LCMXO2-2000HC-6FTG256I

IC FPGA 206 I/O 256FTBGA
Part Description

MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 2112 256-LBGA

Quantity 168 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O206Voltage2.375 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs264Number of Logic Elements/Cells2112
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits75776

Overview of LCMXO2-2000HC-6FTG256I – MachXO2 Field Programmable Gate Array (FPGA), 256‑LBGA, 206 I/Os

The LCMXO2-2000HC-6FTG256I is a MachXO2 family FPGA packaged in a 256‑ball ftBGA (17×17 mm) surface-mount package with 206 user I/Os. It delivers a flexible logic architecture with 2,112 logic elements and approximately 75,776 bits of on-chip RAM for glue logic, control, and interface functions in industrial applications.

Designed for low-power, instant-on operation and system-level integration, this industrial‑grade device supports a wide supply range and extended operating temperature for robust deployment in embedded systems and industrial controls.

Key Features

  • Core Logic — 2,112 logic elements (cells) to implement combinational and sequential logic for control, gating, and protocol bridging.
  • Embedded Memory — Approximately 75,776 bits of total on-chip RAM for buffering, small FIFOs, and state storage.
  • I/O and Interfaces — 206 I/Os provided by the 256‑LBGA package, supporting a wide range of interface needs for system integration.
  • On‑Chip Non‑Volatile Configuration — MachXO2 family supports on-chip user flash memory and TransFR reconfiguration for in-field logic updates (family-level capability).
  • Clocking and PLLs — Flexible on-chip clocking with multiple primary clocks and analog PLL support (family-level features detailed in the MachXO2 data sheet).
  • Power and Voltage — Single supply operation across a wide range: 2.375 V to 3.465 V. Family devices are built on a low-power process with standby power optimizations.
  • Package & Mounting — 256‑FTBGA (17×17 mm) surface-mount package, enabling compact board integration and high I/O density.
  • Industrial Temperature Range — Specified operating range from −40 °C to 100 °C for use in industrial environments.
  • Compliance — RoHS compliant.

Typical Applications

  • Industrial Control — Deterministic logic, signal conditioning, and interface glue for factory automation and equipment control at industrial temperatures.
  • Interface Bridging — Implement protocol conversion, bus bridging, and custom I/O conditioning using the device’s high I/O count and flexible I/O options.
  • Display and Memory Interface Support — Support for source‑synchronous and geared display I/Os and embedded memory buffering for display and memory timing management (family-level I/O features).
  • System Management and Boot Control — On-chip configuration and programmable flash features enable instant-on and in-field reconfiguration for system-level control and secure boot architectures (family-level capability).

Unique Advantages

  • High I/O Density in a Compact Package: 206 I/Os delivered from a 256‑ball ftBGA footprint enable dense signal routing without sacrificing board real estate.
  • Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-varying environments.
  • Flexible Power Options: Operates from 2.375 V to 3.465 V, allowing compatibility with common system power rails.
  • On-Chip Memory and Logic: 2,112 logic elements and ~75,776 bits of RAM provide integrated resources for control, buffering, and state management without external components.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
  • Surface-Mount ftBGA Packaging: 256‑FTBGA (17×17 mm) supplier device package supports automated assembly and high-density designs.

Why Choose LCMXO2-2000HC-6FTG256I?

The LCMXO2-2000HC-6FTG256I positions itself as an integrated, industrial-grade FPGA option for designers needing mid-density logic, substantial I/O capability, and on-chip RAM in a compact ftBGA package. Its combination of 2,112 logic elements, approximately 75,776 bits of embedded memory, and 206 I/Os addresses common requirements for control, interfacing, and system management without excessive external circuitry.

With a wide supply voltage range and an extended operating temperature window, this MachXO2 device is suited to embedded and industrial applications where robustness, low standby power, and in-field reconfiguration capability are important design considerations.

Request a quote or submit your requirements to receive pricing and availability for the LCMXO2-2000HC-6FTG256I. Our team can provide prompt assistance with order placement and lead‑time information.

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