LCMXO2-2000HC-6BG256C

IC FPGA 206 I/O 256CABGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

Quantity 749 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CABGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LFBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-6BG256C – MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LFBGA

The LCMXO2-2000HC-6BG256C is a MachXO2 family non-volatile FPGA offering flexible logic and system integration in a 256-ball BGA package. This device provides 2,112 logic elements, approximately 75,776 bits of on-chip RAM and 206 I/O pins, making it suitable for compact control, glue-logic and I/O-expansion roles in commercial electronic systems.

Designed for low-power operation and fast startup, the device supports a wide supply range (2.375 V to 3.465 V), surface-mount assembly and RoHS compliance. Its commercial operating range (0 °C to 85 °C) addresses mainstream embedded and communications product needs.

Key Features

  • Core Logic  2,112 logic elements provide programmable LUT-based logic capacity for control, glue logic and custom peripheral implementations.
  • On-chip Memory  Approximately 75,776 bits of total RAM available for distributed and block memory use in buffering, FIFOs and small SRAM storage.
  • I/O Capacity and Flexibility  206 I/O pins in the 256-ball package support a broad range of system interfacing and parallel/serial connectivity requirements.
  • Power and Supply  Operates from 2.375 V to 3.465 V supply rails and includes family-level low-power options and standby modes for reduced system power consumption.
  • Non-volatile and Reconfigurable  MachXO2 family devices support non-volatile, instant-on operation and background programming options, enabling in-field updates without external volatile configuration.
  • System Integration  On-chip peripherals and hardened functions in the family (SPI, I²C, timers/counters, oscillator) simplify system-level design and offload common tasks from external components.
  • Clocking and Memory Interfaces  Family-level support includes multiple primary clocks, analog PLLs and dedicated DDR gearing and registers for source-synchronous I/O implementations.
  • Package and Assembly  256-LFBGA package (supplier device package: 256-CABGA 14 × 14 mm) optimized for surface-mount assembly in space-constrained designs.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for mainstream commercial applications.
  • Regulatory  RoHS compliant for environmentally conscious manufacturing.

Typical Applications

  • Consumer and Portable Electronics  Implements glue logic, peripheral aggregation and low-latency control functions while minimizing BOM and power draw.
  • Communications Equipment  Provides I/O-rich, reconfigurable interfaces and source-synchronous I/O support useful for protocol bridging and interface adaptation.
  • Display and User Interfaces  Pre-engineered display gearing and DDR-capable I/O support make it suitable for driving or interfacing with display controllers and human-machine interfaces.
  • Embedded Control and Prototyping  Programmable logic and on-chip memory enable rapid prototyping of control logic, custom peripherals and small soft-processor implementations.

Unique Advantages

  • Instant-on, Non-volatile Operation:  MachXO2 family non-volatile architecture enables immediate startup without external configuration memory, simplifying system boot behavior.
  • Compact, High I/O Density:  206 I/Os in a 256-ball BGA deliver dense interface capability for designs that need many signals in a small footprint.
  • Integrated Memory Resources:  Approximately 75.8 kbits of on-chip RAM supports buffering, FIFOs and small SRAM needs without adding external memory.
  • Flexible I/O Standards:  Family-level programmable sysIO buffers and on-chip termination options support a wide range of interface standards to reduce external components.
  • Field Reconfiguration:  Supports in-field updates and background programming approaches to enable firmware-like upgrades of hardware logic.

Why Choose LCMXO2-2000HC-6BG256C?

The LCMXO2-2000HC-6BG256C positions itself as a versatile, non-volatile FPGA for commercial embedded designs that require moderate logic capacity, extensive I/O and on-chip RAM in a compact BGA package. Its support for multiple I/O standards, instant-on behavior and family-level system peripherals help reduce external component count and simplify system architecture.

This device is suitable for engineering teams building consumer, communications and embedded control products that benefit from reprogrammable logic, deterministic startup and integrated memory resources. Its commercial temperature rating and RoHS compliance support mainstream production and environmentally conscious manufacturing.

Request a quote or submit a quote to check availability, lead times and to discuss how the LCMXO2-2000HC-6BG256C can fit into your next design.

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