LCMXO2-2000HC-6MG132I

The LCMXO2-2000HC-6MG132I is a MachXO2 family Field Programmable Gate Array (FPGA) supplied in a 132‑ball CSPBGA (132‑LFBGA) surface-mount package. It provides 2,112 logic elements, approximately 0.076 Mbits (75,776 bits) of on‑chip RAM and 104 I/Os, making it suitable for industrial embedded designs that require moderate logic density, flexible I/O and non-volatile configuration.

Designed for compact, low-power systems, this device supports an extended single-supply voltage range (2.375 V to 3.465 V) and an industrial operating temperature range (−40 °C to 100 °C), enabling reliable operation in demanding environments.

Key Features

• Core Density — 2,112 logic elements provide a balance of combinational and sequential resources for glue logic, control functions and moderate FPGA tasks.
• On‑chip Memory — Total of 75,776 bits of on‑chip RAM (approximately 0.076 Mbits) for distributed and block RAM storage needs.
• I/O Count & Flexibility — 104 user I/Os in a compact 132‑LFBGA package; family supports programmable sysIO buffers and a wide range of interface standards as defined by the MachXO2 family.
• Power and Supply — Single-supply operation across 2.375 V to 3.465 V; MachXO2 family devices include low-power design options for standby and reduced-power modes.
• Non‑volatile, Instant‑On — MachXO2 family features non-volatile configuration for instant-on operation and in-field reconfiguration capabilities.
• Clocking and PLLs — Family-level flexible clocking with multiple primary clocks and analog PLL options for system timing and high-speed I/O support.
• Embedded System Features — MachXO2 family provides on‑chip user flash memory, IEEE‑1149.1 boundary scan and standard programming interfaces (JTAG, SPI, I²C) for system integration and in-system programming.
• Package & Mounting — 132‑LFBGA (CSPBGA) surface-mount package, supplier device package 132‑CSPBGA (8×8), ideal for space-constrained board designs.
• Industrial Temperature Grade — Rated for −40 °C to 100 °C operation, suitable for industrial applications requiring wide temperature tolerance.
• Compliance — RoHS-compliant for environmental and manufacturing requirements.

Typical Applications

• Industrial Control and Automation — Implement control logic, sensor interfacing and I/O aggregation where industrial temperature range and robust mounting are required.
• Interface Bridging and Glue Logic — Replace discrete glue components with a compact FPGA for protocol translation, bus bridging and system orchestration.
• Memory and Display Interfaces — Use family-level source-synchronous I/O and DDR support for buffering and interfacing with external memory or display subsystems.
• Embedded System Integration — Leverage non‑volatile configuration and on‑chip flash to implement instant‑on devices, boot control and secure in-field updates.

Unique Advantages

• Compact, Surface‑Mount Package: 132‑LFBGA CSPBGA provides high I/O density in an 8×8 package footprint for space-constrained designs.
• Moderate Logic Density with On‑chip RAM: 2,112 logic elements and 75,776 bits of RAM enable meaningful logic and buffering without external SRAM for many embedded tasks.
• Flexible I/O and Interface Support: Family-level programmable I/O buffers and source-synchronous options allow adaptation to a wide range of standards and signaling levels.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Non‑volatile, Instant‑On Operation: Built-in non-volatile configuration ensures immediate startup and supports in-field updates and background programming.
• Single-Supply Operation: Extended voltage range (2.375 V to 3.465 V) simplifies power-rail design and supports multiple system architectures.

Why Choose LCMXO2-2000HC-6MG132I?

The LCMXO2-2000HC-6MG132I delivers a balanced combination of logic capacity, on‑chip memory and flexible I/O in a compact, industrial-grade package. It is well-suited for embedded and industrial applications that need instant-on non-volatile behavior, moderate logic resources and reliable operation across a wide temperature and voltage range.

As part of the MachXO2 family, this device supports migration within the family for varying density needs while providing on‑chip features such as configurable I/O, clocking resources and field reconfiguration capabilities that simplify system design and reduce BOM complexity.

Request a quote or submit a pricing inquiry to evaluate the LCMXO2-2000HC-6MG132I for your next design.