LCMXO2-2000HC-6BG256C positions itself as a versatile, non-volatile FPGA for commercial embedded designs that require moderate logic capacity, extensive I/O and on-chip RAM in a compact BGA package. Its support for multiple I/O standards, instant-on behavior and family-level system peripherals help reduce external component count and simplify system architecture.
This device is suitable for engineering teams building consumer, communications and embedded control products that benefit from reprogrammable logic, deterministic startup and integrated memory resources. Its commercial temperature rating and RoHS compliance support mainstream production and environmentally conscious manufacturing.
Request a quote or submit a quote to check availability, lead times and to discuss how the LCMXO2-2000HC-6BG256C can fit into your next design.

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