LCMXO2-2000HC-6FTG256C
| Part Description |
MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA |
|---|---|
| Quantity | 897 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 206 | Voltage | 2.375 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 264 | Number of Logic Elements/Cells | 2112 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 75776 |
Overview of LCMXO2-2000HC-6FTG256C – MachXO2 Field Programmable Gate Array (FPGA) IC, 206 I/Os, 2,112 logic elements, 256-LBGA
The LCMXO2-2000HC-6FTG256C is a MachXO2 family FPGA from Lattice Semiconductor Corporation designed for flexible, low-power system logic and interface functions. This commercial-grade device integrates 2,112 logic elements and 206 general-purpose I/Os in a compact 256-ball BGA footprint, supporting single-supply operation across a 2.375 V to 3.465 V range and an operating temperature of 0 °C to 85 °C.
Engineered for glue logic, protocol bridging, control and interface tasks, the device combines on-chip RAM, abundant I/O and non-volatile configuration options to simplify board-level designs and accelerate system integration.
Key Features
- Programmable Logic Capacity — 2,112 logic elements provide on-chip logic resources for glue logic, state machines and custom peripherals.
- On-Chip Memory — Total on-chip RAM of 75,776 bits (approximately 75.8 kbits) for distributed and embedded memory needs.
- Extensive I/O — 206 I/Os in the 256-ball package support diverse interface requirements and board-level connectivity.
- Power and Supply — Single-supply operation from 2.375 V to 3.465 V; family-level low-power options include standby power as low as 22 μW.
- Non-Volatile Configuration — MachXO2 family supports on-chip user flash memory and single-chip, instant-on configurations for rapid system startup and secure in-field updates.
- Flexible I/O Standards — Family-level programmable I/O buffer support and pre-engineered source-synchronous I/O, DDR registers and dedicated gearing for display and memory interfaces.
- Clocking and PLLs — Family features include multiple primary clocks and up to two analog PLLs with fractional-n synthesis for broad clocking needs.
- Package and Temperature — Available in a 256-LBGA / 256-FTBGA (17 × 17 mm) package; commercial temperature grade 0 °C to 85 °C and RoHS compliant.
- On-Chip System Functions — Family-level hardened peripherals include SPI, I²C and timer/counter blocks for system-level integration.
Typical Applications
- Interface Bridging — Implement protocol conversion, level translation and glue logic between disparate peripherals using abundant I/O and programmable logic.
- Display and Video I/O — Use pre-engineered gearing and DDR registers for display timing, interface buffering and signal conditioning.
- Memory Interface Support — Take advantage of dedicated DDR/DDR2/LPDDR support and on-chip FIFO control logic for memory buffering and timing alignment.
- Configuration and Field Upgrades — On-chip user flash memory and TransFR reconfiguration enable in-field logic updates and secure boot management.
Unique Advantages
- High I/O Density: 206 I/Os in a compact 256-ball package reduce external glue logic and simplify board routing for I/O-heavy designs.
- Integrated Memory and Logic: Approximately 75.8 kbits of on-chip RAM combined with 2,112 logic elements supports local buffering, state machines and custom datapaths without external SRAM.
- Single-Supply Flexibility: Operates across a wide supply range (2.375 V to 3.465 V), easing integration into existing power rails.
- Instant-On, Non-Volatile Configuration: Family-level on-chip flash enables immediate startup and secure reconfiguration options for long-term field maintenance.
- Low Standby Power: Family-level standby power down to 22 μW helps minimize system idle power consumption.
- Commercial Temperature Grade and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.
Why Choose LCMXO2-2000HC-6FTG256C?
The LCMXO2-2000HC-6FTG256C balances programmable logic capacity, extensive I/O and embedded memory in a single, commercially graded BGA package—making it suitable for board-level logic, interface consolidation and in-field configurable systems. Its family-level features for low-power operation, non-volatile configuration and flexible I/O standards help reduce BOM complexity and accelerate time-to-market for control, interface and display-oriented designs.
Design teams looking for a compact, reconfigurable solution with secure configuration options and broad I/O capabilities will find this MachXO2 device a practical choice for commercial embedded applications requiring reliable, field-updatable logic and interface functionality.
Request a quote or submit an inquiry to get pricing and availability for the LCMXO2-2000HC-6FTG256C and to discuss how it can fit your design requirements.

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